• 제목/요약/키워드: acid deposition

검색결과 558건 처리시간 0.03초

건식법을 이용한 폴리이미드 박막의 제조 및 광특성 (A Study of The Photosensitive Characteristic and Fabrication of Polyimide Thin Film by Dry Processing)

  • 이붕주
    • 전기학회논문지
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    • 제56권1호
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    • pp.139-141
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    • 2007
  • Thin films of polyimide (Pl) were fabricated by a vapor deposition polymerization method (VDPM) and studied for the photosensitive characteristic. Polyamic acid (PAA) thin films fabricated by vapor deposition polymerization (VDP) from 6FDA and 4-4' DDE were converted to PI thin films by thermal curing. From AFM and Ellipsometer experimental, the films thickness was decreased and the reflectance was increased as the curing temperature was increased. Those results implies that thin film is uniform. From UV-Vis spectra, PI thin films showed high absorbance in 225 $\sim$ 260 [nm] region.

FORMATION OF AMORPHOUS NICKEL-PHOSPHORUS ALLOY FILM

  • Yamashita, Tsugito;Komiyama, Toyohiko
    • 한국표면공학회지
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    • 제29권6호
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    • pp.720-723
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    • 1996
  • The behavior of electrodeposition of amorphous nickel-phosphorus has been studied from the point of deposition mechanism, kinetic parameters, morphology and formation of alloy films. The electorode reaction and electrode kinetics of deposition of nickel were significantly influenced by the content of phosphorus. The cathodic deposition of nickel-phosphorus alloy might be governed by the diffusion process of phosphorous acid. The direction of growth layer of the nickel-phosphorus alloy was different with substrate material. The formation of nickel-phosphorus alloy films was affected considerably by the solution compositions, electrolytic conditions and properties of the material as an underlayer.

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무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화 (Electroless Ni-P layer Characteristics in accordance with the plating process conditions)

  • 이홍기;전준미;박해덕
    • 한국표면공학회지
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    • 제36권3호
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    • pp.263-271
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    • 2003
  • Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

A Novel Deposition Method of PLGA Nanoparticles on Coronary Stents

  • Joo, Jae-Ryang;Nam, Hye-Yeong;Nam, So-Hee;Baek, In-Su;Pakr, Jong-Sang
    • Bulletin of the Korean Chemical Society
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    • 제30권5호
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    • pp.1085-1087
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    • 2009
  • Bare metal stents which were used to treat coronary artery disease have several biochemical problems. Polymerbased drug-eluting stents (DES) have opened up a new paradigm in the treatment of in-stent restenosis. Many studies and research programmes have proved that DES can prevent restenosis. In our study, paclitaxel-loaded poly (lactic-co-glycolic acid) (PLGA) nanoparticles have been deposited along the three dimensional scaffold of coronary stents by a method using self-assembling properties of colloidal particles. We found that the nanoparticles were deposited uniformly and closely packed. The amount of paclitaxel was easily controlled by the drug content of the nanoparticles and the deposition count.

Adsorption of nitrate onto nitrogen-doped activated carbon fibers prepared by chemical vapor deposition

  • Yoo, Pyunghwa;Amano, Yoshimasa;Machida, Motoi
    • Korean Journal of Chemical Engineering
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    • 제35권12호
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    • pp.2468-2473
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    • 2018
  • Nitrogen-doped activated carbon fibers (ACFs) were prepared by chemical vapor deposition using melamine powder and acetonitrile for introducing quaternary nitrogen on the commercial ACFs, subsequently heated at $950^{\circ}C$ and activated by steam. Adsorption experiments of nitrate in aqueous solution were also conducted to evaluate adsorption capacity of the prepared ACFs using ion chromatography. The amount of introduced nitrogen content and nitrogen species on activated carbon fibers was examined by CHN elemental analyzer and X-ray photoelectron spectroscopy, respectively. As a result, adsorption capacity of quaternary nitrogen-doped ACF (ST-ML-AN-ST) was 0.75 mmol/g, indicating ca. two-times higher than that of untreated ACF (0.38 mmol/g). According to the adsorption data, the Langmuir isotherm model was the best fit. The prepared samples were also regenerated using hydrochloric acid. After regeneration, the adsorption capacity of the nitrogen-doped ACF (ST-ML-AN-ST) showed ca. 80% on average, implying that a portion of nitrates was adsorbed on the prepared ACFs irreversibly.

