• Journal of the Korean Ceramic Society
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• v.35 no.4
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• pp.330-330
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• 1998

Active belite cement clinkers were synthsized by using natural raw materials with borax and calcium phosphate ({{{{ {Ca }_{3 }( {PO}_{4}) }}2) In both case {{{{alpha ^、 {C }_{2 }S }} were formed but borax was more efficient. The cement syn-thesized with the addition of borax was hydrated with the addition of anhydrite(5 wt%) and slag(30wt%, 40wt% 50wt%) The addition of 50wt% slag with anhydrite was good for strength development in 7days and the compressive strength was developed to twice than no addition of slag at 28 days strength.

• Food Science of Animal Resources
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• v.25 no.1
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• pp.60-65
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• 2005

Antioxidant films are one active packaging technology that can extend food shelf-life through preventing lipid oxidation, stabilizing color, maintaining sensory properties and delaying microbial growth in foods. Because raw, fresh and minimal processed foods are more perishable during storage or under display conditions than further processed foods, they rapidly lose their original quality. Foods are susceptible to physical, chemical, and biochemical hazards to which packaging films can be effective barriers. Although films incorporated natural (tocopherols, flavonoids and phenolic acids) or synthetic antioxidants (BHT, BHA, TBHQ, propyl gallate) have been extensively tested to improve quality and safety of various foods, food applications require addressing issues such as physical properties, chemical action, cost, and legal approval. Increased interest in natural antioxidants as substitutes for synthetic antioxidants has triggered research on use of the new natural antioxidants in films and coatings. Use of new components (phytochemicals) as film additives can improve food quality and human health. The biosynthesis of plant phenolics can potentially be optimized by active coatings on harvested fruits and vegetables. These coatings can trigger the plants natural proline-linked pentose phosphate pathway to increase the phenolic contents and maintain overall plant tissue quality. This alternate metabolic pathway has been proposed by Dr. K. Shetty and is supported by numerous studies. A new generation of active food films will not only preserve the food, but increase food's nutritional quality by optimizing raw food biochemical production of phytochemicals.

• Journal of Bio-Environment Control
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• v.24 no.2
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• pp.79-84
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• 2015

This study was carried out in order to develop an economical and convenient way to improve storability of sweet persimmon 'Fuyu'. Natural porous materials (bamboo active carbon, chaff charcoal, and Ge-lite) pouching bags were enveloped in the conventional LDPE (low density polyethylene) package during room temperature and low temperature storage. The changes of soluble solids content, flesh firmness, flavor, decay, and softening of sweet persimmon were investigated in the 1- or 2-week intervals. The LDPE packaging with bamboo active carbon treatment was confirmed to maintain longer storability and higher quality than the LDPE packaging only. This method is expected to be applied to both of conventional and organic farming as an economical and convenient way to improve storability on long term storage and during distribution.

• Journal of Bio-Environment Control
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• v.20 no.3
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• pp.227-232
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• 2011

The processing techniques are need to use the non-marketable paprika fruit because paprika that is difficult crop for cultivation and produced easily non-marketable fruits, such as physiological disorder fruit, malformed fruit, and small size fruit. This study was carried out to investigate the proper active modified atmosphere packaging (MAP) condition for enhancing the storability of fresh-cut paprika fruit. The fresh-cut paprika (cv 'Score', seminis) put into $7cm{\times}0.7cm$ size and packed them in 20 g bags. The active MAP and vacuum treated paprika fruits were packaged with LLDPE/Nylon, EVOH, Tie film, and injected partial pressures of $CO_2$ and $O_2$, and $N_2$ in the packages immediately after sealing to treat active MAP. The ratio of $CO_2$, $O_2$, and $N_2$ of active MAP conditions were 0 : 20 : 80 (air), 5 : 5 : 90, 30 : 10 : 60, 10 : 70 : 20 and vacuum treatment did not contain any gas. The passive packaging treated paprika packaged with $40{\mu}m$ ceramic film. After 7 days of storage at $9^{\circ}C$, the fresh weight decreased less than 2% in all treatments, and showed lower in 5 : 5 : 90 ($CO_2:O_2:N_2$) active-MAP treatment and higher in vacuum treatment than other treatments. The $CO_2$ and $O_2$ concentration in packages did not change remarkably in active-MA treatments except 30 : 10 : 60 active-MAP treatment that showed sharply decreased $O_2$, concentration and increased $CO_2$ concentration at $1^{st}$ day of storage at $9^{\circ}C$. The ethylene concentration in package was the highest in 30 : 10 : 60 active-MAP treatment and the lowest in the passive MAP treatment that packaged with gas permeable film during $9^{\circ}C$ storage for 7 days. The 30 : 10 : 60 active-MAP treatments were not proper condition to storage fresh-cut paprika. The visual quality was maintained higher in 0 : 20 : 80 (air), 5 : 5 : 90, and 10 : 70 : 20 active MAP treatments and passive MAP treatment than others and the firmness, off-odor, and electrolyte leakage was investigated at 7th day of storage at $9^{\circ}C$. The 5 : 5 : 90 and 10 : 70 : 20 active-MAP treatment showed higher firmness and lower off-odor than other treatments after $7^{th}$ day of storage at $9^{\circ}C$. In addition, the electrolyte leakage was reduced less than 20% at 0 : 20 : 80 (air), 5 : 5 : 90, 10 : 70 : 20, and passive MA treatments. Therefore, 10 : 70 : 20 ($CO_2:O_2:N_2$) and 0 : 20 : 80 (air) might be recommended for proper active MAP conditions.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.6 no.1
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• pp.31-36
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• 2000

