• Journal of Korean Society of Forest Science
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• v.60 no.1
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• pp.51-57
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• 1983

Properties and glue shear strength of each water soluble rues-phenol copolymer adhesive and phenolic resin adhesive were examined as a high temperature curing binder through the manufacture of plywood made of Kapur veneer. The former has different molar ratio and the latter was made from different catalyst method. The results are summarized as follows: 1) Specific gravities of air dried plywood manufactured from each adhesive ranged from 0.67 to 0.82 and their moisture contents met the K.S. standard 2) In dry and wet shear strength, adhesives with 60 percent of non volatile content showed higher values than those with 50 percent except phenolic resin. Urea-phenol copolymer resin with 20 percent of phenol content exhibited the highest, and that with 70 percent the lowest. Filling effect of wood flour on the bonding strength is great in urea-phenol copolymer resin with more than 50 percent of phenol content, especially significant in 50 percent of non volatile content including alkali catalyst phenolic resin. Alkali and acid catalyst methods were the highest among the adhesive manufacture methods. In wet strength, urea resin belongs to the lowest group. 3) In glue shear strength after boiling and drying test, no method for manufacturing phenolic formaldehyde resin adhesive was stronger than alkali and acid catalyst methods. Phenolic resin made from alkali catalyst method needs a wood flour filler to improve the bonding quality. Urea-phenol copolymer resin with 10 percent of phenol content showed the reasonable water resistance.

• Polymer(Korea)
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• v.24 no.4
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• pp.513-519
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• 2000

The effect of petroleum resin as a tackifier for polyalphaolefin (APAO) hot melt adhesive on thermal properties, crystallinity and adhesion strength was investigated. The presence of petroleum resin resulted in the melting temperature decrease in APAO/petroleum blend, especially, in APAO with low ethylene content/C$_{5}$ petroleum blend. It was also found that petroleum resin caused the decrease of crystallinity regardless of ethylene content in APAO. The maximum adhesion strength was found to be at 50/50 (APAO/petroleum) composition. $C_{5}$ resin was more effective to increase adhesion strength than $C_{9}$ for APAO with high ethylene content. In addition, it was found that the adhesion strength was improved with the decrease of crystallinity in APAO/petroleum resin hot melts.

• Polymer(Korea)
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• v.37 no.2
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• pp.184-195
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• 2013

Acrylic pressure sensitive adhesive (PSA) tapes were used for the automotive, the electrical and the electronic industries and the display module junction. In this study, the manufacture of high-strength structural tape used 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC), and UV irradiation for photo-polymerization, and the semi-structural properties of acrylic PSA tape with the AAC content and inorganic filler $SiO_2$ content were investigated. The initial adhesion strength was lowered by the rigidity of molecule chains due to the use of AAC, and the adhesion strength increased with increasing wetting time. The wetability, contact angle, and SEM images of PSA tapes with various contents of AAC were determined. Without filler, the peel strength and dynamic shear strength of PSA tape showed inverse correlation but the peel strength and dynamic shear strength increased with increasing filler content. From these correlations the PSA tapes could be optimized for the applications requiring high performance.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.67-71
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• 2016

In this study, low-viscosity polyurethane hot-melt were synthesized with polyether polyol / polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), 2-butanone oxime (MEKO) to improve the properties and peel strength. The properties of the synthesized low-viscosity polyurethane hot-melt was evaluated through FT-IR, viscosity meter and UTM. When the content of the reactive diluent increases and the NCO-blocked prepolymer decreases, the viscosity of low-viscosity polyurethane hot-melt adhesive was increased. When the ratio of OH-terminated oligomer, NCO-blocked prepolymer and content of reactive diluent is 1 : 0.5 : 0.5, low-viscosity polyurethane hot-melt showed 1.1 kgf/cm peel strength.

