• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.256-259
• /
• 2003

To develop cleaning process various particles should be deposited on wafer surfaces to measure particle removal efficiencies. The purpose of the article in to evaluate, removal efficient)r of silica and alumina particles from wafer surfaces when they are deposited by dry and wet method. Dry deposition in air and wet spray deposition using solutions are used. van der Waals are considered to calculate the adhesion force of particles on surfaces. Higher adhesion force is measured on alumina particles on silicon when particles are deposited in air.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.29 no.6 s.237
• /
• pp.852-859
• /
• 2005

Molecular dynamics simulations of nanoimprint lithography in which a stamp with patterns is pressed onto amorphous poly-(methylmethacrylate) (PMMA) surface are performed to study the deformation of polymer. Force fields including bond, angle, torsion, inversion, van der Waals and electrostatic potential are used to describe the intermolecular and intramolecular force of PMMA molecules and stamp. Periodic boundary condition is used in horizontal direction and Nose-Hoover thermostat is used to control the system temperature. As the simulation results, the adhesion forces between stamp and polymer are calculated and the mechanism of deformation are investigated. The effects of the adhesion and friction forces on the polymer deformation are also studied to analyze the pattern transfer in nanoimprint lithography. The mechanism of polymer deformation is investigated by means of inspecting the indentation process, molecular configurational properties, and molecular configurational energies.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2006.05a
• /
• pp.1391-1395
• /
• 2006

In non-contact mode atomic force microscopy, the response of a resonating tip is used to measure the nanoscale topography and other properties of a sample surface. However, the tip-surface interactions can affect the tip response and destabilize the non-contact mode control. Especially it is difficult to obtain a good scanned image of high adhesion surfaces such as polymers using conventional hard NCHR tip and non-contact mode control. In this study, experimental investigation is made on the non-contact mode imaging and we report the microcantilever having low stiffness (OMCL) is useful to measure the properties of samples such as elasticity. In addition, we proved that it was adequate to use low stiffness microcantilever to obtain a good scanned image in AFM for the soft and high adhesion sample.

• Laser Solutions
• /
• v.5 no.2
• /
• pp.9-15
• /
• 2002

Basic principles and unique characteristics of laser-induced shock cleaning have been described compared to a conventional laser cleaning method and the removal of small tungsten particles from silicon wafer surfaces was attempted using both methods. It was found that the conventional laser cleaning was not feasible to remove the tungsten particles whereas a successful removal of the particles was carried out by the laser-induced shock waves. From the quantitative analysis using a surface scanner, the average removal efficiency of the particles was more than 98% where smaller particles were slightly more difficult to remove probably due to the increased adhesion force with a decrease of the particle size. It was also seen that the gap distance between the laser focus and the wafer surface is an important processing parameter since the removal efficiency is strongly dependent on the gap distance.

• Journal of Adhesion and Interface
• /
• v.1 no.1
• /
• pp.47-55
• /
• 2000

In this article, the characterization of the interface of hybrid composites was discussed. Interfacial interaction in organic/inorganic hybrid composites, especially silica-containing hybrids can be characterized by fluorescence spectroscopy, small angle X-ray scattering (SAXS), scanning electron microscopy (SEM), atomic force microscopy (AFM), and $^{29}Si$ NMR spectroscopy measurements.

• Korean Journal of Cleft Lip And Palate
• /
• v.7 no.1
• /
• pp.1-16
• /
• 2004

In the recent time, early correction of the congenital anomalies has become the focus of contemporary cleft lip care, The reason of that is mostly psychologic factor of children are respected, Although the propound object of lip adhesion is not esthetic improvement, that able to satisfy sufficiently parents of cleft children, In the unilateral or bilateral clefts, a preliminary lip adhesion has been advocated as a mean of narrowing the cleft at an early phase, of improving the nasal contour, of molding the alveolar arch, and of easing and improving the result of a definitive lip repair. The present study was earned out to investigate the effect of lip adhesion. We performed the Millard's high-half underminded adhesion and Seibert's lip adhesion followed by modified Millard's cheiloplasty for five infants had unilateral complete cleft lip. The lip adhesion reduced the actual deformity by molding the maxillary alveolar segments into better relationship and allows a easy cheiloplasty so that led to more perfect final lip result, Both Millard's high-half underminded adhesion and Seibert's lip adhesion were available methods to adhere a wide cleft lip, Especially, Seibert's lip adhesion had more advantages such as enhancement of the force of adhesion, correction of the deviated columella and acquirement of the esthetic upper lip continuity. These results suggest that the lip adhesion followed by cheiloplasty for wide unilateral complete cleft lip patients provide more favorable final result by molding the maxillary alveolar segments into better relationship.