A Monte Carlo Simulation Incorporated with Genetic Algorithm for the Transition Deposition of LB Film of Fatty Acid

  • 최정우;조경상;이원홍;이상백;이한섭
    • Bulletin of the Korean Chemical Society
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    • 제19권5호
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    • pp.544-548
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    • 1998
  • A Monte Carlo simulation incorporated with the genetic algorithm is presented to describe the defect known as "transition from Y-to X-type deposition" of the cadmium arachidate Langmuir-Blodgett multilayer film. Simulation is performed based on the detachment models of XY-type deposition. The transition is simulated by introducing a probability of surface molecule detachment considering interaction between neighboring molecules. The genetic algorithm is incorporated into Monte Carlo simulation to get the optimum value of the probability factors. The distribution of layers having different thickness predicted by the simulation correlates well with the measured distribution of thickness using the small-angle X-ray reflectivity. The effect of chain length and subphase temperature on the detachment probability are investigated using the simulation. Simulation results show that an increase (or a decrease) of two hydrocarbon chain is roughly equivalent to the detachment probability to a temperature decrease (or increase) of 15 K.

Comparison of Deposition Behavior and Properties of Cyanide-free Electroless Au Plating on Various Underlayer Electroless Ni-P films

  • Kim, Dong-Huyn
    • 한국표면공학회지
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    • 제55권4호
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    • pp.202-214
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    • 2022
  • Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.

Post Ru CMP Cleaning for Alumina Particle Removal

  • Prasad, Y. Nagendra;Kwon, Tae-Young;Kim, In-Kwon;Park, Jin-Goo
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.34.2-34.2
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    • 2011
  • The demand for Ru has been increasing in the electronic, chemical and semiconductor industry. Chemical mechanical planarization (CMP) is one of the fabrication processes for electrode formation and barrier layer removal. The abrasive particles can be easily contaminated on the top surface during the CMP process. This can induce adverse effects on subsequent patterning and film deposition processes. In this study, a post Ru CMP cleaning solution was formulated by using sodium periodate as an etchant and citric acid to modify the zeta potential of alumina particles and Ru surfaces. Ru film (150 nm thickness) was deposited on tetraethylorthosilicate (TEOS) films by the atomic layer deposition method. Ru wafers were cut into $2.0{\times}2.0$ cm pieces for the surface analysis and used for estimating PRE. A laser zeta potential analyzer (LEZA-600, Otsuka Electronics Co., Japan) was used to obtain the zeta potentials of alumina particles and the Ru surface. A contact angle analyzer (Phoenix 300, SEO, Korea) was used to measure the contact angle of the Ru surface. The adhesion force between an alumina particle and Ru wafer surface was measured by an atomic force microscope (AFM, XE-100, Park Systems, Korea). In a solution with citric acid, the zeta potential of the alumina surface was changed to a negative value due to the adsorption of negative citrate ions. However, the hydrous Ru oxide, which has positive surface charge, could be formed on Ru surface in citric acid solution at pH 6 and 8. At pH 6 and 8, relatively low particle removal efficiency was observed in citric acid solution due to the attractive force between the Ru surface and particles. At pH 10, the lowest adhesion force and highest cleaning efficiency were measured due to the repulsive force between the contaminated alumina particle and the Ru surface. The highest PRE was achieved in citric acid solution with NaIO4 below 0.01 M at pH 10.

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강우분석과 모델링에 의한 원주시 대기오염물질($SO_2$) 이동과 침적에 관한 연구 (Studies on the Transportation and Wet Deposition of Air Pollutant($SO_2$) by Modeling and Precipitation Analysis in Wonju City)

  • 권영식;송동웅;강경호
    • 분석과학
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    • 제9권1호
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    • pp.98-106
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    • 1996
  • 대기확산 모델 TCM(Texas Climatological Model)을 이용하여 $SO_2$ 오염도를 예측하였으며 강우분석에 의한 $SO_2$의 침적에 관하여 연구하였다. 원주시의 월별 $SO_2$ 실측치와 모델예측치의 상관계수는 높은 편이었으며 $SO_2$는 강우에 의해 세척되어 제거되는데, $SO_2$ 총배출량에 대한 제거율이 여름철이 가을, 겨울보다 높게 나타났으며, 이는 여름철에 강우량이 많기 때문이 고 강우량과 제거율과의 상관계수는 0.68로 나타났다. 강우량이 많은 달은 $SO_2$ 실측치가 모델예측치보다 상당히 낮아지는 경향을 보였다.

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무전해 Ni 도금의 전기화학적 고찰 (Electrochemical aspects of electroless nickel-boron plating)

  • 김영기;이원해
    • 한국표면공학회지
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    • 제26권4호
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    • pp.175-182
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    • 1993
  • Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.

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