• The Journal of Advanced Prosthodontics
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• 제5권3호
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• pp.248-255
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• 2013

PURPOSE. This study compared the effect of three intraoral repair systems on the bond strength between composite resin and zirconia core. MATERIALS AND METHODS. Thirty zirconia specimens were divided into three groups according to the repair method: Group I-CoJet$^{TM}$ Repair System (3M ESPE) [chairside silica coating with $30{\mu}m$ $SiO_2$ + silanization + adhesive]; Group II-Ceramic Repair System (Ivoclar Vivadent) [etching with 37% phosphoric acid + Zirconia primer + adhesive]; Group III-Signum Zirconia Bond (Heraus) [Signum Zirconia Bond I + Signum Zirconia Bond II]. Composite resin was polymerized on each conditioned specimen. The shear bond strength was tested using a universal testing machine, and fracture sites were examined with FE-SEM. Surface morphology and wettability after surface treatments were examined additionally. The data of bond strengths were statistically analyzed with one-way ANOVA and Tamhane post hoc test (${\alpha}$=.05). RESULTS. Increased surface roughness and the highest wettability value were observed in the CoJet sand treated specimens. The specimens treated with 37% phosphoric acid and Signum Zirconia Bond I did not show any improvement of surface irregularity, and the lowest wettability value were found in 37% phosphoric acid treated specimens. There was no significant difference in the bond strengths between Group I ($7.80{\pm}0.76$ MPa) and III ($8.98{\pm}1.39$ MPa). Group II ($3.21{\pm}0.78$ MPa) showed a significant difference from other groups (P<.05). CONCLUSION. The use of Intraoral silica coating system and the application of Signum Zirconia Bond are effective for increasing the bond strength of composite resin to zirconia.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.199-201
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• 2006

The wetting balance test was carried out to compare the wettability of Sn-Xwt%Cu($0{\sim}3$wt%) solders. And, IMCs which were formed at interface between solders and substrates were investigated by using XRD(x-ray diffractometer), SEM(scanning electron microscope) and EDS(energy dispersive spectroscope). The value of ${\gamma}_[fl}$ and(${\gamma}_{fs}-{\gamma}_{ls}$) had a tendency to increase with increasing wetting temperature. The activation energy that was calculated between the bare Cu substrate and flux was increased in the following order Sn-0.7wt%Cu(68.42 kJ/mol);Sn-3.0wt%Cu(72.66 kJ/mol);100wt%Sn solder(94.53 kJ/mol).

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• 한국재료학회지
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• 제31권8호
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• pp.427-432
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• 2021

This study uses silicone monomer, DMA, crosslinking agent EGDMA, and initiator AIBN as a basic combination to prepare hydrogel lenses using fluorine-based perfluoro polyether and iron oxide and zinc oxide nanoparticles as additives. After manufacturing the lens using iron oxide nanoparticles and zinc oxide nanoparticles, the optical, physical properties, and polymerization stability are evaluated to investigate the possibility of application as a functional hydrogel lens material. As a result of this experiment, it is found that the addition of the wetting material containing fluorine changes the surface energy of the produced hydrogel lens, thereby improving the wettability. Also, the addition of iron oxide and zinc oxide nanoparticles satisfies the basic hydrogel ophthalmic lens properties and slightly increases the UV blocking performance; it also increases the tensile strength by improving the durability of the hydrogel lens. The polymerization stability of the nanoparticles evaluated through the eluate test is found to be excellent. Therefore, it is judged that these materials can be used in various conditions as high functional hydrogel lens material.

• 한국산학기술학회논문지
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• 제9권2호
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• pp.311-316
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• 2008

Ag계 분말 삽입금속을 볼 밀링법으로 제조하였다. 밀링공정의 변수들은 밀링시간을 제외하고는 일정하게 하였고 밀링 시간은 24, 48, 72시간들로 정하였다. 밀링에 의해 제조된 삽입금속들은 SEM관찰, DSC분석, 퍼짐성, 젖음성 시험을 통해 평가하였다. 삽입금속들의 브레이징부 특성은 상용금속에 비하여 우수하였다. 48시간 동안 밀링한 삽입금속이 퍼짐성과 젖음 특성이 가장 우수한 조건임을 나타냈다. 또한 브레이징부는 작은 양의 기공을 포함하고 있지만 안정적인 미세조직을 보였고 미세경도는 138VHN으로 나타났다.

