• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.22 no.4
• /
• pp.717-722
• /
• 2013

In this study, we investigated the design of a wire wedge bonding ultrasonic tool horn using finite element method (FEM) simulations. The proposed method is based on an initial design estimate obtained by FEM analysis. An ultrasonic excitation causes various vibrations of a transducer horn and capillary. A simulated ultrasonic transducer horn and resonator are then built and characterized experimentally using a laser interferometer and electrical impedance analyzer. The vibration characteristics and resonance frequencies close to the exciting frequency are identified using ANSYS. FEM analysis is developed to predict the resonance frequency of the ultrasonic horn and use it in the optimal design of an ultrasonic horn mode shape.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.54 no.7
• /
• pp.315-318
• /
• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• Journal of Sensor Science and Technology
• /
• v.25 no.3
• /
• pp.173-177
• /
• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• Journal of the Korean Wood Science and Technology
• /
• v.13 no.3
• /
• pp.3-26
• /
• 1985

The object of this study was to investigate the effects on physical and mechanical properties of wood particle and sawdust board combined with wire net. Conventional forming, press-lam, and veneer comply boards combining one to four wire net sheets were made from wood particle and sawdust with different spacings (8, 10, 12, and 18 Mok) and different wire diameters (0.35, 0.50, and 0.80mm) composing wire net. They were compared and analyzed statistically with specific gravity, thickness swelling, length swelling, bending properties (modulus of rupture, modulus of elasticity, work to proportional limit, and total work), internal bonding strength, and screw holding strength between wood particle and sawdust boards. The results obtained at this study as cording to the discussions might be concluded as follows; 1. In specific gravity, both particle and sawdust boards by press-lam method were higher than by conventional forming and veneer comply method, and the boards containing more wire net sheets also showed higher value. But the wire net spacings(Mok) had no influence on specific gravity. In general, particle board showed higher specific gravity than sawdust board. Veneer comply board showed lowest specific gravity values. 2. Both particle and sawdust boards by press-lam method was slightly lower than by conventional forming and veneer comply method in thickness swelling. The sawdust board containing 8, 12. and 18 Mok wire net showed lower thickness swelling than the corresponding particle board, but both sawdust and particle boards containing the T8 and 10 Mok wire net showed higher and similar thickness swelling. 3. Both particle and sawdust boards containing wire net showed no difference in MOR and MOE of bending. Comply board was the highest and particle board showed slightly higher than sawdust board in MOR and MOE values. 4. In work to proportional limit and total work in bending, both particle and sawdust boards containing thicker wire diameter and more wire net sheets showed higher value. From these facts, it is conceivable that boards with thicker wire diameter and more wire net sheets show increasing resistance against external force. But there was no significant difference between particle and sawdust borads. 5. In resistance against delamination (internal bonding strength), both sawdust and particle boards containing wire net showed lower value than control, and also showed decreasing tendency with more number of wire net sheet composed. Particle board showed higher resistance against delamination than sawdust board. 6. In screw holding strength, sawdust board containing thicker wire diameter and more wire net sheets showed higher value, but particle board by press-lam method was higher than by conventional forming and veneer comply method. Screw holding strength of particle board was higher than that of sawdust board.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2003.04a
• /
• pp.18-21
• /
• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.4
• /
• pp.221-225
• /
• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• Journal of the Korean Society for Precision Engineering
• /
• v.32 no.9
• /
• pp.799-805
• /
• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.34D no.2
• /
• pp.1-9
• /
• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.7 s.172
• /
• pp.137-145
• /
• 2005

A new design of contact detection algorithm is proposed for the z-axis of a wire bonder that interconnects between pads and leads in semiconductor manufacturing processes. Fast and stable contact detection of the z-axis is extremely important fer maintaining proper quality in the fine pitch gold wire bonding process, which has a small pad size of below 70um. The new method is based on a statistical approach and designed for the discrete Kalman filter. Real wire bonding experimental results are presented to demonstrate the advantages of the proposed algorithm.

• Proceedings of the Optical Society of Korea Conference
• /
• 2003.02a
• /
• pp.256-257
• /
• 2003

반도체 와이어 본딩(wire-bonding) 조립공정에 사용되는 검사용 현미경 광학계를 설계하였다. 이러한 와이어는 리드프레임에 대해 $\pm$ 1 mm의 단차를 가진다. 이 때 리드프레임은 6배로 관찰하며, 와이어 부분은 2배로 관찰하고자 한다. 그러나 와이어의 단차로 인해 물체거리가 변하게 되며, 일반 광학계로는 배율도 변하게 된다. 물체거리가 변해도 동일한 배율을 가지는 광학계를 설계하기 위해 유한 물점용 3군 줌 광학계를 목적에 맞게 변형시켰다. (중략)