• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.257-257
• /
• 2010

디스플레이 산업의 발달로 화상 영상폰, 디지털 카메라, MP4, PMP, 네비게이션, LCD TV등의 가전 제품의 수요증가에 따라 이에 장착되는 LCD 패널의 생산력 향상과 원가 절감을 위한 검사 기술이 요구되고 있다. LCD 검사를 위한 Probe unit은 미세전기기계시스템(MEMS) 공정을 이용하여 제작된다. LCD 검사용 Probe unit는 LCD 가장자리 부분에 전기적 신호(영상신호, 등 기신호, 색상신호)가 인가되도록 하는 수 십 내지 수 백개의 접속 단자가 고밀도로 배치되는데, 이러한 LCD는 제품에 장착되기 전에 시험신호를 인가하여 화면의 불량여부를 검사하기 위한 점등용 부품으로 50 um 이하의 Pin간 거리를 유지하면서 정확한 Pin Alignment를 요구하는 초정밀 부품이다. 본 연구에서는 반도체용 Si wafer에 마스크 공정 및 slit etching 공정을 적용하여 목표인 30 um pitch의 Probe unit을 개발하기 위해 Deep Si Etching(DRIE) 장비를 이용하여 식각 공정에 따른 특성을 평가하였다. 마스크 공정은 500 um 두께의 양면 연마된 반도체용 Si wafer를 이용하였으며, thick PR을 사용하여 마스킹하여 식각공정을 수행하였다. Si 깊은 식각은 $SF_6$ 가스와 Passivation용으로 $C_4F_8$ 가스를 교대로 사용하여 수직방향으로 깊은 식각이 이루어지는 원리이다. SEM 측정 결과 30 um pitch의 공정 목표에 도달하였으며, 식각공정 결과 식각율 6.2 um/min, profile angle $89.1^{\circ}$로 측정되었다. 또한 상부 에칭공정과 이면 에칭공정에서 폭과 wall의 간격이 동일하였으며, 완전히 관통된 양면식각이 이루어졌음을 확인하였다. 또한 실제 사용되는 probe unit의 조립에 적합한 slit 공정을 위한 에칭특성을 조사하였다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.5 no.2
• /
• pp.128-131
• /
• 2004

In this study Bosch etching process repeating etch and deposition by STS-ICP ASEHR was evaluated. Fundamentally etch depth changes were affected by thickness of deposited PR, $SiO_2$ and depth, and pattern size on the substrate. However etch rates were observed to be changed by variable parameters such as platen power, coil power, and process pressure. Etch rate showed $1.2\mu{m}/min$ and sidewall profile showed $90\pm0.2^\circ$ with platen power 12W, coil power 500W, and etch/passivation cycle 6/7sec. It was confirmed that this result was very typical to Bosch process utilizing ICP.

• Journal of Institute of Control, Robotics and Systems
• /
• v.14 no.6
• /
• pp.519-522
• /
• 2008

As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

• Tribology and Lubricants
• /
• v.32 no.2
• /
• pp.61-66
• /
• 2016

Total thickness variation (TTV), BOW, and surface roughness are essential characteristics for high quality sapphire substrates. Many researchers have attempted to increase removal rate by controlling the key process parameters like pressure and velocity owing to the high cost of consumables in sapphire chemical mechanical polishing (CMP). In case of the pressure approach, increased pressure owing to higher deviation of pressure over the wafer leads to significant degradation of the TTV. In this study, the authors focused on reducing TTV under the high-pressure conditions. When the production equipment polishes multiple wafers attached on a carrier, higher loads seem to be concentrated around the leading edge of the head; this occurs because of frictional force generated by the combination of table rotation and the height of the gimbal of the polishing head. We believe the skewed pressure distribution during polishing to be the main reason of within-wafer non-uniformity (WIWNU). The insertion of a hub ring between the polishing head and substrate carrier helped reduce the pressure deviation. Adjusting the location of the hub ring enables tuning of the pressure distribution. The results indicated that the position of the hub ring strongly affected the removal profile, which confirmed that the position of the hub ring changes the pressure distribution. Furthermore, we analyzed the deformation of the head via finite element method (FEM) to verify the pressure non-uniformity over the contact area Based on experiment and FEM results, we determined the optimal position of hub ring for achieving uniform polishing of the substrate.

