• 제목/요약/키워드: abrasive size

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A Study of Electrochemical Characteristics on Copper Film (Copper 막의 전기화학적 특성에 관한 연구)

  • Han, Sang-Jun;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.07b
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    • pp.1269-1270
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    • 2006
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry.

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Effects of Oxidizer Additive on the Performance of Copper-Chemical Mechanical Polishing using Tungsten Slurry (텅스텐 슬러리를 사용한 Cu-CMP 특성에서 산화제 첨가의 영향)

  • 이우선;최권우;이영식;최연옥;오용택;서용진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.2
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    • pp.156-161
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    • 2004
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

A study on the Grindability of Fine Ceramics by Experimental Method (실험적 방법에 의한 파인세라믹스의 연삭성에 관한 연구)

  • Kim, Seong-Kyeum
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.3
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    • pp.35-42
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    • 2011
  • This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

A Study on the Ultrasonic Micro-machining and Measurement System (초음파 초정밀 가공 및 측정시스템에 대한 연구)

  • Ju, Jong-Nam;Han, Dong-Cheol;Park, Hui-Jae;Park, Sang-Sin;Je, Seong-Uk
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.7
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    • pp.133-140
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    • 2002
  • Ultrasonic Machining (USM) is widely used in cutting of non-conductive, brittle workpiece materials such as engineering ceramics. However, USM has a limitation in its application to micro machining because problems are occurred in attaching micro tools to the machine and maintaining high precision. Therefore Micro Ultrasonic Machining (MUSM) with WEDM is proposed in this research. The experiments are produced as the change of shaft diameter and abrasive size.

A Study of Electrochemical Characteristics on Copper Film (Copper 막의 전기화학적 특성에 관한 연구)

  • Han, Sang-Jun;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1729-1730
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    • 2006
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_{3}$ abrasive particles in CMP slurry.

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Microstructural and Mechanical Characteristics of In Situ Synthesized Chromium-Nickel-Graphite Composites

  • Pirso, Juri;Viljus, Mart;Letunovits, Sergei;Juhani, Kristjan
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.631-632
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    • 2006
  • Cr-C-Ni composites were synthesized in situ from elemental powders of Cr, Ni and C by high energy milling followed by reactive sintering. The milled powders with the grain size in nano-scale were pressed to compacts and sintered. During the following thermal treatment at first the chromium carbide was formed and then the $Cr_3C_2-Ni$ cermets were sintered in one cycle. The interface between the binder phase and the carbide grains of the in situ composite has a good bonding strength as it is not contaminated with oxidation films or other detrimental surface reactions.

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Effect of Heat Treatment on the Microstructure and Mechanical Properties for Al-Si Alloyed Powder Material by Gas Atomizing and Hot Extrusion Process (가스 분무 공정에 의해 제조된 Al-Si 합금 분말 압출재의 열처리에 의한 미세조직 및 기계적 특성 변화)

  • Nam, Ki-Young;Jin, Hyeong-Ho;Kim, Yong-Jin;Yoon, Seog-Young;Park, Yong-Ho
    • Journal of Powder Materials
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    • v.13 no.6 s.59
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    • pp.421-426
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    • 2006
  • The microstructural and mechanical properties of Al-Si alloyed powder, prepared by gas atomization fallowed by hot extrusion, were studied by optical and scanning electron microscopies, hardness and wear testing. The gas atomized Al-Si alloy powder exhibited uniformly dispersed Si particles with particle size ranging from 5 to $8{\mu}m$. The hot extruded Al-Si alloy shows the average Si particle size of less than $1{\mu}m$. After heat-treatment, the average particle size was increased from 2 to $5{\mu}m$. Also, mechanical properties of extruded Al-Si alloy powder were analyzed before and after heat-treatment. As expected from the microstructural analysis, the heat-treated samples resulted in a decrease in the hardness and wear resistance due to Si particle growth. The friction coefficient of heat-treated Al-Si alloyed powder showed higher value tough all sliding speed. This behavior would be due to abrasive wear mechanism. As sliding speed increases, friction coefficient and depth and width of wear track increase. No significant changes occurred in the wear track shape with increased sliding speed.

Development of point-of-use filter evaluation method using chemical mechanical planarization slurry (Chemical mechanical planarization 슬러리에 사용되는 point-of-use 필터의 평가 방법 개발)

  • Jang, Sunjae;Kulkarni, Atul;Kim, Hyeong-U;Kim, Taesung
    • Particle and aerosol research
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    • v.12 no.4
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    • pp.145-150
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    • 2016
  • During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

Mechanical Properties of SiCp/AC8A Composites Fabricated by Pressureless Metal Infiltration Process (무가압함침법으로 제조한 SiCp/AC8A 복합재료의 기계적 성질)

  • 김재동;고성위;김형진
    • Composites Research
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    • v.15 no.3
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    • pp.1-10
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    • 2002
  • The effect of size of SiC particles and additive Mg content on the mechanical properties and wear characteristics were investigated for the SiCp/AC8A composites fabricated by pressureless infiltration process. Results showed that the hardness and the bending strength increased with decreasing the size of SiC particle. By increasing the Mg content the hardness of SiCp/AC8A composites increased due to the hard reaction products, however the bending strength decreased by formation of coarse precipitates and high porosity level. The SiCp/AC8A composites exhibited about 6 times higher wear resistance compared with AC8A alloy at high sliding velocity and as increasing the particle size, wear resistance was improved. The major wear mechanical of SiCp/AC8A composites exhibited the abrasive wear at low to high sliding velocity whereas AC8A alloy showed adhesive and melt wear at high sliding velocity.

Heat and Wear Resistance Characterization of SiCp Reinforced Al Matrix Composites (SiCp입자강화 Al 복합재료의 내열 및 마모특성)

  • Kim, Sug-Won;Kim, Wan-Ki;Woo, Kee-Do;Ahn, Haeng-Keun
    • Journal of Korea Foundry Society
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    • v.20 no.6
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    • pp.377-385
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    • 2000
  • Al matrix composites as the most promising MMCs can be expected to be excellent engineering materials in the nearest future. So as to improve material properties of composite, many manufacturing processes have been developed. Among them, squeeze casting process which offers fine microstructure and near-net-shape is one of the most successful MMCs manufacturing processes. But, in case of with subsieve size particles (under 44 ${\mu}m$), it is very difficult to homogeneously distribute particles in matrix of Al matrix composite by various casting processes, including squeeze casting used so far. Duplex process which was developed in previous study was used to distribute the particle of subsieve size more homogeneously in matrix of Al matrix composite. Microstructures, wear and heat resistance characterization of Al-Si-Cu-Mg-(Ni)/SiCp manufactured by duplex process were examined to clarify the effect of manufacturing conditions, particle size of reinforcement and alloying elements. Al matrix composites reinforced with SiCp(10 ${\mu}m$) have the lowest wear amount among composites reinforced with 3 ${\mu}m$, 5 ${\mu}m$ and 10 ${\mu}m$ SiCp. The wear amount of Al matrix composites with 10 wt.% SiCp(3, 5, 10 ${\mu}m$) was decreased according to the increase of the sliding speed because abrasive wear takes place at high sliding speed of 4m/s and worn debris with block type occurs at low sliding speed of 1m/s. As for heat resistance, it is made clear that remarkable heat resistance property can be obtained by addition of Ni element in Al matrix composites.

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