• Journal of the Korean Society for Precision Engineering
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• v.29 no.8
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• pp.896-905
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• 2012

Recently, the application of the plastic material to automotive components and structures has steadily increased to satisfy demands on the saving of overall weight and the improvement of energy efficiency. The objective of this paper is to investigate the development of a bumper back-beam using a thermoplastic olefin (TPO). The bumper back-beam was designed to be manufactured from the injection molding process. In order to obtain a proper design of the bumper back-beam, three-dimensional finite element analyses were performed for various design alternatives. Stress-strain curves for different strain rates were measured by high speed tensile tests of the TPO to consider strain rate effects in the FEA. The influence of the sectional shape and the rib formation on the contact force-intrusion curves, the deflection and the energy absorption rate of the bumper back-beam was examined. From the results of the examination, a proper design of the bumper back-beam was acquired. The bumper back-beam consisting of TPO was fabricated from the injection moulding process and the vibration welding. Pendulum crash tests were carried out using the fabricated bumper back-beam. The results of the tests showed that the designed bumper back-beam can satisfy requirements of the federal motor vehicle safety standard (FMVSS). Through the comparison of the previously designed bumper back-beam with the newly designed bumper back beam, it was noted that the weight of the designed bumper back-beam is lighter than that of the previously designed bumper back beam by nearly 16 %. In addition, it was considered that the newly designed bumper back beam can improve recycling of the bumper back-beam.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.42-52
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• 1995

In the evaluation of aging degradation on the structural materials based on the fracture mechanics, the detection and size prediction of defect are very important. Aiming at nondestructive detection and size prediction ol defect with high accuracy and resolution, therefore, an lnduced Current Focusing Potential Drop(ICFPD) technique has been developed. The principle of this technique is to induce a focusing current at an exploratory region by an induction wire flowing an alternating current(AC) that is a constant ampere and frequency. Defects are assessed with the potential drops that are measured the induced current on the surface of metallic material by the potential pick-up pins. In this study, the lCFPD technique was applied for evaluating the location and size of the surface crack and blind crack made in plate specimens, and also for detecting the defects existing in valve, a field component, that were developed by SCC etc. during the service. The results of this present study show that surface crack and blind crack are able to defect with potential drop. these cracks are distinguished with the distribution of potential drop, and the crack depths can be estimated with each normalized potential drop that are parameters estimating the depth of each type crack. In the field component, the defects estimated by experiment result correspond with those in the cutting face of the measuring point within a higher sensitivity.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.2
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• pp.158-162
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• 2004

Reliability of welded structures in power plant facilities is very important, and their reliability evaluation requires exact materials properties. But, the conventional PQR (Procedure Qualification Record) can hardly reflect the real material properties in the field because the test is only done on specimens with simulated welding. Therefore, a continuous indentation technique is proposed in this study for simple and non-destructive testing of in-field structures. This test measures the indentation load-depth curve during indentation and analyzes the mechanical properties such as the yield strength, tensile strength and work hardening index. This technique has been applied to evaluate the tensile properties of the weldment in the main steam pipe and hot reheater pipe in power plants under construction and in operation.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.10
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• pp.2596-2601
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• 2009

Gouging is defined as the removal of weld metal and base metal from the opposite of a partially welded joint to facilitate complete joint penetration. Since the work by current method needs skillful welding and grinding, there is a limit on the increase of operation efficiency. Noise and dust from the weld gouging also deteriorate the work place and cause environmental problems. In this study, the gouging work by cutting method is proposed to overcome the defects from weld gouging such as low productivity, severe noise, dense dust, and so on. The developed cutting gouging system removes material as much as $13,565mm^3/min$, and enlarge the labor productivity as three times compared to that by weld gouging method.

• Transactions on Electrical and Electronic Materials
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• v.17 no.2
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• pp.92-97
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• 2016

This paper presents design and simulation of wide band RF microswitch that uses electrostatic actuation for its operation. RF MEMS devices exhibit superior high frequency performance in comparison to conventional devices. Similar techniques that are used in Very Large Scale Integration (VLSI) can be employed to design and fabricate MEMS devices and traditional batch-processing methods can be used for its manufacturing. The proposed switch presents a novel design approach to handle reliability concerns in MEMS switches like dielectric charging effect, micro welding and stiction. The shape has been optimized at actuation voltage of 14-16 V. The switch has an improved restoring force of 20.8 μN. The design of the proposed switch is very elemental and primarily composed of electrostatic actuator, a bridge membrane and coplanar waveguide which are suspended over the substrate. The simple design of the switch makes it easy for fabrication. Typical insertion and isolation of the switch at 1 GHz is -0.03 dB and -71 dB and at 85 GHz it is -0.24 dB and -29.8 dB respectively. The isolation remains more than - 20 db even after 120 GHz. To our knowledge this is the first demonstration of a metal contact switch that shows such a high and sustained isolation and performance at W-band frequencies with an excellent figure-of merit (fc=1/2.pi.Ron.Cu =1,900 GHz). This figure of merit is significantly greater than electronic switching devices. The switch would find extensive application in wideband operations and areas where reliability is a major concern.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.89-96
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GTD-111 was investigated. Bonds were fabricated using a series of holding times(0-7.2ks) at three different temperatures(1403, 1418 and 1453K) under a vacuum of 13.3mPa. In raw material, ${\gamma}$- ${\gamma}$' eutectic phases, platelet η phases, MC carbide and PFZ were seen in interdendritic regions or near grain boundary and size of primary ${\gamma}$' precipitates near interdendritic regions were bigger than core region. The primary ${\gamma}$' precipitates in dendrite core were dissolved early in bonding process, but ${\gamma}$' precipitates near interdendritic regions were dissolved partially and shape changed. The dissolution rate increased with increasing temperature. Phases in interdendritic regions or near pain boundary continually changed with time at the bonding temperature. In the bonding temperature of 1403K, eutectic phases had not significantly changed, but η phases had transformed from platelet shape to needle morphology and PFZ region had widened with time. The interdendritic region and near pain boundary were liquated partially at 1423k and fully at 1453k by reaction of η phases and PFZ. In the bonding temperature of 1453K, interdendritic region and near pain boundary were liquated and then new phases which mixed with η phases, PFZ and MC carbide crystallized during cooling. Crystallized η phases transformed from rod shape to platelet shape with increasing holding time.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.4 no.3
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• pp.19-25
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• 1984

In the welded structure, the most dengerous section is welded parts and almost fractures of welded structure occur from welded parts. Accordingly, in other to prevents of fracture, it is important seeking the fracture behavior of welded parts. In this study as basic investigation of fracture behavior of welded parts, it is investigated that local distribution of fracture toughness and effect of multipass electrode welding, also effect of release of residual stress were investigated, as the subjected. material, the used steel having fatigue history and unused steel were selected. As the result of this study, it is dear that the base metal of unused steel and heat affected zone and weld metal are different each other in fracture toughness, and it seems clear that the weld metal may will become source of fracture because of it having the most low fracture toughness. Especially, in the case of crack occur in the used steel, it will be the most brittle section in the structure because of it having low fracture toughness then weld metal. It affirmation that, if welded parts has not flaw, the multi pass electrode welding effective to improve of fracture toughness, also release of residual stress is none effective to improve of fracture toughness in this study.