• Journal of the Korean Vacuum Society
• /
• v.20 no.5
• /
• pp.322-326
• /
• 2011

Etch process of silicon dioxide layer by using capacitively coupled plasma (CCP) is currently being used to manufacture semiconductor devices with nano-scale feature size below 50 nm. In typical CCP plasma etcher system, plasmas are generated by applying the RF power on upper electrode and ion bombardment energy is controlled by applying RF power to the bottom electrode with the Si wafer. In this case, however, etch results often drift due to heating of the electrode during etching process. Therefore, controlling the temperature of the upper electrode is required to obtain improvement of etch repeatability. In this work, we report repeatability improvement during the silicon dioxide etching under extreme process conditions with very high RF power and close gap between upper and bottom electrodes. Under this severe etch condition, it is difficult to obtain reproducible oxide etch results due to drifts in etch rate, critical dimension, profile, and selectivity caused by unexpected problems in the upper electrode. It was found that reproducible etch results of silicon dioxide layer could be obtained by controlling temperature of the upper electrode. Methods of controlling the upper electrode and the correlation with etch repeatability will be discussed in detail.

• Polymer(Korea)
• /
• v.28 no.4
• /
• pp.335-343
• /
• 2004

Carmustine (l,3-bis(2-chloroethyI)-1-nitrosourea, BICNU) used as antineoplastic drug for the treatment of brain tumor is not appropriate for the long term delivery, because it has short biological half life. Therefore, poly(D,L-lactide-co-glycolide) (PLGA) is useful as drug carrier for the long term delivery due to bulk erosion property. Glycolide monomer is applied to release of BICNU owing to non-toxic and monomeric components after biodegradation of PLGA. In this study, BICNU-loaded PLGA wafers with or without glycolide monomer were fabricated by conventional direct compression method for the sustained release of BICNU. These wafers were observed for their release profiles of BICNU and degradation rates by SEM, NMR, and GPC. Furthermore, we make multi-layer wafers and compare them with release profiles of conventional wafer. From these results, drug release of BICNU-loaded PLGA wafers was increased with increasing the glycolid monomer contents. We confirmed that glycolide monomer and BICNU contents in barrier-layer influenced the drug release profiles and degradation rate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.363-363
• /
• 2008

The development of dry etching process for sapphire wafer with plasma has been key issues for the opto-electric devices. The challenges are increasing control and obtaining low plasma induced-damage because an unwanted scattering of radiation is caused by the spatial disorder of pattern and variation of surface roughness. The plasma-induced damages during plasma etching process can be classified as impurity contamination of residual etch products or bonding disruption in lattice due to charged particle bombardment. Therefor, fine pattern technology with low damaged etching process and high etch rate are urgently needed. Until now, there are a lot of reports on the etching of sapphire wafer with using $Cl_2$/Ar, $BCl_3$/Ar, HBr/Ar and so on [1]. However, the etch behavior of sapphire wafer have investigated with variation of only one parameter while other parameters are fixed. In this study, we investigated the effect of pressure and other parameters on the etch rate and the selectivity. We selected $BCl_3$ as an etch ant because $BCl_3$ plasmas are widely used in etching process of oxide materials. In plasma, the $BCl_3$ molecule can be dissociated into B radical, $B^+$ ion, Cl radical and $Cl^+$ ion. However, the $BCl_3$ molecule can be dissociated into B radical or $B^+$ ion easier than Cl radical or $Cl^+$ ion. First, we evaluated the etch behaviors of sapphire wafer in $BCl_3$/additive gases (Ar, $N_2,Cl_2$) gases. The behavior of etch rate of sapphire substrate was monitored as a function of additive gas ratio to $BCl_3$ based plasma, total flow rate, r.f. power, d.c. bias under different pressures of 5 mTorr, 10 mTorr, 20 mTorr and 30 mTorr. The etch rates of sapphire wafer, $SiO_2$ and PR were measured with using alpha step surface profiler. In order to understand the changes of radicals, volume density of Cl, B radical and BCl molecule were investigated with optical emission spectroscopy (OES). The chemical states of $Al_2O_3$ thin films were studied with energy dispersive X-ray (EDX) and depth profile anlysis of auger electron spectroscopy (AES). The enhancement of sapphire substrate can be explained by the reactive ion etching mechanism with the competition of the formation of volatile $AlCl_3$, $Al_2Cl_6$ or $BOCl_3$ and the sputter effect by energetic ions.