• 한국재료학회지
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• 제26권7호
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Journal of Welding and Joining
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• 제20권1호
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• pp.47-54
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• 2002

Powder type Ag system insert metals were manufactured by ball milling process. The variables of milling process such as milling media, revolution speed and powder/ball weight ratio were constant except the milling time. The milling times were selected for 24, 48 and 72 hours. The insert metals made by milling process were evaluated by performing scanning electron microscope, x-ray and DSC(differential scanning calorimetry) analysis, and further in terms of wettability test. The selected insert metals that have the good characteristics compared to commercial insert metals were applied to make the brazed joints of the steel/steel and the steel/WC superhard particles. The characterizations of those brazed joints were also conducted by microstructural observations, shear tensile tests and microhardness measurements. The results indicated that milling time of 48 hours for making powder type insert metals was the best condition showing the small amount of oxides residue, low wetting angle and stable microstructure. The brazed joints that applied the 48 hours milled insert metal were very sound condition indicating the shear tensile value of $2.29{\times}102$ MPa and the microhardness of 138VHN. Further, the amount of the porosity was appeared to be lower than that of the commercial insert metals.

• 한국안광학회지
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• 제16권3호
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• pp.255-264
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• 2011

목적: 인공눈물, 렌즈용 다목적 용액, 화장품, 근골격계 용제에 널리 사용되고 있는 히알루론산(hyaluronic acid, HA)의 콘택트렌즈의 습윤성과 착용감에 대한 효과를 알아보기 위해 HA가 첨가된 콘택트렌즈(+HA)와 HA가 첨가되지 않은 렌즈(-HA)를 임상 평가하여 비교하였다. 방법: 안질환이 없는 대학생 28명을 대상으로 하여 4주 동안 우안에는 HA가 첨가된 렌즈(+HA, With HA)를 좌안에는 HA가 첨가되지 않은 렌즈(-HA, Without HA)를 착용하여, 좌안을 대조군으로 우안을 비교하였다. 이 때, 렌즈 도수는 등가구면으로 처방하고, 자동굴절검사기를 이용해 덧댐굴절검사를 한 뒤 2주와 4주 동안 렌즈 착용 후 눈물검사, 전안부 검사, 피팅 용이성 평가, 표면 습윤성 검사, 설문조사를 시행하였다. 결과: 히알루론산이 첨가된 렌즈(+HA)가 -HA 렌즈보다 우수한 습윤성을 보였으며, 눈물량은 +HA 렌즈 착용자에서는 4주 동안 차이가 크지 않았지만, -HA 렌즈 착용자에서는 4주가 되면서 눈물량이 줄어드는 결과를 보였다. +HA와 -HA 렌즈 착용자의 충혈정도는 차이를 보이지 않았으며, 렌즈 피팅은 +HA 렌즈에서 용이한 것으로 나타났다. 설문조사 결과에서 착용감, 습윤감, 세척의 용이성과 건조감은 +HA 렌즈가 -HA 렌즈에 비해 우수한 결과를 보였으나, 충혈정도와 렌즈 취급성은 차이가 적은 것으로 나타났다. 결론: 히알루론산이 첨가된 소프트콘택트렌즈(+HA)는 HA가 첨가되지 않은 소프트콘택트렌즈(-HA)에 비해 렌즈착용에 따른 표면 습윤성을 높임으로써 착용감을 증진시키는 것으로 사료된다.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.25-30
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• 2015

직경 20 nm 미만의 금속 나노입자들이 나타내는 저온 용융특성을 이용한 새로운 패드 피니쉬 공정을 적용하여 Cu 표면을 SAC305로 코팅한 후 wettability의 변화를 평가하였다. SAC305 잉크를 사용한 $160^{\circ}C$의 저온 코팅공정 시 형성되는 SAC305 코팅층의 두께는 수 나노미터 수준으로 극히 얇았으며, 이 코팅층 밑으로 10~100 nm 두께 수준의 $Cu_6Sn_5$ 및 50~150 nm 두께 수준의 $Cu_3Sn$ 금속간화합물층 반응층이 생성되었음을 확인할 수 있었다. 즉, 생성된 금속간 화합물층의 두께는 압연동 시편에 비해 전해도금동 시편에서 훨씬 두꺼웠는데, 이는 전해도금동 시편에서 관찰되는 향상된 표면 거칠기 특성에 의해 단위면적 기준으로 보다 많은 수의 SAC305 나노입자들이 접촉된 상태에서 용융되어 반응하기 때문으로 분석되었다. 이후 SAC305 솔더볼을 사용한 젖음각 측정 실험에서 저온 SAC 코팅이 이루어진 Cu 표면은 SAC 코팅이 없는 Cu 표면에 비해 눈에 띄게 낮은 젖음각을 나타내어 당 코팅법으로 Cu 표면에 단지 수 나노미터 두께의 SAC305 층을 형성시킨 경우에서도 솔더의 wettability 개선을 유도할 수 있음을 확인할 수 있었다.