• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.198.1-198
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.35-40
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• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.185-191
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• 2023

The lifetime and corrosion resistance of the coating depends on its thickness and composition. We checked how the plating progressed according to the shape of the product to be plated. There was no significant difference in the composition or thickness of the plating according to the shape of the separately plated products. Samples of different shapes collected from products with complex shapes showed no significant difference in composition depending on the shape, but significant differences in thickness. This difference is due to the difference in applied current density depending on the shape of the product.

• Resources Recycling
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• v.25 no.4
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• pp.42-48
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• 2016

A research for the recovery of the metal with high purity from the waste tin plating solution was carried out. First, tin plating waste solution was tested to remove the organic substances and metallic impurities such as Fe, Zn, Na etc. using ion exchange resin having iminodiacetic functional groups (Lewatit TP 207). Second, the tin solution was purified to obtain the high purity tin solution using ion exchange resin having ethylhexyl-phosphate functional groups (Lewatit VPOC 1026). Finally, 99.98% of the high purity of tin metal can be recovered from the purified solution by cyclone type electrowinning method.

• Proceedings of the Korean Magnestics Society Conference
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• 2001.04a
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• pp.146-147
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• 2001

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.205-206
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• 2011

Cu thin films for electromagnetic wave shielding were prepared on PET film and Ni-coated PET film by using Dry and Wet coating method, such as evaporation method, DC sputtering method and copper sulfate($CuSO_4$). After that, Zn thin film and Ni thin film were prepared onto the Cu thin films by using evaporation dry process and Ni electro plating wet process as a finishing treatment, respectively. The result of conductivity test and corrosion resistance test revealed Cu thin films which were formed with bigger grain size and high Cu composition rate have superior properties. Zn thin film by dry evaporation process and Ni thin film by wet electro plating process on Cu thin films were largely contributed to corrosion resistance. However, Ni thin film by wet process made conductivity of all specimen worse, the other hand, Zn thin film by dry process made it better to improve condictivity of specimens just prepared by dry process.

• Membrane Journal
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• v.4 no.2
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• pp.106-112
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• 1994

The ultrafiltration(UF) and reverse osmosis(RO) tests for a model metal plating wastewater prepared with zinc sulfate, showed the zinc ion rejection coefficient of over 99% and the permeate flux of $1.49 {\times} 10^{-3}cm/sec$ at pH = 8.3. The effect of cyanide on the zinc removal was investigated. When the amount of cyanide addition was same the zinc content, the zinc was removed over 99% and the cyanide was excluded about 93%. The addition of the surfactants such a LAS-Na and EDTA-Na was found to reduce the permeate flux down to $0.76 {\times} 10^{-3}cm/sec$ at the RO membrane.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.700-708
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• 1996

Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.265-275
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• 1999

Titanium nitride and related overlayers produced by arc ion plating (AIP) are applied as commercial coatings in world-wide scale since the middle of 80s. Due to the achievements of low temperature deposition (LTD), they begin now to be used as wear and corrosion-resistant coatings for machine parts, besides applications on cemented carbide and high speed steel cutting tools. On the other side, TiN can be now applied successfully to brass, Al-alloy, ZnAl alloy articles as decorative coating through LTD. Various nitrides, carbonitrides, borides and other refractory compounds, such as (Ti, Al)N, TiCN, CrN, are used as the coatings for special heavy-duty working conditions instead of TiN since 90s. More and more multilayer coatings are applied now substituting single layer ones. Duplex processes are under development.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.224-226
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• 2006