• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.10
• /
• pp.1023-1028
• /
• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• 한국지구물리탐사학회:학술대회논문집
• /
• 2003.11a
• /
• pp.637-641
• /
• 2003

Abrasive powders were recovered from electrical industry sludge by simple physical separation for their recycling. The raw electrical industry sludge was filter pressed, dried, dispersed and then classified by air classifier at various conditions. The three kinds of particles with different particle size distribution were classified by controlling rotor speed and air volumes of the classifier. The recovered abrasive powders, which are classified at 5,000,9000 and 13,000 rpm of rotor speed, are almost same properties to raw pumice, garnet and rouge powders, respectively. The results of particle size analysis, X-ray diffraction and SEM observation show that the recovered powders can be reused as an abrasive powders.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.16 no.2
• /
• pp.16-21
• /
• 2017

An experimental study has been carried out to improve the performance of a commercial abrasive blasting nozzle, by simply redesigning the nozzle's inner contour. The analytical 1-D code, that can evaluate both the frictional effects on the nozzle inner wall and the sphericity effects of the particle, is utilized to calculate the dynamics of the particle inside the nozzle. The analytical results are compared to the experimental ones, that were obtained from images of the particle streaklines downstream from the nozzle exit. It is noted that the particle velocity at the redesigned nozzle exit increases as compared to the original commercial nozzle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.561-562
• /
• 2006

The purpose of this study was to investigate the root cause of adhesion of silica and ceria particles during Poly-Si, TEOS, and SiN CMP process, respectively. The zeta-potentials of abrasive particles and wafers were observed negative surface charges in the alkaline solutions. SAC and STI patterned wafers have intermediate values of their composition surface's zeta potentials. The theoretical interaction force and adhesion force of silica and ceria particle were calculated in solution with acidic, neutral and alkaline pH. A stronger attractive force was calculated for silica and ceria particles on wafers in acidic solutions than in alkaline solutions. The theoretical interaction forces of the SAC and STI patterned wafers have intermediate values of their constitution wafer's values. The adhesion forces is observed lower values in alkaline solutions than in acidic solutions. And the ceria particle has lower adhesion than that of the silica particle.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.649-652
• /
• 2005

Abrasive jet machining is a well-known process for patterning window glass and mirrors. The technics is now being developed for the production structure with high precision. This paper describes erosion profile modeling of micro abrasive jet machining and compares with other researcher's model.

• YAKHAK HOEJI
• /
• v.37 no.1
• /
• pp.66-75
• /
• 1993

Dental abrasive, dicalcium phosphate dehydrate (DCPD) was prepared and the several important factors affecting on the quality of toothpaste were investigated by means of set test, glycerine absorption, Coulter counter test, color difference, BET adsorption, mercury porosimetery, and rheogram comparing with two foreign DCPDs, MFO4 and Dentphos K. Sample DCPD was prepared by reaction between 85% H$_{3}$PO$_{4}$ and 15% milk of lime at $39^{\circ}C$ (pH6.5), and stabilized with TSPP and TMP. The physicochemical properties of Sample DCPD were obtained as follows: whiteness (98.99), average particle size (15.5 $\mu\textrm{m}$), pH (7.9), remainder particle weight (0.49w/w%), glycerine absorption value (64 ml), and set test (passed). N$_{2}$ adsorption curves (BET) of three kinds of DCPD showed non-porous type III isotherm. BET adsorption parameters of sample DCPD showed that surface area was 24.9 m$^{2}$/g, total pore volume 0.09 cm$^{3}$/g and average pore radius 72.0 $\AA$. The rheogram of the toothpaste containing each DCPD showed bulged plastic flow with yield vlaue and thixotropic behavior. These results meet standard requirements as abrasive standard, and suggested that synthesized sample DCPD could be used a dental abrasive such as a high quality grade in practice as foreign DCPDs.

• Tribology and Lubricants
• /
• v.28 no.6
• /
• pp.283-288
• /
• 2012

In this study, a new sliding contact problem involving an elastomeric seal, a spherical particle and a hard coated steel counterface was modeled to investigate the detailed wear mechanisms related to the sealing surface. The model was also used to design the optimum coating conditions. A three-dimensional finite element contact problem was modeled and analyzed using the nonlinear finite element code, MARC. The deformed steel surface and stress distributions are presented for different coating layers and thicknesses. When the coating thickness is relatively small, the entrapped particle produces surface plastic deformations such as groove and torus. In addition, the sealing surface can be damaged by abrasive wear as well as fatigue wear. For a relatively thick and multi-layered coating, on the other hand, surface plastic deformation does not occur, and the amount of abrasive and fatigue wear is reduced. Therefore, the proposed contact model and results can be used in the design of various sealing systems, further intensive studies are required.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.53 no.11
• /
• pp.551-555
• /
• 2004

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.487-487
• /
• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

• Tribology and Lubricants
• /
• v.28 no.1
• /
• pp.1-6
• /
• 2012

In this paper, a three elastic body sliding contact problem is modeled to investigate more precise wear mechanisms related with the sealing surface. A 3-D finite element contact model, a small spherical elastic particle, PTFE seal and steel surface, is solved using a nonlinear finite element code MARC. The deformed seal and steel surface shapes, von-Mises and principal stress distributions are obtained for different seal sliding distances. The entrapped small particle within PTFE seal results in very high stresses on the steel surface which exceeded its yield strength and produce plastic deformation such as groove and torus. The sealing surface could also be worn down by sub-surface fatigue due to intervening small particles together with the well-known abrasive wear. Therefore the proposed contact model adopted in this paper can be applied in design of various sealing systems, and further studies are required.