• Polymer(Korea)
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• v.36 no.2
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• pp.119-123
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• 2012

Adhesion strength of polyurethane adhesive for laminated metal plate was investigated. Also, the effect of laminating conditions on the adhesion strength was understood by measuring peel strength as a function of adhesion temperature and time. The amount of isocyanate appearing due to the unblocking of oxime in polyurethane adhesive affected the strength of adhesion with hydroxyl on the metal plate or aluminum foil and it was controlled by adhesion temperature and time. However, the excess of temperature and time in laminating process caused the lowering of adhesion strength because of the decrease of solvent content as well as thermal degradation of the adhesive.

• Restorative Dentistry and Endodontics
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• v.42 no.1
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• pp.39-47
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• 2017

Objectives: Although the coating of surface sealants to dental composite resin may potentially reduce bacterial adhesion, there seems to be little information regarding this issue. This preliminary in vitro study investigated the adhesion of Streptococcus mutans (S. mutans) on the dental composite resins coated with three commercial surface sealants. Materials and Methods: Composite resin (Filtek Z250) discs (8 mm in diameter, 1 mm in thickness) were fabricated in a mold covered with a Mylar strip (control). In group PoGo, the surfaces were polished with PoGo. In groups PS, OG, and FP, the surfaces polished with PoGo were coated with the corresponding surface sealants (PermaSeal, PS; OptiGuard, OG; Fortify Plus, FP). The surfaces of the materials and S. mutans cells were characterized by various methods. S. mutans adhesion to the surfaces was quantitatively evaluated using flow cytometry (n = 9). Results: Group OG achieved the lowest water contact angle among all groups tested (p < 0.001). The cell surface of S. mutans tested showed hydrophobic characteristics. Group PoGo exhibited the greatest bacterial adhesion among all groups tested (p < 0.001). The sealant-coated groups showed statistically similar (groups PS and FP, p > 0.05) or significantly lower (group OG, p < 0.001) bacterial adhesion when compared with the control group. Conclusions: The application of the surface sealants significantly reduced S. mutans adhesion to the composite resin polished with the PoGo.

• Journal of Adhesion and Interface
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• v.5 no.3
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• pp.23-28
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• 2004

• Journal of Adhesion and Interface
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• v.18 no.2
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• pp.59-67
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• 2017

Recently, integration of parts is accelerating according to the growth of the smart mobile industry. The integration of these parts causes problems of interference phenomena between the parts, and the importance of electromagnetic wave shielding technology to solve this problem is highlighted. Electromagnetic wave shielding technology is implemented so as to reflect or absorb electromagnetic waves, and generally conductive materials are utilized for electromagnetic wave shielding. Transparent shielding technology is required according to recent industrial changes. In this research, we propose transparent the shielding film using imprint technology with conductive composite binder. Utilizing UV polymerized acrylic binder to produce a conductive composite binder. Spherical, plate and stacked silver particles were used for conductivity. The changes of the curing characteristics, conductivity and adhesion were observed according to the structural characteristics of the silver particles. The use of spherical particles was the most efficient in the curing process, and an additional curing system was required to complement the UV-shadowing structure. In the conductivity evaluation, the stacked structure showed excellent characteristics. The adhesion of spherical system was the best. It is evaluated as a result of irregularities on the surface. Ultimately, the patterned film using this showed excellent transparency characteristics.

• Journal of Adhesion and Interface
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• v.19 no.2
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• pp.74-82
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• 2018

Many methods for cross-linking acrylic PSAs have been discussed previously. For high cross-linking density, epoxy functionalized monomer and methyl aziridines as cross-linking agents were used in this study. Additionally, photopolymerization using different UV doses was investigated to synthesize a binder because of its rapid productivity. FT-IR analysis, curing behaviours and adhesion performance were examined for the relationship between UV doses and temperature as curing conditions. According to the results, the gel fraction was over 50% even at $120^{\circ}C$ after UV curing at a dose of $800mJ/cm^2$. On the other hand, while gel fractions of all samples reached approximately 80% only at $180^{\circ}C$ in thermal curing for 1 hour, gel fractions of the samples after thermal curing for 3 hours increased rapidly above $120^{\circ}C$ regardless of UV doses and reached approximately 100% at $180^{\circ}C$. This means that the second cross-linking reaction, esterification, is mainly dependent on the curing temperature.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.24-29
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• 2002

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.12-18
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• 2006

Recently, as industries and technologies are increased, superior adhesives having more and more developed functions and properties have been demanded. In this article, to use the merits and viscoelastic properties of poly(ethylene/butylene) rubber resin and to supplement the demerits, semi-structure pressure sensitive adhesives (PSAs) are developed. Aslo, it can be said environmentally friendly PSAs because of not use the organic solvent and not emit volatile organic compounds (VOCs).

• Journal of Adhesion and Interface
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• v.12 no.2
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• pp.47-55
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• 2011

UV-curable coatings have been used in various industries due to their advantages such as high mechanical property, good solvent resistance, fast curing process and low volatile organic compounds. However, a lack of flexibility of UV-cured films is a weak point for the pre-coated system of roll-to-roll process. In this study, UV-curable polycarbonate-based methacrylates were synthesized with polycarbonate diol, isophorone diisocyanate and 2-hydroxyethylmethacrylate to improve flexibility of the UC-cured films. The effects of polyol molecular weight, content of photoinitiator and monomers on the UV-curing behavior, flexibility and properties were investigated. The UV-curing behavior was measured by a photo-DSC, the pendulum hardness, tensile strength, viscoelastic properties were also evaluated.