• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.557-561
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• 2001

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.

• Journal of Advanced Marine Engineering and Technology
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• v.10 no.2
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• pp.136-145
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• 1986

The perfect and accurate methods to control the wear are not made clear so far. For this phenomenon only mating surface has been studied. In order to control the wear the essence of it has to be made clear. It is reported that adhesive wear might occure as a result of plastic deformation, the fracture and removal or transfer asperities on close contacting surfaces. On this view point the plastic flow was attempted to compare with fluid or electromagnetic flow. The partial differential equations of equilibrium for the plane strain deformation will make use of the method of characteristics. The characteristic curves or characteristics of the hyperbolic equation coincide with the slip lines by R. Hill's papers. By Hencky's stress equation, it is evident that if P and .phi. are prescribed for a boundary condition then it may be possible to proceed along constant .alpha. and .betha. lines to determine the value of the hydrostatic pressure everywhere in the slip line field net work. A wedge formation mechanism has been considered for an explanation of this matters. The analysis shows that there is a critical value, which depends on the hardness ratio and the shear stress on the interface, for the top angle of asperity is less than this critical value, the asperity can yield plastically despite of being harder than the mating surface.

• Journal of the Korean Society of Safety
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• v.25 no.6
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• pp.128-136
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• 2010

In according with concrete structural design standard, it is common designing flexure reinforcement concrete to induce tension failure. So reinforcing ratio is limited to inducing tension failure. And maximum reinforcing ratio is regulated to protecting concrete compression strength caused by over reinforced building. Minimum reinforcing ratio is also limited in designing standard to protecting brittle failure as extremely using less reinforcing bar. But in minimum reinforcing ratio it is extremely conservative or it is sometimes impossible to induce stable tension-failure because they are depending on yield failure and experienced method and concrete designing standard strength. Therefore the purpose of the present paper is to evaluate the flexural behavior of minimum steel ratio of reinforced concrete of beams and to propose the guide-line of equation of minimum steel ratio by performing static flexural test of 16 beams according to size effect, number of steel, yielding stress of steel, and concrete compressive strength which are presumed effective variables. From experimental results, the equation of minimum steel ratio was newly proposed considered size effect.

• Journal of Digital Contents Society
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• v.6 no.4
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• pp.209-216
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• 2005

The aim of this study is to examine the effects of web-based cyber instruction on EFL learning from the viewpoint of learners` perceptions and needs. Data was collected through a questionnaire survey that was carried out with 709 undergraduate student enrolled in three cyber English courses offered at N university during the secind semester in 2004. The results of the study indicated that the learners exhibited a positive attitude towards web-based cyber instruction and considered it a paper educational method in the cyber age. However, the students perceived that web-based cyber instruction was not greatly satisfactory in terms of cultivating their English communicative competence or improving the language skills they needed. It was also found that cyber instruction was still teacher-dominant, lacking in interaction, which made the students passive recipients of informaton presented. In comparison with off-line instruction, cyber instruction was not particularly better in enhancing their motivation interest or concentration on class. To be more effective, cyber instruction needs to be equipped not only with a large variety of contents and class activities, but also with more exposure to authentic language by native English speakers. The finding of the investigation yield some implications for the design and development of web-based cyber EFL programs.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.315-321
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• 2004

The void evolution in direct bonding process of $Si/Si_3$$N_4$ ∥ $SiO_2$/Si silicon wafer pairs has been investigated with an infrared camera. The voids that formed in the premating process grew in the conventional furnace annealing process at a temperature of $600^{\circ}C$. The voids are never shrunken even with the additional annealing process at the higher temperatures. We observed that the voids became smaller and disappeared with sequential scanning by our newly proposed fast linear annealing(FLA). FLA irradiates the focused line-shape halogen light on the surface while wafer moves from one edge to the other. We also propose the void shrinking mechanism in FLA with the finite differential method (FDM). Our results imply that we may eliminate the voids and enhance the yield for the direct bonding of wafer pairs by employing FLA.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.26-34
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• 1998

This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.54-60
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• 2006

