• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.135-142
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• 1998

The performances of cutting process is mostly affected by the characteristics of closed loop system constructed with machine tool structure, work piece and tools. The chucking system is very important component in this system to hold work piece correctly in various static and dynamic load condition. Therefore, chucking force and accuracy must be considered carefully, from these reason, this paper describes the stability of chucking system which preserve high stiffness and accuracy of machine tool system.

• 한국정밀공학회지
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• 제18권3호
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• pp.40-46
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• 2001

An integrated analysis for the thermo-elastic deformation, fatigue, wear and brittle damage evolution of the shrink-fitted die with multi stress-ring of dissimilar materials is presented. A simple numerical algorithm for the moving elastic boundaries characterizing the contacts of the insert and multi stress-rings is presented. The initial stress distribution in the die due to shrink-fit is considered and the traction at the die surface contacting with the work piece is obtained by analyzing the elasto-plastic deformation of work piece. Elastic analysis of the separate-type die is performed and then the evolution of brittle damage, wear and fatigue life are predicted. This integrated analysis is applied to the extrusion die with two layers of stress-rings and the results are discussed in detail.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1998년도 제28회 추계학술대회
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• pp.272-277
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• 1998

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer(work piece) and pad(tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.

• Tribology and Lubricants
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• 제15권1호
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• pp.90-97
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• 1999

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CU process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer (work piece) and pad (tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 제3회 압연심포지엄 논문집 압연기술의 미래개척 (Exploitation of Future Rolling Technologies)
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• pp.78-87
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• 1999

A mathematical model for the stress free surface profile in Over-Round and Round-Oval grove rolling, which can be used effectively in the calculation of pass area, is presented. The new model has generality, simplicity and accuracy for practical usage. The stress free surface profile of an outgoing stock can be modeled when the maximum spread of it known a priori. The equation for the stress free surface profile is formulated from the linear interpolation of the radius of curvature of an incoming stock and that of roll groove to the axis direction. In developing the analytical model, the effect of rolling temperature and friction between roll and work piece(stock) were not considered since the geometry of roll groove and the incoming work piece were assumed a dominant factor which decides the stress free surface profile of the outgoing stock. A simulation with the analytical model developed also has been carried out to demonstrate the stress free surface profile of the outgoing stock.

• 한국정밀공학회지
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• 제17권1호
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• pp.179-184
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• 2000

Chemical Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active and abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves hydrodynamic behavior. The liquid slurry is trapped between the work piece and pad forming a hydrodynamic film. For the first step to understand material removal mechanism of the CMP process, the hydrodynamic analysis is done with semiconductor wafer. Three-dimensional Reynolds equation is applied to get pressure distribution of the slurry film. Shear stress distributions on the wafer surface are also analyzed

• 한국추진공학회지
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• 제3권1호
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• pp.55-64
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• 1999

대형 조선소에서는 선박에 사용하고 있는 수많은 부재들은 고가이고, 고급기술을 필요로 하는 WORK-STAT10N급에서 구동되는 선박전용프로그램 등에 의하여 부재생성 및 네스팅을 하고 있다. 그러나 중소형 조선소의 경제적, 기술적인 사정으로 고가의 장비와 고급인력의 확보가 어려운 실정이다. 따라서 본 연구에서는 널리 보급되어 있는 PC에서 사용 가능한 파라메트릭 매크로에 의한 부재생성과 부재의 네스팅 프로그램을 개발하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.150-152
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• 2003

This simulation was carried out to estimate the process time and to improve the operation efficiency. The subassembly process consists of piece arrangement, tack welding, robot welding, manual welding and the robot welding of them was the focus of the simulation. Robot welding stage was analyzed by UML and IDEFø method, and then it was represented as the three-dimensional model(simulator) based on the analysis. The output of this simulation was the cycle time for one day's work. The cycle time for the different torch and the different piece arrangement was investigated by the 3-dimensional simulation.

• 한국항해학회지
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• 제23권1호
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• pp.29-43
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• 1999

The production process of the compound-curved hull plates includes hull design, definition, fairing, modeling, lofting, cutting, and forming in sequence. Traditional fabrication methods and shop environment caused low level to productivity in medium and small sized shipyards. The most effective solution to solve those problems is to rationalize the layout of facilities. For the well-balanced development of domestic shipbuilding industry, it is urgently required to reduce the gap between modernized large sized shipyards and traditional small and medium sized shipyards in production technologies and efficiencies. For the efficient and accurate hull piece forming, all information from design to forming should be clarified and organized in a systematic manner. Thus, management of the information plays an important role in the computerized and automated of hull piece forming. The object of this paper is to survey the status of the field, to find out the feasibility and to introduce a draft of hull piece fabrication line for small and medium sized shipyards. The development of required system follows the object oriented technology to extend to simulation based system for carrying out physical product flow and facilities layout analysis. It is feasible to operate such a modernized facility for a group of small and medium shipyards who are unable to have each of their own facility because of its large amount of initial investment and insufficient work load.

• 대한조선학회 특별논문집
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• 대한조선학회 2011년도 특별논문집
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• pp.101-105
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• 2011

In most shipbuilding company, cutting procedure is proceed by cutting machine which run by CNC(Computer Numerical Code) data. In our cutting process, all CNC data is created by our nesting post processor system automatically. Among them, in case that cutting piece in the remnant plate, our system creates only one piece CNC data. Because remnant plate is not typical shape, and ship designers don't know remnant plate shape and quantity. In can happen some merit and good point if we modify 1:1 piece NC data by shorten cutting path, reducing cutting time or re-arrangement piece. For modifying cutting data, outside workers have to call to ship designer or have to go to NC control room where control the CNC system and cutting machine. It makes stop work process, and it waste time. In this paper, we introduce a program that can modify and replace 1:1 NC data with continuous or common NC data automatically.