• 전자공학회논문지
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• 제53권11호
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• pp.66-70
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• 2016

본 논문에서는 심장박동 측정 레이더 송수신기용 24 GHz I/Q 발생기를 제안한다. 공정 변화에 따른 I/Q LO 신호간의 부정합 특성을 개선하기 위하여 인덕터와 캐패시터로 구성된 high-pass 위상천이기와 low-pass 위상천이기 기반 24 GHz I/Q LO 발생기를 제안하였다. 제안한 24 GHz I/Q 발생기는 LO 버퍼와 high-pass 위상천이기와 low-pass 위상천이기 구성된 24 GHz I/Q LO 발생기는 65 nm CMOS 공정에서 설계되었고, 전원 전압 1 V에서 8 mA의 전류를 소모하면서 24.05 GHz에서 24.25 GHz의 주파수 대역에서 7.5 dB의 전압 이득, 2.3 dB의 잡음 지수, 공정 및 온도 변화에 대해 0.1 dB의 I/Q 이득 부정합, 4.3도의 I/Q 위상 부정합의 성능을 보인다.

• 한국융합학회논문지
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• 제7권6호
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• pp.23-28
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• 2016

본 연구에서 전력 변환 회로의 전자파적합성(EMC: Electromagnetic Compatibility)에 관한 설계 및 측정 결과를 제시하고 있다. 태양광 에너지 저장 장치에 주로 사용되는 LT3652 칩을 사용한 DC-DC 전력 변환 회로가 설계되어 제작되었다. 제작된 회로를 이용하여 원거리 방사, 근거리 전도성 및 복사성 방출에 대한 시뮬레이션이 ANSYS SIwave로 수행되었으며 결과가 제시되었다. 본 연구에서 불필요한 방사를 최소화하기 위해 콘덴서와 접지 포스트가 추가된 회로를 사용하였다. 전도 및 방사 방출은 CISPR 22의 표준화 된 시험 절차에 따라 EMC 전용무반사실에서 측정되었다. 개선된 회로를 사용하여 측정된 데이터를 제시하였고 개선 전후의 값들이 비교되었다. 제시된 결과를 보면 EMI 감소 기술이 적용된 회로에서 원치 않는 방출이 크게 감소하는 것을 보여주고 있다. 여기서 제안 된 결과는 전력 컨버터 모듈의 설계에 효율적으로 적용 가능한 기술이다.

• 한국세라믹학회지
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• 제55권3호
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• pp.244-260
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• 2018

Issues in the electrical characterization of semiconducting photoanodes in a photoelectrochemical (PEC) cell, such as the cell geometry dependence, scan rate dependence in DC measurements, and the frequency dependence in AC measurements, are addressed, using the example of a $TiO_2$ photoanode. Contrary to conventional constant phase element (CPE) modeling, the capacitive behavior associated with Mott-Schottky (MS) response was successfully modeled by a Havriliak-Negami (HN) capacitance function-which allowed the determination of frequency-independent Schottky capacitance parameters to be explained by a trapping mechanism. Additional polarization can be successfully described by the parallel connection of a Bisquert transmission line (TL) model for the diffusion-recombination process in the nanostructured $TiO_2$ electrode. Instead of shunt CPEs generally employed for the non-ideal TL feature, TL models with ideal shunt capacitors can describe the experimental data in the presence of an infinite-length Warburg element as internal interfacial impedance - a characteristic suggested to be a generic feature of many electrochemical cells. Fully parametrized impedance spectra finally allow in-depth physicochemical interpretations.

• 한국정보통신학회논문지
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• 제20권9호
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• pp.1755-1762
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• 2016

본 논문에서는 입력전압 범위가 향상된 저면적 이중출력 스위치드 커패시터 DC-DC 변환기를 제안하였다. 기존의 스위치드 커패시터는 면적이 작고 저렴하지만, 효율적인 전압변환을 하는 입력전압의 범위가 좁고 다중출력의 경우 면적이 커지고 전력효율이 낮아진다. 제안된 스위치드 커패시터 DC-DC 변환기는 입력전압에 따라 커패시터 어레이 구조를 변경하여 최적의 효율을 갖는 입력 범위를 증가시켰다. 그리고 두 개의 스위치 어레이를 공유함으로써 스위치와 커패시터 수를 32개에서 25개로 줄였다. 제안된 변환기는 $0.18{\mu}m$ CMOS 공정에서 제작하였다. 시뮬레이션 결과 입력전압 범위는 0.7~1.8V이고, 최대 전력 효율은 90%이며, 칩의 면적은 $0.255mm^2$이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.61.1-61.1
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• 2015

