• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.9
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• pp.803-809
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• 2005

Cerium ammonium nitrate (CAN) and nitric acid was used an etchant and an additive for Ru etching and polishing. pH and Eh values of the CAN and nitric acid added chemical solution satisfied the Ru etching condition. The etch rate increased linearly as the concentration of CAN increased. Nitric acid added solution had the high etch rate. But micro roughness of etched surfaces was not changed before and after etching, The removal rate of Ru film was the highest in $1wt\%$ abrasive added slurry, and not increased despite the concentration of alumina abrasive increased to $5wt\%$. Even Ru film was polished by only CAN solution due to the friction. The highest removal rate of 120nm/min was obtained in 1 M nitric acid and $1wt\%$ alumina abrasive particles added slurry. The lowest micro roughness value was observed in this slurry after polishing. From the XPS analysis of etched Ru surface, oxide layer was founded on the etched Ru surface. Therefore, Ru was polished by chemical etching of CAN solution and oxide layer abrasion by abrasive particles. From the result of removal rate without abrasive particle, the etching of CAN solution is more dominant to the Ru CMP.

• Restorative Dentistry and Endodontics
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• v.40 no.1
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• pp.68-74
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• 2015

Objectives: This study examined the effects of additional acid etching on the dentin bond strength of one-step self-etch adhesives with different compositions and pH. The effect of ethanol wetting on etched dentin bond strength of self-etch adhesives was also evaluated. Materials and Methods: Forty-two human permanent molars were classified into 21 groups according to the adhesive types (Clearfil SE Bond [SE, control]; G-aenial Bond [GB]; Xeno V [XV]; Beauti Bond [BB]; Adper Easy Bond [AE]; Single Bond Universal [SU]; All Bond Universal [AU]), and the dentin conditioning methods. Composite resins were placed on the dentin surfaces, and the teeth were sectioned. The microtensile bond strength was measured, and the failure mode of the fractured specimens was examined. The data were analyzed statistically using two-way ANOVA and Duncan's post hoc test. Results: In GB, XV and SE ($pH{\leq}2$), the bond strength was decreased significantly when the dentin was etched (p < 0.05). In BB, AE and SU (pH 2.4 - 2.7), additional etching did not affect the bond strength (p > 0.05). In AU (pH = 3.2), additional etching increased the bond strength significantly (p < 0.05). When adhesives were applied to the acid etched dentin with ethanol-wet bonding, the bond strength was significantly higher than that of the no ethanol-wet bonding groups, and the incidence of cohesive failure was increased. Conclusions: The effect of additional acid etching on the dentin bond strength was influenced by the pH of one-step self-etch adhesives. Ethanol wetting on etched dentin could create a stronger bonding performance of one-step self-etch adhesives for acid etched dentin.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.419-419
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• 2016

High efficiency silicon solar cell requires the textured front surface to reduce reflectance and to improve the light trapping. In case of mono-crystalline silicon solar cell, wet etching with alkaline solution is widespread. However, the alkali texturing methods are ineffective in case of multi-crystalline silicon wafer due to grain boundary of random crystallographic orientation. The acid texturing method is generally used in multi-crystalline silicon wafer to reduce the surface reflectance. However the acid textured solar cell gives low short-circuit current due to high reflectivity while it improves the open-circuit voltage. To reduce the reflectivity of multi-crystalline silicon wafer, double texturing method with combination of acid and reactive ion etching is an attractive technical solution. In this paper, we have studied to optimize RIE experimental condition with change of RF power (100W, 150W, 200W, 250W, 300W). During experiment, the gas ratio of SF6 and O2 was fixed as 30:10.