Fitting process carried out in automobile transmission assembly line is classified into three classes; heat fitting, press fitting, and their combined fitting. Heat fitting is a method that heats gear to a suitable range under the tempering temperature and squeezes it toward the outer diameter of shaft. Its stress depends on the yield strength of gear. Press fitting is a method that generally squeezes gear toward that of shaft at room temperature by press. Another method heats warmly gear and safely squeezes it toward that of shaft. Warm shrink fitting process for automobile transmission part is now gradually increased, but the parts (shaft/gear) assembled by this process produced dimensional changes of gear profile in both radial and circumferential directions. So that it may cause noise and vibration between gears. In order to solve these problems, we need an analysis of warm shrink fitting process, in which design parameters are involved; contact pressure according to fitting interference between outer diameter of shaft and inner diameter of gear, fitting temperature, and profile tolerance of gear. In this study, an closed form equation to predict contact pressure and fitting load was proposed in order to develop optimization technique of warm shrink fitting process and verified its reliability through the experimental results measured in the field and FEM, that is, thermal-structural coupled field analysis. Actual loads measured in the field have a good agreement with the results obtained by theoretical and finite element analysis and also the expanded amounts of the gear profile in both radial and circumferential directions are within the limit tolerances used in the field.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.5 s.182
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• pp.37-43
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• 2006

Fitting process carried out in automobile transmission assembly line is classified into three classes; heat fitting, press fitting, and their combined fitting. Heat fitting is a method that heats gear to a suitable range under the tempering temperature and squeezes it toward the outer diameter of shaft. Its stress depends on the yield strength of gear. Press fitting is a method that generally squeezes gear toward that of shaft at room temperature by press. Another method heats warmly gear and safely squeezes it toward that of shaft. Warm shrink fitting process for automobile transmission part is now gradually increased, but the parts (shaft/gear) assembled by this process produced dimensional change in both outer diameter and profile of the gear. So that it may cause noise and vibration between gears. In order to solve these problems, we need an analysis of warm shrink fitting process, in which design parameters are involved; contact pressure according to fitting interference between outer diameter of shaft and inner diameter of gear, fitting temperature, and profile tolerance of gear. In this study, an closed form equation to predict contact pressure and fitting load was proposed in order to develop optimization technique of warm shrink fitting process and verified its reliability through the experimental results measured in the field and FEM, that is, thermal-structural coupled field analysis. Actual loads measured in the field have a good agreement with the results obtained by theoretical and finite element analysis and also the expanded amounts of the outer diameters of the gears have a good agreement with results.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.47-54
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• 2008

Fitting process carried out in the automobile transmission assembly line is classified into three classes; heat fitting, press fitting, and their combined fitting. Heat fitting is a method that heats gear to a suitable range under the tempering temperature and squeezes it toward the outer diameter of shaft. Its stress depends on the yield strength of gear. Press fitting is a method that generally squeezes gear toward that of shaft at room temperature by a press. Another method heats warmly gear and safely squeezes it toward that of shaft. Warm shrink fitting process for the automobile transmission part is now gradually increased, but the parts (shaft/gear) assembled by this process produced dimensional changes in both the outer diameter and profile of the gear. So that it may cause noise and vibration between gears. In order to solve these problems, we need an analysis of warm shrink fitting process, in which design parameters are involved; contact pressure according to fitting interference between outer diameter of shaft and inner diameter of gear, fitting temperature, and profile tolerance of gear. In this study, an closed form equation to predict contact pressure and fitting load was proposed in order to develop an optimization technique of the warm shrink fitting process and verified its reliability through the experimental results measured in the field and FEM, that is, thermal-structural coupled field analysis. Actual loads measured in the field was in good agreements with the results obtained by the theoretical and finite element analysis.

• Journal of Bio-Environment Control
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• v.27 no.2
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• pp.117-124
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• 2018

Recently, the interest and consumption of mini watermelon (Citrullus lunatus Thunb.) are increasing due to nuclear family and one person household. However, there's no research for mini watermelon. Therefore, the purpose of the study is to develop standard cultivation method of mini watermelon. The test cultivar is 'Minimi', which is a small-sized fruit, the rootstock is 'Bullojangsaeng', which is a cucurbit line. Grafted plants were transplanted on April 5, 2017, and harvested in early July. Cultivated types were 3 methods, which are ${\cap}-form$, arched, and runner type, and plant spacing were 40, 60, and 80 cm, respectively. The rowth and yield in ${\cap}-form$ was higher than that of the arched and runner types, and the sugar content was higher a bit. The yield per unit area was about 50% higher than ${\cap}-form$, which can be plant density cultivation than that of the runner type. The number of seeds per fruit of 'Minimi' was similar to that of 'Sambokggul', but seed weight was one third lower than that of 'Sambokggul'. The content of lycopene was 30% higher than that of 'Sambokggul' watermelon, and the main sugar content is similar to or slightly less. In conclusion, the ${\cap}-form$ staking cultivation was superior to the runner type or arched cultivation in terms of fruit setting ratio, yield and quality.