• Title/Summary/Keyword: Wettablility

Search Result 4, Processing Time 0.025 seconds

A Study on the Surface Modification of Polyimide Film by lon Implantation (이온주입법에 의한 폴리이미드박막의 표면 개질에 대한 연구)

  • 김종택;이덕출
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.4
    • /
    • pp.293-297
    • /
    • 1998
  • The influence of ion implantation on surface properties of polymers was studied. We investigated microhardness, friction, wear and wettablility of polyimide. Energies of 50, 200keV were used with doses range from $1{\times}10^{13} to 1{\times}10^{16} [ions/cm^2]$. The implanted ion species were B, N and Ar. The microhardness of polyimide was increased after implantation for doses of $1{\times}10^{15}\; [ions/cm^2]$. A reduction of the friction coefficient was in most case correlated with a reduction of wear. The contact angles of water for $B^+,N^+$ implanted polyimide decreased from $76^{\circ}C$ to zero, as the fluencies increased at energies of 50 and 200 KeV. However, the contact angle of Ar ion implanted polyimide did not change under ambient room conditions even if the time elapsed. SEM measurement was performed to characterize the modified surface layer.

  • PDF

A multi Step Cure Process to Prevent Residual Bubbles in LED Encapsulation Silicone Resin (LED Encapsulation 실리콘의 기포잔류방지를 위한 Step 경화공정 연구)

  • Song, M.J.;Kim, H.K.;Yoon, G.S.;Kim, K.H.
    • Transactions of Materials Processing
    • /
    • v.21 no.2
    • /
    • pp.101-106
    • /
    • 2012
  • Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

Tribological Behavior of DLC Coatings at Various Humidities (습도에 따른 DLC 코팅의 마찰 거동)

  • Jo, Gyeong-Man;An, Hyo-Seok;Kim, Dae-Eun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.26 no.9
    • /
    • pp.1842-1848
    • /
    • 2002
  • Although DLC coatings have good tribological properties, these are dependant on the deposition method, the property of contact surface, and test condition. Humidity, which has little influence on tribological behavior in macro scale, is an important factor of tribological behavior in small devices like MEMS. The objective of this study is to investigate the tribological behavior of DLC coatings with particular attention to their wettability at various humidities. DLC coatings were deposited on Si substrates and tested using a reciprocating friction tester against Si$_3$N$_4$balls at various humidities. The results showed that the tribological behavior of DLC coatings was dependant on relative humidity and wettablility of DLC coatings. Friction coefficient at high relative humidity was higher thar that at low relative humidity. The tungsten-containing DLC coatings had a good wear resistance at low relative humidity whereas DLC coatings derived from argon(Ar)+cesium(Cs) gases showed a good wear resistance at high relative humidity.