• Journal of the Korean institute of surface engineering
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• v.49 no.5
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• pp.401-407
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• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

• Journal of the Korean institute of surface engineering
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• v.49 no.3
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• pp.238-244
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• 2016

Copper electrodeposition on AZ91 Mg alloy was studied in views of preferential deposition on ${\alpha}$- or ${\beta}$- phases and how to achieve uniform deposition over the entire surface on ${\alpha}$- and ${\beta}$-phases in a cyanide solution. The inhomogeneous microstructure of AZ91 Mg alloy, particularly ${\alpha}$- and ${\beta}$-phases, was found to result in non-uniform deposition of zincate layer, preferential deposition of zincate on ${\beta}$-phases, which leads to non-uniform growth of copper layer during the following electrodeposition process. The preferential depositions of zincate can be attributed to higher cathodic polarizations on the ${\beta}$-phases. Pin-hole defects in the copper electrodeposit were observed at the center of large size ${\beta}$-phase particles which is ascribed to gas bubbles formed at the ${\beta}$-phases. The activation of AZ91 Mg alloy in hydrofluoric acid solution was used to obtain uniform growth of zincate layer on both the ${\alpha}$- and ${\beta}$-phases. By choosing an optimum activation time, a uniform zincate layer was obtained on the AZ91 Mg alloy surface and thereby uniform growth of copper was obtained in a cyanide copper electroplating solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.124.1-124.1
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• 2016

In this work, uniform thickness and good adhesion of electrodeposited copper layer were achieved on AZ91 Mg alloy in alkaline noncyanide copper solution containing pyrophosphate ion by employing appropriate zincate pretreatment. Without zincate pretreatment, the electrodeposited copper layer on AZ91 Mg alloy was porous and showed poor adhesion which was explained by small number of nucleation sites of copper due to rapid dissolution of the magnesium substrate in the pyrophosphate solution. The zincate pretreatment was found as one of the most important steps that can form a conducting layer to cover AZ91 surface which decreased the dissolution rate of AZ91 Mg alloy about 40 times in the copper pyrophosphate solution. Electrodeposited copper layer on AZ91 Mg alloy after an appropriate zincate pretreatment showed good adhesion and uniform thickness with bright surface appearance, independent of the deposition time but the surface roughness of the electrodeposited copper layer increased with increasing Cu deposition time.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.194.1-194.1
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• 2016

The present study investigated the effect of zincate treatment time on the dissolution behavior and the deposition of copper by immersion process and electroplating process on AZ31 Mg alloy substrate in a copper pyrophosphate bath. Without zincate pretreatment, the AZ31 Mg substrate quickly dissolved in the copper pyrophosphate solution although an external cathodic current was applied. The copper layers deposited on non-zincate treated AZ31 Mg alloy substrate by both immersion and electroplating processes showed very porous structure and very poor adhesion. With increasing zincate treatment time up to 2 min, the dissolution of AZ31 substrate in pyrophosphate solution rapidly decreased and the deposited copper layer was less porous and exhibited stronger adhesion. The immersion of AZ31 Mg sample in zincate solution for 5 min was found as a critical time for producing a non-porous and adherent electrodeposited copper layer on AZ31 Mg alloy. The optimum zincating time can be determined by observing the open circuit potential (OCP) of AZ31 Mg alloy samples in a copper pyrophosphate electroplating bath. The OCP reached a stable value of about -0.10 V (vs. SCE) after 5 min of immersion in the copper pyrophosphate electroplating solution.

• Journal of the Korean institute of surface engineering
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• v.44 no.6
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• pp.239-245
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• 2011

Magnesium alloys is the lightest by structural metals, but it is not good corrosion resistant because of pit, void. Particularly, AZ31B magnesium alloy sheets that have slag, scratch by rolling process indicate some defects. The objective of this research is to perform uniform plating on AZ31B by studying etching and zincate process. Especially, zincate treatment by zinc salt and pyrophosphate is the most important in the decoration plating. Dissolution of magnesium is reduced by the formation of uniform zinc conversion layer during strick and post process, which decreases defects for plating process.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1095-1101
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• 1999

Electroless Ni plating is applied to form bumps and UBM layer for flip chip interconnection. Characteristics of electroless Ni are also investigated. Zincate pretreatment is analyzed and plated layer characteristics are investigated according to variables like temperature, pH and heat treatment. Based on these observations, characteristics dependence to each variables and optimum electroless Ni plating conditions for flip-chip interconnection are suggested. Electroless Ni has 10wt% P, $60\mu\Omega$-cm resistivity, 500HV hardness and amorphous structure. It changes crystallized structure and hardness increases after heat treatment After interconnection of electroless Ni bumps by ACF flip chip method, we show their advantages and possibility in microelectronic package applications.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.700-708
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• 1996

Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.