• Journal of the Korean Wood Science and Technology
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• v.51 no.5
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• pp.334-344
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• 2023

Dregs from the sugar palm (Arenga pinnata) starch industry are considered a waste product of the agricultural industry and have not yet been optimally utilized. Therefore, this study aimed to manufacture particleboards from dregs using different amounts of adhesive and particle size ratios. Sugar palm dregs, which had been separated into fibers and powder/fine particles, were used as raw material for making particleboards. The fiber had an average length of 6.84 ± 3.23 cm, while the fine particles were of a size that passed through size 10 mesh and remained in size 60 mesh. Three ratios of fiber to fine particles (100:0, 75:25, and 50:50 wt%) with three different amounts of sucrose-citric acid adhesive (10, 15, and 20 wt%) were used in this study. Increasing the amount of fine particles and the resin content can improve the physical properties and the internal bond strength of boards made from sugar palm dregs. The fine particles possibly filled the gap between the fibers in the particleboard, while the fibers exhibited a high bending strength. As a result, a high-performance particleboard can be attained by combining the composition ratio of fiber/fine particles and resin content. In this study, particleboards made from fiber/fine particles (75:25 wt%) and adhesive content of 15 wt% and 20 wt% had the mechanical properties that met the requirements of Japanese Industrial Standard (JIS) A 5908 type 18. Sugar palm dregs have the potential to be used as raw materials to create value-added particleboards.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Polymer(Korea)
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• v.36 no.2
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• pp.119-123
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• 2012

Adhesion strength of polyurethane adhesive for laminated metal plate was investigated. Also, the effect of laminating conditions on the adhesion strength was understood by measuring peel strength as a function of adhesion temperature and time. The amount of isocyanate appearing due to the unblocking of oxime in polyurethane adhesive affected the strength of adhesion with hydroxyl on the metal plate or aluminum foil and it was controlled by adhesion temperature and time. However, the excess of temperature and time in laminating process caused the lowering of adhesion strength because of the decrease of solvent content as well as thermal degradation of the adhesive.

• Applied Chemistry for Engineering
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• v.16 no.1
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• pp.81-85
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• 2005

Pressure sensitive adhesive (PSA) was prepared by semi-batch emulsion polymerization of acryl monomers in the presence of reactive and non-reactive carboxylated polyurethane resin (PUR). Effects of the PUR type, its content, and crosslinker feeding method on the adhesive properties of the PSA was investigated. In this experiment, the PSA prepared with the reactive PUR showed better adhesive property then the PSA with the non-reactive PUR. Especially, peel strength of the PSA, where acetoacetoxy ethyl methacrylate and 1,6-hexane diamine as crosslinkers were introduced, was dramatically enhanced in severe humidity condition due to the interfacial crosslinking.

• Elastomers and Composites
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• v.40 no.3
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• pp.196-203
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• 2005

In this work, the engine oil resistant evaluation and breakdown analysis of room temperature vulcanizing silicone adhesives were performed through the surface properties, thermal stabilities, adhesive strength, and morphology measurements. As a result, the permeation of engine oil into adhesive specimens was carried out from surface to center in the specimens. And the oil content in the adhesive specimens was increased and the Si-O-Si bond of the adhesives was decomposed with increasing the aging time. The TGA results indicated that the thermal degradation was mainly occurred at under and surfaces of the specimens. The tensile strength, elongation, and adhesive strength of the adhesives were significantly decreased after the engine oil resistant tests, which could be attributed to the initial lose of adhesive properties resulting from the engine oil absorption and thermal aging. And the failure mode of the adhesive specimens was changed from cohesive failure to interfacial failure.

• Journal of Adhesion and Interface
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• v.18 no.4
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• pp.159-165
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• 2017

In this study, we synthesized UV-curable urethane acrylates with different contents of BA, reactive diluent and characterized their physical properties such as thermal, mechanical properties, adhesive strength and flexibility resistance. From a result of DSC, Tg of polyol and acrylate resin were separated as the BA content increased more than 40%. Also, tensile strength, elongation and adhesive strength decreased with increasing the BA content. The UV-curable urethane acrylate with 40% BA has shown good flexibility resistance compared to other resin due to poor hardness and Tm of acrylate resin.