• Journal of the Korean Vacuum Society
• /
• v.22 no.5
• /
• pp.238-244
• /
• 2013

Doping process using laser is an important process in fabrication of solar cell for heat treatment. However, the process of using the furnace is difficult to form a selective emitter doping region. The case of using a selective emitter laser doping is required an expensive laser equipment and induce the wafer's structure damage due to high temperature. This study, we fabricated a new costly plasma source. Through this, we research the selective emitter doping. We fabricated that the atmospheric pressure plasma jet injected Ar gas is inputted a low frequency (a few tens kHz). We used shallow doping wafers existing PSG (Phosphorus Silicate Glass) on the shallow doping CZ P-type wafer. Atmospheric plasma treatment time was 15 s and 30 s, and current for making the plasma is 40 mA and 70 mA. We investigated a doping profile by using SIMS (Secondary Ion Mass Spectroscopy) and we grasp the sheet resistance of electrical character by using doping profile. As result of experiment, prolonged doping process time and highly plasma current occur a deeper doping depth, moreover improve sheet resistance. We grasped the wafer's surface damage after atmospheric pressure plasma doping by using SEM (Scanning Electron Microscopy). We check that wafer's surface is not changed after plasma doping and atmospheric pressure doping width is broaden by increase of plasma treatment time and current.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.12
• /
• pp.1005-1008
• /
• 2009

In this study, adaptively coupled plasma (ACP) source was used for dry etching of $Al_2O_3$ thin film. During the etching process, the wafer surface temperature is an important parameter to influent the etching characteristics. Therefore, the experiments were carried out in ACP to measuring the etch rate, the selectivities of $Al_2O_3$ thin film to mask materials and the etch profile as functions of $Cl_2$/Ar gas ratio and substrate temperature. The highest etch rate of $Al_2O_3$ was 65.4 nm/min at 75% of $Cl_2/(Cl_2+Ar)$ gas mixing ratio. The etched profile was characterized using field effect scanning electron microscopy (FE-SEM). The chemical states of $Al_2O_3$ thin film surfaces were investigated with x-ray photoelectron spectroscopy (XPS).

• 제어로봇시스템학회:학술대회논문집
• /
• 2005.06a
• /
• pp.604-609
• /
• 2005

This paper presents an experimental study for optimizing the acceleration of AC servomotor using finite jerk (the first derivative of acceleration). The acceleration optimization with finite jerk aims at generating the smooth velocity profile of AC servomotor by experimentally minimizing vibration resulted from the initial friction of servomotor. The stick-slip motion of AC servomotor induced by initial friction can result in the positional errors that are not good for high-precision devices such as the assembly robot arms to be used in a 300mm wafer or a LCD (Liquid Crystal Display) stocker system. In this paper, experiments were made by using a PM (Permanent Magnet) type AC servomotor with MMC(R) (Multi Motion Controller) programmed in Visual C++(R). The experiments have been performed for finding the optimal duration time of finite jerk in terms of the minimization of vibration displacements when both the magnitude of velocity and the allowable acceleration are given. We have compared the proposed control with the conventional control with trapezoidal velocity profile by measuring vibration displacements. The effectiveness of the proposed control has been verified in that the experimental results showed the decrease of vibration displacement by about 24%.