• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.343-348
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• 2007

Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• Current Optics and Photonics
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• 제3권6호
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• pp.566-570
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• 2019

To investigate dependence of the sensitivity of THz metamaterials on the position of target dielectric materials, we functionalized the metamaterial gap with an adhesive polymer. A shift in resonance frequency occurs when polystyrene microbeads are deposited in the gap of the metamaterial's metal resonator pattern, while little change is observed when they are deposited on other areas of the metasurface. A two-dimensional mapping of the sensitivity, with a grid size of 1 ㎛, is obtained from a finite-difference time-domain simulation: The frequency shift is displayed as a function of the position of a target dielectric cube. The resulting sensitivity distribution clearly reveals the crucial role of the gap in sensing with metamaterials, which is consistent with the electric field distribution near the gap.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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• pp.472-474
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• 1995

A Sputter ion Plating(SIP) system with a r.f. coil electrode and the Facing Target Sputter(FTS) source was designed for high-quality thin film formation. The rf discharge was combined with DC facing target sputtering in order to enhance ionization degree of a sputtered atoms. The energy of ions incident on the substrate depended on the health potential of DC biased substrate. The mean impact ion energy increased with negative bias voltage and rf power. The adhesive force of the TiN film formed was in the range of 30$\sim$50N, and markedly influenced by substrate bias voltage.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2006년도 전력전자학술대회 논문집
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• pp.532-533
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• 2006

In this research work attempts were made to study the bonding of thermoplastics with adhesives using solar energy. In order to study the curing behaviour necessary experiments were conducted under varying conditions of temperature, exposure time and power. The cured samples were then studied under the optical microscope before subjecting to tensile testing in order to study their mechanical properties. The fracture surfaces were further studied under the Scanning Electron Microscopy in order to study the microstructural changes that are taken place during curing. From the present study it is evident that curing under higher solar energy temperature, generally improves bond strength and quality of the adhesive joints when compared to other modes of curing process expect the microwave curing process.

• 한국자동차공학회논문집
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• 제12권1호
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• pp.130-137
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• 2004

The ultrasonic attenuation coefficients were measured by interfacial crack length in the adhesive components of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental measurement of compliance. The numerical analysis by the boundary element method(BEM) and Ripling's equation was investigated. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. A measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• 한국표면공학회지
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• 제47권6호
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• pp.282-286
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• 2014

Wear characteristic of the nitrided SKD61 which is a typical mold material using for the extrusion of Al6061 alloy was investigated. The surface of SKD61 was nitrided by salt bath and plasma processes. The thickness of surface nitride layer was about $8.9{\mu}m{\sim}21.3{\mu}m$. Reciprocating friction wear test conducted using pin on disk type indicated the plasma treatment followed salt bath has a lower friction coefficient and a smaller adhesive wear with Al6061 alloy. That was identified by the $Fe_4N$ which has a better wear resistance than FeN mainly formed by plasma nitriding.

• Advances in aircraft and spacecraft science
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• 제7권2호
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• pp.151-168
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• 2020

The present study deals with the repair of composite structures by bonding composite patches. The composite structure is a carbon/epoxy laminate with stacking sequence [45/-45/0/90]S. The damaged zone is simulated by a central crack and repaired by bonding symmetrical composite patches. The repair is carried out using composite patches laminated from the same elemental folds as those of the cracked specimen. Three-dimensional finite element method is used to determine the energy release rate along the front of repaired crack. The effects of the repair technique used single or double patch, the stacking sequence of the cracked composite patch and the adhesive properties were highlighted on the variations of the fracture energy in mode I and mixed mode I + II loading.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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• pp.475-479
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• 2012

Thermal energy storage (TES) systems using Microencapsulated phase change material (MPCM) have been recognized as one of the most advanced energy technologies in enhancing the energy efficiency and sustainability of buildings. We examined a way to incorporate MPCMs with building materials through application for wood-based flooring. Wood-based flooring is commonly used for floor finish materials of residential buildings in Korea. However, wood-based flooring has not performed the characteristic of heat storage. This study is aimed at manufacturing high thermal efficiency wood flooring by increasing its heat storage using MPCM. As a result, this study confirmed that MPCM is dispersed well in adhesive through the scanning electron microscopy analysis. From the differential scanning calorimetry analysis, it can be confirmed that this composite has the characteristic of a thermal energy storage material. Also, we analyzed how this composition was formed by physical combination through the Fourier transform infrared analysis. Also, we confirmed the bonding strength of the material by using the universal testing machine.

• Current Photovoltaic Research
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• 제10권1호
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• pp.1-5
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• 2022

Bifacial photovoltaic (PV) technology has received considerable attention in recent years due to the potential to achieve a higher annual energy yield compared to its monofacial PV systems. In this study, we fabricated the bifacial c-Si PV module with a shingled design using the conventional patterned bifacial solar cells. The shingled design PV module has recently attracted attention as a high-power module. Compared to the conventional module, it can have a much more active area due to the busbar-free structure. We employed the transparent backsheet for a light reception at the rear side of the PV module. Finally, we achieved a conversion power of 453.9 W for a 1300 mm × 2000 mm area. Moreover, we perform reliability tests to verify the durability of our Shingled Design Bifacial c-Si Photovoltaic module.