• The korean journal of orthodontics
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• v.42 no.1
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• pp.32-38
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• 2012

Objective: The aim of this study was to compare the effects of different enamel conditioning techniques for bracket bonding. Methods: Ninety-one human premolars were randomly divided in six groups of 15 specimens each. The enamel surfaces of the teeth were etched with 35% orthophosphoric acid in Group 1, with a self-etching primer in Group 2, sandblasted in Group 3, sandblasted and etched with 35% orthophosphoric acid in Group 4, conditioned by Er:YAG laser in Group 5 and conditioned by Er:YAG laser and etched with 35% phosphoric acid gel respectively in Group 6. After enamel conditioning procedures, brackets were bonded and shear bonding test was performed. After debonding, adhesive remnant index scores were calculated for all groups. One tooth from each group were inspected by scanning electron microscope for evaluating the enamel surface characteristics. Results: The laser and acid etched group showed the highest mean shear bond strength (SBS) value ($13.61{\pm}1.14$ MPa) while sandblasted group yielded the lowest value ($3.12{\pm}0.61$ MPa). Conclusions: Although the SBS values were higher, the teeth in laser conditioned groups were highly damaged. Therefore, acid etching and self-etching techniques were found to be safer for orthodontic bracket bonding. Sandblasting method was found to generate inadequate bonding strength.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.4
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• pp.13-20
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• 2014

In this paper, the effects of a nonionic surfactant on the etch uniformity and the etch profile during the wet-etching process of high-purity aluminum were investigated for the fabrication of uniform micropattern arrays. To improve the surface roughness of a high-purity aluminum plate, a mechanical lapping process and an electrolytic polishing process were used. After electrolytic polishing process, the surface roughness, Ra, of the high-purity aluminum plate was improved from $1.25{\mu}m$ to $0.02{\mu}m$. A photoresist was used as an etching mask during the aluminum etching process, where the mixture of phosphoric acid, acetic acid, nitric acid, a nonionic surfactant and water was used as the aluminum etchant. Different amounts of the Triton X-100 nonionic surfactant were added to the aluminum etchant to investigate the effect of a nonionic surfactant during the wet-etching process of high-purity aluminum. The etch rate and the etch profile were measured by an optical interferometer and a scanning electron microscope.

• Journal of the korean academy of Pediatric Dentistry
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• v.46 no.2
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• pp.165-172
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• 2019

The purpose of this study was to evaluate the effect of application time and phosphoric acid etching of 8th generation adhesives containing functional monomer on adhesive performance in primary teeth. 80 extracted non-carious human primary teeth were selected and divided into 8 groups based on 3 factors: (1) adhesive: G-Premio bond and Single bond universal; (2) application time: shortened time and manufacture's instruction; (3) acid etching mode: self-etching and total-etching. Shear bond strength was measured using a universal testing machine, and fractured surface were observed under scanning electron microscope. Microleakage was evaluated by dye penetration depth. G-Premio bond were not significant different in shear bond strength and microleakage depending on application time of adhesive and acid etching mode. In Single bond universal, shear bond strength of short application time was significantly lower than that of long adhesive application time (p = 0.014). Clinically applicable shear bond strength values (> 17 MPa) were identified in all groups. These results suggested that G-Premio bond be used clinically for a short application time without phosphoric acid etching.

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.73-79
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• 2008

In order to apply for transparent conductive oxide(TCO), we deposited ZnO thin films on the glass at room temperature by RF magnetron sputtering method. Deposition conditions for high transmittance and low resistivity were optimized in our previous studies. Under the deposition condition with the RF power of 200 W, target to substrate distance of 30 mm and working pressure of 5 mTorr, highly conductive($7.4{\times}10^{-3}{\Omega}cm$) and transparent(over 85%) ZnO films were prepared. Highly oriented ZnO film in the [002] direction were obtained with specifically designed ZnO targets. Systematic study on dependence of deposition parameters on electrical and optical properties of the as-grown ZnO films were mainly investigated in this work. And for application tests using these films as transparent conductive oxide anodes, wet chemical etching behaviors of ZnO films were also investigated using various chemicals. Wet-chemical etching behavior of ZnO films were investigated using various acid solutions. The concentrations of these different acid solutions were controlled to study the etching shapes and etching rate. ZnO films were anisotropically etched at various concentrations and wet etching led to crater-like surface structure. Also we firstly found that the etching rate and etching shapes of ZnO films strongly depended on the etchant concentrations (i.e. pH) and the etching rate is exponentially decreased with increasing pH values regardless of the acid etchants.

