• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.1075-1076
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1033-1034
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.31-32
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• 2012

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.59-64
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• 2018

In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.13-14
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.621-622
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.837-838
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• 2012

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.4_2
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• pp.675-682
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• 2020

Multi-wire sawing is the prominent technology employed to cut hard material ingots into wafers. This paper aimed to research the effect of diamond toughness index on the cutting performance of electroplated diamond wire. Three different toughness index of diamond abrasives were used to manufacture electroplated diamond wires. The cutting performance of electroplated diamond wire is verified through experiments, in which sapphire ingot are cut using single wire sawing machine. A single wire saw for constant load slicing is developed for the cutting performance evaluation of electroplated diamond wire. Choosing the cutting depth, total cutting depth, cutting force and wear of electroplated diamond wires as evaluation parameters, the performance of electroplated diamond wire is evaluated. The results of this study showed that there was a significant direct relationship between the toughness index of diamond abrasives and the cutting performance. Results demonstrated that diamond abrasive with a high toughness index showed higher cutting performance. However, all diamond abrasives showed similar cutting performance under low load conditions. The results of this paper are useful for the development of cutting large diameter ingots and cutting high hardness ingots at high speed.

• Journal of the Korean Institute of Gas
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• v.18 no.2
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• pp.10-15
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• 2014

In this paper, the displacement and stress strength safeties have been presented for cylindrical hollow rollers of a wire saw machine. Using the finite element method, the hollow roller with Y-shaped shift and vertical columns between three tubes has been developed to analyze the displacement behavior and stress strength safeties. For the same diameter and length of hollow roller models with a different weight, the displacement behavior safety of Y-shaped shift column and vertical column models is heavily depending on the total length of a hollow roller, which is closely related to the bending moment of a hollow roller structure. But, the stress strength of a hollow roller is more influenced by the cross sectional area of a hollow roller for the similar weight. Thus, this paper recommends Y-shaped hollow roller for increasing the roller strength safety and decreasing a total roller weight.