Dry Etching of Al2O3 Thin Film by Cl2/Ar Plasma
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Yang, Xue
(중앙대학교 전자전기공학부)
Um, Doo-Seung (중앙대학교 전자전기공학부) Kim, Gwan-Ha (중앙대학교 전자전기공학부) Song, Sang-Hun (중앙대학교 전자전기공학부) Kim, Chang-Il (중앙대학교 전자전기공학부) |
1 | G. H. Kim, 'A study on the etching mechanism of high-k dielectric thin films in high density plasma', Doctoral Thesis, Chung-Ang University, 2007 |
2 |
D. P. Kim, J. W. Yeo, and C. I. Kim, 'Etching properties of |
3 | E. Gusev, V. Narayanan, and M. M. Frank, 'Advanced high-k dielectric stacks with polySi and metalgates: Recent progress and current challenges', IBM J. Res. Dev., Vol. 50, No. 4, p. 387, 2006 DOI ScienceOn |
4 |
W. F. A. Besling, E. Young, T. Conard, C. Zhao, R. Carter, W. Vandervorst, M. Caymax, S. De Gendt, M. Heyns, J. Maes, M. Tuominen, and S. Haukka, 'Characteristic of ALCVD |
5 |
T. W. Hickmott, 'Voltage-dependent dielectric breakdown and voltage-controlled negative resistance in anodized Al- |
6 | W. Y. Chung, S. R. Oh, J. H. You, K. T. Lim, Y. K. Oh, and N. H. Kim, 'Application of adaptively coupled plasma (ACP) source for dry etching', The 13th Korean Conference on Semiconductors, p. 909, 2006 |
7 |
Y. J. Sung, H. S. Kim, Y. H. Lee, J. W. Lee, S. H. Chae, Y. J. Park, and G. Y. Yeom, 'High rate etching of sapphire wafer using |
8 |
S. M. Koo, D. P. Kim, K. T. Kim, and C. I. Kim, 'The etching properties of |
9 |
S. J. Yun, A. Efremov, M. Kim, D. W. Kim, J. W. Lim, Y. H. Kim, C. H. Chung, D. J. Park, and K. H. Kwon, 'Etch characteristics of |
10 | Y. H. Kim and J. C. Lee, 'Reliability characteristics of high-k dielectrics', Microelectron Reliability, Vol. 44, No. 2, p. 183, 2004 DOI ScienceOn |
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