180g of fermented soy paste and 150g of red pepper paste were packaged in glass jars of 232 mL with different conditions of active packaging and then stored at $13^{\circ}C$ for about 170 and 128 days, respectively. During the storage, package atmosphere, surface color, pH, acidity and microbial flora were monitored to see the effect of packaging conditions. Test packaging conditions include package equipped with $Ca(OH)_2\;as\;CO_2$ absorber, package with pinhole and closed control one. Closed control packages of soypaste and red pepper paste showed the increased $CO_2$ partial pressure, the decreased $O_2$ partial pressure and the constant $N_2$ partial pressure to produce high pressure buildup with storage. The paste packages with $Ca(OH)_2$ maintained relatively low $CO_2$ partial pressure and thus the package pressure close to normal atmospheric pressure for initial storage period of 70 days. The packages with air pinhole channel had the partial pressures of $O_2\;and\;N_2$ decreased with storage time, while $CO_2$ partial pressure first increased to a maximum and then slowly decreased thereafter Without any pressure increase the packages with pinhole gave the lowest quality changes possibly due to the effect of package atmosphere, but it had problem of mold contamination and growth for soy paste after 120 days. There were no difference in microbial flora between the packages after about 70 day storage.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.50 no.3
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• pp.120-129
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• 2001

A two-degree-of-freedom quarter-car model is used as the basis for LQ and the proposed controller design for a semi-active suspension. The LQ controller results in the best rms performance trade-offs(as defined by performance index) between ride, handling and packaging requirements. In LQ controller, however, the conflict between road holding and ride comfort remains. The adaptive semi-active suspension control based on the road frequency are introduced in this paper. With this method, the trade-off between road holding and ride comfort can be relaxed. The road frequency is estimated by wavelet transform if rattle space signal. The simulation results show that the proposed controller is superior to the conventional LQ controller.

• Korean Journal of Food Science and Technology
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• v.35 no.6
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• pp.1110-1116
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• 2003

The effects of packaging methods on the storage quality of minimally processed (prepeeled) onions were investigated to determine the optimal packing design. Various packaging treatments used for modifying headspace atmospheres included two passive MAP using LDPE and PP films, two active MAP using a gas mixture of 20% $O_2/10%\;CO_2/balance\;N_2$ and an ethylene scavenging sachet, and moderate vacuum packaging (MVP). The quality attributes of onion samples were evaluated periodically in terms of flesh weight loss, color of cut surface, decay ratio, microbial counts, and sensory properties during storage at $10^{\circ}C$ for 28 days. Packaging methods did not significantly influence surface color, weight loss, and microbiological populations of mesophiles, psychrotrophs, and lactic acid bacteria. They did, however, affect sensory characteristics as well as decay occurrence. Results indicated that seal-packaging with a gas-permeable plastic film under a mild vacuum condition could retain better onion quality in terms of microbial decay and visual sensory aspects as compared with the other packages.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.1-6
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• 2016

The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.