Nanoscale semiconductor plasma processing has become one of the most challenging issues due to the limits of physicochemical fabrication routes with its inherent complexity. The mission of future and emerging plasma processing for development of next generation semiconductor processing is to achieve the ideal nanostructures without abnormal profiles and damages, such as 3D NAND cell array with ultra-high aspect ratio, cylinder capacitors, shallow trench isolation, and 3D logic devices. In spite of significant contributions of research frontiers, these processes are still unveiled due to their inherent complexity of physicochemical behaviors, and gaps in academic research prevent their predictable simulation. To overcome these issues, a Korean plasma consortium began in 2009 with the principal aim to develop a realistic and ultrafast 3D topography simulator of semiconductor plasma processing coupled with zero-D bulk plasma models. In this work, aspects of this computational tool are introduced. The simulator was composed of a multiple 3D level-set based moving algorithm, zero-D bulk plasma module including pulsed plasma processing, a 3D ballistic transport module, and a surface reaction module. The main rate coefficients in bulk and surface reaction models were extracted by molecular simulations or fitting experimental data from several diagnostic tools in an inductively coupled fluorocarbon plasma system. Furthermore, it is well known that realistic ballistic transport is a simulation bottleneck due to the brute-force computation required. In this work, effective parallel computing using graphics processing units was applied to improve the computational performance drastically, so that computer-aided design of these processes is possible due to drastically reduced computational time. Finally, it is demonstrated that 3D feature profile simulations coupled with bulk plasma models can lead to better understanding of abnormal behaviors, such as necking, bowing, etch stops and twisting during high aspect ratio contact hole etch.

• 한국재료학회지
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• 제19권11호
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• pp.576-580
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• 2009

$BaTiO_3$/epoxy composites have been widely investigated as promising materials for embedded capacitors in printed circuit boards. It is generally known that the dielectric constant (K) of the $BaTiO_3$/epoxy composites increases with improvement of the dispersion of $BaTiO_3$ particles in the epoxy matrix that comes from adding surfactant. The influences of surfactant addition on the dielectric properties of the $BaTiO_3$/epoxy composites are reported in the present study. The dielectric constant of the $BaTiO_3$/epoxy composites is not significantly affected by the surfactant addition. However, the temperature coefficient of capacitance increases and the peel strength decreases as the amount of added surfactant increases. The influences of surfactant addition on the dielectric properties of the neat epoxy are also very similar to those of the $BaTiO_3$/epoxy composites. The residual surfactant in the $BaTiO_3$/epoxy composites affects the temperature coefficient of capacitance and the peel strength of the epoxy matrix, which in turn affects the temperature coefficient of capacitance and the peel strength of the $BaTiO_3$/epoxy composites.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권2호
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• pp.95-102
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• 2001

Hafnium oxide thin films for gate dielectric were deposited at $300^{\circ}C$ on p-type Si (100) substrates by plasma enhanced chemical vapor deposition (PECVD) and annealed in $O_2$ and $N_2$ ambient at various temperatures. The effect of hydrogen treatment in 4% $H_2$ at $350^{\circ}C$ for 30 min on the electrical properties of $HfO_2$for gate dielectric was investigated. The flat-band voltage shifts of $HfO_2$capacitors annealed in $O_2$ambient are larger than those in $N_2$ambient because samples annealed in high oxygen partial pressure produces the effective negative charges in films. The oxygen loss in $HfO_2$films was expected in forming gas annealed samples and decreased the excessive oxygen contents in films as-deposited and annealed in $O_2$ or $N_2$ambient. The CET of films after hydrogen forming gas anneal almost did not vary compared with that before hydrogen gas anneal. Hysteresis of $HfO_2$films abruptly decreased by hydrogen forming gas anneal because hysteresis in C-V characteristics depends on the bulk effect rather than $HfO_2$/Si interface. The lower trap densities of films annealed in $O_2$ambient than those in $N_2$were due to the composition of interfacial layer becoming closer to $SiO_2$with increasing oxygen partial pressure. Hydrogen forming gas anneal at $350^{\circ}C$ for samples annealed at various temperatures in $O_2$and $N_2$ambient plays critical role in decreasing interface trap densities at the Si/$SiO_2$ interface. However, effect of forming gas anneal was almost disappeared for samples annealed at high temperature (about $800^{\circ}C$) in $O_2$ or $N_2$ambient.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 추계학술발표대회
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• pp.36.2-36.2
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• 2009

