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http://dx.doi.org/10.4150/KPMI.2020.27.4.333

Fabrication, Microstructure and Adhesive Properties of BCuP-5 Filler Metal/Ag Plate Composite by using Plasma Spray Process  

Youn, Seong-June (Department of Materials Science and Engineering, Inha University)
Kim, Young-Kyun (Department of Materials Science and Engineering, Inha University)
Park, Jae-Sung (LT Metal LTD.)
Park, Joo-Hyun (LT Metal LTD.)
Lee, Kee-Ahn (Department of Materials Science and Engineering, Inha University)
Publication Information
Journal of Powder Materials / v.27, no.4, 2020 , pp. 333-338 More about this Journal
Abstract
In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu3P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/㎠. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.
Keywords
Cu-15Ag-5P (BCuP-5); Plasma spray; Switching Device; Multi-layer; Bond strength;
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