• ETRI Journal
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• v.45 no.1
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• pp.171-179
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• 2023

We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13㎛-0.16㎛ to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.

• Restorative Dentistry and Endodontics
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• v.21 no.2
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• pp.602-618
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• 1996

The purpose of this study was to investigate the effect of acid treatment of fluoride applied dentin surface with various concentrations of phosphoric acid for various periods of time on dentin bonding. Dentin specimens prepared from freshly extracted bovine mandibular anterior teeth were divided into fluoridated and nonfluoridated groups. Specimens of nonfluoridated group were pretreated with 10% phosphoric acid for 15 seconds. Those of fluoridated groups were treated with 2% sodium fluoride or 2% stannous fluoride solution for 5 minutes and stored in $37^{\circ}C$ distilled water for 3 days, followed by phosphoric acid treatment. The concentrations of phosphoric acid were 10%, 32% or 50% and the treatment periods of time were 15, 30 or 60 seconds. All the specimens were bonded with All Bond$^{(R)}$ 2 and Bisfil$^{TM}$ composite resin. After bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, tensile bond strengths of each specimens were measured and the pretreated dentin and the fractured dentin surfaces were examined under the scanning electron microscope. The results were as follows : The tensile bond strengths from the fluoridated groups were significantly lower than those from the nonfluoridated group when the concentrations of phosphoric acid and the treatment periods of time were equal in all the groups (p<0.05). In general, the higher the concentration of phosphoric acid and the longer the treatment period of time for acid etching on the fluoride applied dentin surface, the higher were the bond strength values. Recovery of bond strength of the dentin bonding agent was better in the NaF applied group than in the $SnF_2$ applied one. SEM findings of NaF applied and $SnF_2$ applied dentin surfaces demonstrated reaction product-covered and partially or completely obstructed dentinal tubules. SEM findings of dentin surfaces fluoridated for 5 minutes followed by etching showed wider tubular openings and more clean dentin surfaces when dentin was etched with higher concentration of phosphoric acid for longer period of time. On the SEM observations of the fractured dentin-resin interface, the etched specimens of fluoridated group showed an adhesive failure mode when the concentration of phosphoric acid and the treatment period of time were same as in the nonfluoridated group. As the concentration of phosphoric acid and the treatment period of time increase during acid etching, the cohesive failure area increased. However, excessive acid etching caused adhesive failure.

• Journal of the korean academy of Pediatric Dentistry
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• v.25 no.4
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• pp.761-771
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• 1998

In this study, attempt has been made to evaluate the effect of $CO_2$ laser irradiation on enamel surface structure and the bond strength of sealant material. Conventional acid etching was used as a control technic for comparison. The results obtained from this experiment were as follows; 1. The highest mean shear bond strength value was observed in samples of Group I (acid-etching) with the statistical significance(p<.05) between all the other groups. 2. The shear bond strength in Group IV was the lowest among laser etching groups. but there were no significant difference between them(p>.05). 3. Scanning electron microscopic observation showed that the rough and irregular surface was created by $CO_2$ laser treatment with the formation of numerous pores, micro-cracks, and small bubble-like inclusion. Increasing the energy density induced localized surface melt with a thin smooth glaze-like appearance. 4. In acid-etched control specimen cohesive failure predominated, whereas adhesive failure was the main mode in laser-treated group. Based upon the above-mentioned results, it can be assumed that the $CO_2$ laser is not an adequate substitute for the acid-etch technique in enamel preconditioning. More studies are required to explore the effective condition of laser irradiation which could attain the better bond strength of restorative materials.