Low dielectric materials have been great attention in the semiconductor industry to develop high performance interlayer dielectrics with low k for Cu interconnect technology. In our study, the dielectric properties of SiOC /SiO2 thin film derived from polyphenylcarbosilane were investigated as a potential interlayer dielectrics for Cu interconnect technology. Polyphenylcarbosilane was synthesized from thermal rearrangement of polymethylphenylsilane around $350^{\circ}C{\sim}430^{\circ}C$. Characterization of synthesized polyphenylcarbosilane was performed with 29Si, 13C, 1H NMR, FT-IR, TG, XRD, GPC and GC analysis. From FT-IR data, the band at 1035 cm-1 is very strong and assigned to CH2 bending vibration in Si-CH2-Si group, indicating the formation of the polyphenylcarbosilane. Number average of molecular weight (Mn) of the polyphenylcarbosilane synthesized at $400^{\circ}C$ for 6hwas 2, 500 and is easily soluble in organic solvent. SiOC/SiO2 thin film was fabricated on ton-type silicon wafer by spin coating using 30wt % polyphenylcarbosilane incyclohexane. Curing of the film was performed in the air up to $400^{\circ}C$ for 2h. The thickness of the film is ranged from $1{\mu}m$ to $1.7{\mu}m$. The dielectric constant was determined from the capacitance data obtained from metal/polyphenylcarbosilane/conductive Si MIM capacitors and show a dielectric constant as low as 2.5 without added porosity. The SiOC /SiO2 thin film derived from polyphenylcarbosilane shows promising application as an interlayer dielectrics for Cu interconnect technology.

• 반도체디스플레이기술학회지
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• 제6권4호
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• pp.69-73
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• 2007

The MIM(metal-insulator-metal) capacitors with the Al/PMMA/ITO/Glass structures were manufactured according to various PMMA concentration of 1, 2, 4, 6, 8 wt%. The lowest leakage current and the largest capacitance were found to be 2.3 pA and 1.2 nF, respectively, for the device with 2 wt% PMMA concentration. The measured capacitance of the devices was almost same values with the calculated one. The optimum film thickness was obtained at the value of 48 nm, showing that the capacitance and leakage current were 1.92 nF, 0.3 pA at 2 wt%, respectively. From this experiment, the PMMA gate insulator films can be applicable to the organic thin film transistors.

• 대한전자공학회논문지SD
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• 제38권11호
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• pp.765-770
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• 2001

고온 급속 열처리시킨 LiNbO₃/AIN/Si(100) 구조를 이용하여 MFIS 소자를 제작하고, 비휘발성 메모리 동작 가능성을 확인하였다. 고유전율 AIN 박막 위에 Pt 전극을 증착시켜 제작한 MIS 구조에서 측정한 1MHz C-V 특성곡선에서는 히스테리시스가 전혀 없고 양호한 계면특성을 보였으며, 축적 영역으로부터 산출한 비유전율 값은 약 8 이었다. Pt/LiNbO₃/AIN/Si(100) 구조에서 측정한 1MHz C-V 특성의 축적영역에서 산출한 LiNbO₃ 박막의 비유전율 값은 약 23 이었으며, ±5 V의 바이어스 범위 내에서의 메모리 윈도우는 약 1.2 V이었다. 이 MFIS 구조에서의 게이트 누설전류밀도는 ±500 kV/cm의 전계 범위 내에서 10/sup -9/ A/㎠ 범위를 유지하였다. 500 kHz의 바이폴러 펄스를 인가하면서 측정한 피로특성은 10/sup 11/ cycle 까지 초기값을 거의 유지하는 우수한 특성을 보였다.