• 제어로봇시스템학회논문지
• /
• 제15권12호
• /
• pp.1197-1202
• /
• 2009

We present a power-efficient driving scheme that consists of piezoelectric actuator and driver IC for AF (Auto-Focus) on ISM (Image Sensor Module). The piezoelectric actuator is more power-efficient than conventional voice coil motor actuator. And high power-efficiency driver IC is designed. So the proposed driving scheme using designed piezoelectric actuator and driver IC is more close to recent trend of green IT. The diver IC should guarantee fast and accurate performance. So, the optimum driving method and high accurate frequency synthesizer are proposed. The die area of designed driver IC is $2.0{\times}1.6mm^2$ and power consumption is 2.8mW.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2005년도 ICCAS
• /
• pp.1334-1338
• /
• 2005

A limit switch box is used for an indicator of a valve actuator. This device indicates an opening and closing of a valve or a throttle in the valve actuator. In a ship, equipments require safety and robustness because of a rough environment and a specific condition during a voyage. However, the limit switch box has been used in an indoor environment generally. This study developed a new limit switch box which can be used at an outdoor environment. This study designed the new limit switch box. The housing of the limit switch box was made by an aluminum die cast method with surface painting after anodizing or chromate coating. In order to evaluate the endurance of the housing, the endurance tests against salt water have been conducted. Experiment results showed that the proposed device provides a reliable performance against salt water.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
• /
• pp.946-949
• /
• 2003

This paper reports on the fluid flow simulation results of a multilayer type piezoelectric valve. The mechanical and fluidic analysis are done by finite element method. The designed structure is normally closed type using buckling effect, which is consist of three separate structures; a valve seat die, an actuator die and a MLCA(Multilayer Type Ceramic Actuator). It is confirmed that the complete laminar flow and the lowest flow leakage are strongly depend on the valve seat geometry. In addition, turbulent flow was occurs in valve outlet according to increase seat dimension, height and inlet pressure. From this, we was deducts the optimum geometry of the valve seat and diaphragm deflection that have an great influence fluid flow in valve. Thus, it is expected that our simulation results would be apply for piezoelectric applications such as valve and pump, fluidic control systems.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
• /
• pp.383-386
• /
• 2002

This paper reports on the fluid flow simulation results of an active microvalve. The mechanical and fluidic analysis are done by finite element method. The designed structure is normally closed microvalve using buckling effect, which is consist of three separate structures; a valve seat die, an actuator die and a small piezoelectric actuator. It is confirmed that the complete laminar flow and the lowest flow leakage are strongly depend on the valve seat geometry. In addition, turbulent flow was occurs in valve outlet according to increase seat dimension, height and inlet pressure. From this, we was deducts the optimum geometry of the valve seat and diaphragm deflection that have an great influence fluid flow in microvalve. Thus, it is expected that our simulation results would be apply for constructing integrated chemical analyzing system or drug delivery system.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.899-903
• /
• 2004

A limit switch box is used for a indicator of a valve actuator. This device indicates an opening and closing of a valve or throttle in a valve actuator. In ship, equipments are required safe and robust because of a rough environment and a specific condition during a voyage. However, the limit switch box is used in an indoor environment generally. Thus, a new limit switch box must be developed which can be used at an outdoor environment. This study designed the limit switch box. The housing of the limit switch box was made by an aluminium die cast method with surface painting after anodizing or chromate coating. In order to evaluate the endurance of the housing, the endurance tests against salt water have been conducted. Experiment results showed that the proposed device provides a reliable performance against salt water.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
• /
• pp.844-846
• /
• 1998

In this study, Brass endcap with 2, 3, 5, and 7mm contact surface and 0.6, 0.9, 1.2, 1.5mm conical cavity depths was fabricated by the punch die while keeping the cavity diameter constant 9.25mm then displacement characteristics of the cymbal actuators with each of brass endcap thickness were measured under an applied voltage $60V_{max}$. Dispacement increased with increasing contact surface and resonant frequency decreased with increasing contact surface, cymbal actuator with 7mm contact surface and 1.5mm endcap cavity depth exhibits $35.89{\mu}m$ displacement and 18.8kHz resonant frequency, displacement increased with increasing endcap cavity depth while contact surface was kept constant at 3mm and Below a endcap thickness of 0.2mm, Differences in displacement between 1.2mm and 1.5mm cavity depth appeared at $0.18{\mu}m$. that is, displacement of cymbal actuator with 1.2mm over cavity depth saturated nearly.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1996년도 하계학술대회 논문집 C
• /
• pp.2004-2006
• /
• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• Design & Manufacturing
• /
• 제11권3호
• /
• pp.29-34
• /
• 2017

Increased demand for parts with micro-pattern structure made of metals, ceramics, and composites in various fields such as medical ultrasonic sensors, CT collimators, and ultra-small actuator parts. Micro powder injection molding (PIM) is a technology for manufacturing micro size, high volume, complex, precision, net-shape components from either metal or ceramic powder. In the present study, a standard mold with a variable insert core capable of producing various micro patterns was investigated. An injection molding test was performed on a standard mold using a line type micro-pattern core having an aspect ratio of 2, a slenderness ratio of 70, a pattern size of $200{\mu}m$, and a pattern spacing of $150{\mu}m$. During the filling process, the deformation of the mold with large aspect ratio and slenderness ratio was analyzed by the experiment and the numerical simulation according to the position of the gate. We proposed a mold structure that minimizes mold deformation by gate modification and enables uniform pattern filling behavior.

• Design & Manufacturing
• /
• 제13권4호
• /
• pp.10-16
• /
• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1997년도 추계학술대회 논문집
• /
• pp.54-58
• /
• 1997

In this study, study, about Automatic Loader and Unloader system which can directly be used for material handing and tool operating is moving linear transfer system for mainly forming of small electronic unit and other at press line. This system for been installed in a press in order to load and unload a workpiece from a press die. Control method be used Programmable logic control(PLC) unit. other Control equipment of system is Motor drive, Positioning Control and so on. It took data of input from each sensor and send signal of output to actuator by sequence program. We try to Characteristics test of this system has good condition when operating by laser measurement