• Journal of Adhesion and Interface
• /
• v.9 no.2
• /
• pp.32-37
• /
• 2008

A series of UV-curable powder coatings with different contents of photoinitiator (0.5 wt%, 1 wt%, 2 wt%) were formulated and measured gel content, tensile strength of cured film. Heat-sensitive substrates such as MDF, plywood and PVC were coated UV-curable powder and cured coatings were measured physical properties by pendulum hardness tester, glossmeter, pull-off adhesion tester. With increasing photoinitiator content, adhesion force between coating and substrate decreased because of crosslinking density increasing. The results of pendulum hardness was not significantly changed but gloss was changed according to different substrates. Adhesion of UV-curable coatings was enough to apply for heat-sensitive substrates. From these results, we concluded that contents of photoinitiator was a effective factor in UV-curable powder coatings. UV-curable coatings was a portential candidate for heat-sensitive substrates.

• Korean Journal of Materials Research
• /
• v.9 no.12
• /
• pp.1176-1180
• /
• 1999

The adhesion strength and high temperature/high humidity reliability of polyetherimide (PEI) adhesive on silicon wafer after being treated by each reactive ion etching (RIE) Aluminum (Al)-chelate adhesion promoter were investigated. 180$^{\circ}$ peel test and <85$^{\circ}C$ 85%> humidity test were performed for the initial adhesion strength and high temperature/high humidity reliability, respectively. For investigating surface effect scanning electron microscope (SEM), atomic force microscope (AFM), deionized (DI)-water contact angle studies were carried out. To investigate RIE effect, PEI was treated with $^O_2$ RIE, and then laminated. The initial peel strength increased slightly from 1.6 kg/cm for the first 2 minutes, and then decreased. High temp/high humid resistance decreased rapidly by RIE etching. RIE treatment on PEI affected on both of roughness and hydrophilicity increase. Aluminum-chelate adhesion promoter was coated by spinning on silicon wafer. The initial peel strength showed no effect of adhesion promoter treatment, but high temp/high humidity resistance increased remarkably. Al-chelate adhesion promoter did not affect the roughness but increased hydrophilicity.

• The Journal of the Korea Contents Association
• /
• v.19 no.5
• /
• pp.624-631
• /
• 2019

The purpose of this study was to observe the influence of adhesive force of lifter on powdered fingermark. First, an experiment was conducted to measure the adhesive force of five kinds of lifters. Second, each fingermark deposited on slide glass was developed using four kinds of powders. Then, these were transferred to lifter, and the quality of the transferred fingermark was observed. As a result of measuring the adhesive force of the lifter using the ASTM D3121-17 rolling ball tack method, the difference in adhesion between the lifters except the gelatin lifter was small. Also, it was confirmed that the quality of the transferred fingermark was not significantly related to the adhesive force of the lifter. However, if the quality of the transferred fingermark is not good when transferring to a gelatin lifter which is a lifter having a weak adhesive force, additional transfer is possible.

• Journal of the Korean institute of surface engineering
• /
• v.37 no.1
• /
• pp.5-12
• /
• 2004

The enhancement of adhesion for Cu film on polycarbonate (PC) surface with the $Ar/O_2$ gas plasma treatment and dc-bias sputtering was studied. The plasma treatment with this reactive mixture changes the chemical property of PC surface into hydrophllic one, which is shown by the variation of contact angle with surface modification. The micro surface roughness that also gives the high adhesive environment is increased by the $Ar/O_2$ gas plasma treatment. These results were observed distinctly from the atomic force microscopy (AFM). The negative substrate dc-bias effect for the Cu adhesion on PC was also investifated. Accelerated $Ar^{+}$ lons in sheath area of anode bombard the bare surface of PC during initial stage of dc bias sputtering. PC substrate. therefore, has severe roughen and hydrophilic surface due to the physical etching process with more activated functional group. As dc-bias sputtering process proceeds, morphology of Cu film shows better step coverage and dense layer. The results of peel test show the evidence of superiority of bias sputtering for the adhesion between metal Cu and PC.C.