• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1059-1060
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.1075-1076
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• 2010

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.5
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• pp.171-174
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• 2016

The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ($(CH_3)_4NOH$, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1069-1077
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• 2015

In tunnel excavation using blast, the wire saw rock cutting method generates a discontinuity perimeter around the center cut, and thus prevents blast vibration propagation to reduce vibration and noise. Therefore, the method is expected to be easy to use and economical compared with other methods. In this paper, the cutting mechanism of wire saw in tunnel excavation is investigated. A model describing the changes in cutting depth and wire saw shape inside a rock during cutting is established and validated for this purpose. Through a simulation using the model, the important characteristics of wire saw cut are investigated, and the influences of cutting conditions, such as wire saw tension, wire saw speed, feed speed, depth, and diameter of boring, on cutting performance are also examined. A method to improve the cutting performance is proposed based on the results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.31-32
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1033-1034
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.7-8
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.255-256
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• 2013

• Korean Journal of Materials Research
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• v.21 no.6
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• pp.334-340
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• 2011

Saw wires have been widely used in industries to slice silicon (Si) ingots into thin wafers for semiconductor fabrication. This study investigated the microstructural and mechanical properties, such as abrasive wear and tensile properties, of a saw wire sample of 0.84 wt.% carbon steel with a 120 ${\mu}M$ diameter. The samples were subjected to heat treatment at different linear velocities of the wire during the patenting process and two different wear tests were performed, 2-body abrasive wear (grinding) and 3-body abrasive wear (rolling wear) tests. With an increasing linear velocity of the wire, the tensile strength and microhardness of the samples increased, whereas the interlamellar spacing in a pearlite structure decreased. The wear properties from the grinding and rolling wear tests exhibited an opposite tendency. The weight loss resulting from grinding was mainly affected by the tensile strength and microhardness, while the diameter loss obtained from rolling wear was affected by elongation or ductility of the samples. This result demonstrates that the wear mechanism in the 3-body wear test is much different from that for the 2-body abrasive wear test. The ultra-high tensile strength of the saw wire produced by the drawing process was attributed to the pearlite microstructure with very small interlamellar spacing as well as the high density of dislocation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.83-90
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• 2018

This paper introduces a innovative diamond wire saw cutting technology and its experimental verification that can be utilized for cutting heavy structures. While conventional diamond wire saw cutting technologies such as water cooled cutting method and dry cutting method cause severe environmental problems due to generating massive concrete sludge or dust scattering, the proposed method can eliminate those problems considerably. Through extensive experiments using heavy structure test bed and real bridge pier structure, comprehensive analysis and comparative evaluation about various cutting methods were performed. As a result, the innovative diamond wire saw cutting method could achieve a similar cutting and cooling performance to the water cooled cutting method without generating concrete sludge and it showed an improved cutting and cooling performance to the dry cutting method without dust scattering. Consequently it is confirmed that the suggested cutting technology can be a promising environment-friendly alternative in the field of heavy structure dismantling.