• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.415-416
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• 2002

Experiments have been conducted to investigate scuffing mechanism in oil lubricated piston-ring /cylinder sliding contacts. Samples were extracted from actual components to simulate the real contact geometry and other influencing conditions. A standard test machine. with some modifications, has been used for the investigation of the effects of surface temperature load and sliding velocity. preliminary tests were carried out to find the critical temperature of scuffing using gradient temperature under a constant load, reciprocating frequency and stroke. The experimental and analytical results show that a transition from lubricated contact to adhesion, accompanied by the phenomena such as material transfer between the two sliding surfaces, local contact welding and temperature rise, and sharp increase in friction coefficient, appears to contribute to the final failure of scuffing.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.410-415
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• 2004

Molecular dynamics simulations of nanoimprint lithography in which a stamp with patterns is pressed onto amorphous poly-(methylmethacrylate) (PMMA) surface are performed to study the deformation of polymer. Force fields including bond, angle, torsion, inversion, van der Waals and electrostatic potential are used to describe the intermolecular and intramolecular force of PMMA molecules and stamp. Periodic boundary condition is used in horizontal direction and $Nos\acute{e}$-Hoover thermostat is used to control the system temperature. As the simulation results, the adhesion forces between stamp and polymer are calculated and the mechanism of deformation are investigated. The effects of the adhesion force and friction force on the polymer deformation are also studied to analyze the pattern transfer in nanoimprint lithography. The mechanism of polymer deformation is investigated by means of inspecting the indentation process, molecular configurational properties, and molecular configurational energies.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.6 s.237
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• pp.852-859
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• 2005

Molecular dynamics simulations of nanoimprint lithography in which a stamp with patterns is pressed onto amorphous poly-(methylmethacrylate) (PMMA) surface are performed to study the deformation of polymer. Force fields including bond, angle, torsion, inversion, van der Waals and electrostatic potential are used to describe the intermolecular and intramolecular force of PMMA molecules and stamp. Periodic boundary condition is used in horizontal direction and Nose-Hoover thermostat is used to control the system temperature. As the simulation results, the adhesion forces between stamp and polymer are calculated and the mechanism of deformation are investigated. The effects of the adhesion and friction forces on the polymer deformation are also studied to analyze the pattern transfer in nanoimprint lithography. The mechanism of polymer deformation is investigated by means of inspecting the indentation process, molecular configurational properties, and molecular configurational energies.

• International Journal of Automotive Technology
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• v.7 no.2
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• pp.121-128
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• 2006

The interaction between adherent molecules and gas molecules was modeled in the molecular scale and simulated by the molecular dynamics method in order to understand evaporation and removal processes of adherent molecules on metallic surface using high temperature gas flow. Methanol molecules were chosen as adherent molecules to investigate effects of adhesion quantity and gas molecular collisions because the industrial oil has too complex structures of fatty acid. Effects of adherent quantity, gas temperature, surface temperature and adhesion strength for the evaporation rate of adherent molecules and the molecular removal mechanism were investigated and discussed in the present study. Evaporation and removal rates of adherent molecules from metallic surface calculated by the molecular dynamics method showed the similar dependence on the surface temperature shown in the experimental results.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2010.04a
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• pp.550-553
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• 2010

본 논문에서는 seta와 spatula로 구성된 게코(gecko) 접착 시스템의 해석을 위한 새로운 adhesive beam contact model을 제시한다. adhesive contact 해석에 있어서 기존의 JKR model은 nano pillar와 같은 형태의 접촉방식의 해석에는 매우 유용하지만, seta와 같이 보(beam)의 형상을 가지는 구조물의 접촉방식의 해석에는 부적합하다. 따라서 본 연구에서는 seta와 같은 보의 형상을 가지는 접촉 시스템의 해석을 위해 adhesive beam contact model을 제시하고, 유한요소 해석을 통하여 접촉면에서의 불균일한 응력분포 상태가 분리 메커니즘에 미치는 영향에 대한 해석 결과를 제시한다. 또한 spatula의 기하학적 형상과 보의 접촉각(contact angle)등이 seta adhesion system의 분리 메커니즘(detachment mechanism)에 미치는 영향에 대한 결과를 제시한다.

• Preventive Nutrition and Food Science
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• v.9 no.1
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• pp.29-33
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• 2004

Cranberries have long been used by lay people to relieve the symptoms of urinary tract infections. Recent research has determined that the component of cranberry called proanthocyanidin (PAC) is the primary mechanism for inhibiting P-fimbriated E.coli adhesion to uroepithelial cells in vitro. A series of experiments were performed to determine the effects of PAC on growth and adhesion of uropathogenic E. coli and Staphylococcus aureus to urinary catheter material. The results showed that PAC-inhibited binding of Gram positive S. aureus to collagen coated surfaces and significantly decreased the growth of these bacteria. P-fimbriated E.coli did not bind well to the biomaterial and their growth was unaffected by the cranberry extract with the exception of some loss in viability at 1000 $\mu\textrm{g}$/mL after 5 to 18 hours of exposure. This is the first report of the potential for cranberries to interfere with the adhesion and growth of S. aureus, a multi-drug resistant organisms responsible for morbidity and mortality especially in hospitalized patients.

• Journal of Surface Science and Engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.247-253
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• 2010

The characteristics of selective oxidation prior to hot-dip galvanizing with the annealing atmosphere dew point and chemical composition in dual-phase steels and their effect on the inhibition layer formation relevant to coating adhesion have been studied using a combination of electron microscopic and surface analytical techniques. The annealed and also galvanized samples of 3 kinds of Si/Mn ratios with varied amounts of Si addition were prepared by galvanizing simulator. The dew point was controlled at soaking temperature $800^{\circ}C$ in 15%$H_2$ -85%$N_2$ atmosphere. It was shown that good adhesion factors were mainly uniformity of oxide particle distribution of low number density and low Si/Mn ratio prior to hot-dip galvanizing. Their effect was the greatly reduced coating bare spots and the formation of uniform inhibition layer leading to good adhesion of Zn overlay. The mechanism of good adhesion is suggested by two processes: the formation of inhibition layer on the oxide free surface uncovered with no $SiO_2$-containing particles in particular, and the inhibition layer bridging of oxide particles. The growth of inhibition layer was enhanced markedly by the delayed reaction of Fe and Al with the increase of Si/Mn ratio.

• Journal of Surface Science and Engineering
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• v.32 no.4
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• pp.531-537
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• 1999

A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/$\m^2$ within 2 minutes. Correlation between oxide thickness, $\delta$ and the adhesion strength in terms of interfacial fracture toughness, $G_{c}$ was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.123-123
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• 2001