• Title/Summary/Keyword: WR-340 waveguide

Search Result 6, Processing Time 0.027 seconds

Development and spectroscopic characteristics of the high-power wave guide He Plasma (도파관식 고출력 헬륨 플라즈마의 개발과 분광학적 특성 연구)

  • Lee, Jong-Man;Cho, Sung-Il;Woo, Jin-Chun;Pak, Yong-Nam
    • Analytical Science and Technology
    • /
    • v.25 no.5
    • /
    • pp.265-272
    • /
    • 2012
  • Okamoto cavity was modified to generate high power (2.45 GHz, 2 kW) He, N2 and Ar plasmas with WR-340 waveguide. Many factors which influence to the plasma generation were optimized and investigated for the spectroscopic properties of the He plasma generated. Some of the important factors are the diameter of the inner conductor, the distance between the inner and outer conductors and the distance between the tip of the inner conductor and the torch. After optimization for the He, two torches (a commercial mini torch for ICP and a tangential flow torch made locally) were compared and showed similar results for the helium plasma gas flow of 25 L/min~30 L/min. A tall torch (extended) was used to block the air in-flow and reduced the background intensity at 340 nm region (NH band). Emission intensity was measured for determination of halogen element in the aqueous solution with power and carrier gas flow rate. Electron number density and the excitation temperature were on the order of $3.67{\times}10^{11}/cm^3$ and 4,350 K, respectively. These values are similar or a bit smaller than other microwave plasmas. It has been possible to analyze aqueous samples. The detection limit for Cl (479.45 nm) was obtained to be 116 mg/L and needs analytical optimization for the better performance.

Fabrication of Microwave PECVD with Linear Antenna for large-scale deposition processing, and Analysis of Ar plasma characteristics using Electrostatic Probe and Temperature Characteristics (대면적 증착용 선형 초고주파 플라즈마 장치 제작 및 정전 탐침법을 이용한 Ar 플라즈마 특성 분석과 온도 특성 분석)

  • Han, Moon-Ki;Seo, Kwon-Sang;Kim, Dong-Hyun;Lee, Ho-Jun
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.64 no.3
    • /
    • pp.422-428
    • /
    • 2015
  • A 2.45GHz microwave plasma source with a linear antenna has been developed for low temperature large scale deposition processing. Microwave power is transmitted through WR340 waveguide and a copper rod, linear antenna, is located in a quartz tube. The power matching is effectively achieved by a linear antenna is located at ${\lambda}_g/4$ or $3{\lambda}_g/4$ from the end of WR340 waveguide. The Ar plasma was generated along the surface of quartz tube and a clear standing wave pattern with nearly 10cm wavelength was observed at Ar pressure of 200mTorr and 200W input power. The electron density and electron temperature were investigated by using the electrostatic probe. The electron density and electron temperature were highly measured near the surface of quartz tube. Ar plasma density along the quartz tube is mostly uniform despite standing wave set-up and antenna of long length. A uniform temperature was measured at 10~40cm distance from the end quartz tube and 5cm distance from the surface of quartz tube.

Breakdown and Destruction Characteristics of the TTL IC by the Artificial Microwave (인위적인 전자파에 의한 TTL IC의 오동작 및 파괴 특성)

  • Hong, Joo-Il;Hwang, Sun-Mook;Huh, Chang-Su
    • Journal of the Korean Society of Safety
    • /
    • v.22 no.5
    • /
    • pp.27-32
    • /
    • 2007
  • We investigated the damage of the TTL ICs which manufactured five different technologies by artificial microwave. The artificial microwave was rated at a microwave output from 0 to 1000W, at a frequency of 2.45GHz. The microwave power was extracted into a standard rectangular waveguide(WR-340) and TTL ICs were located into the waveguide. TTL ICs were damaged two types. One is breakdown which means no physical damage is done to the system and after a reset the system is going back into function. The other is destruction which means a physical damage of the system so that the system will not recover without a hardware repair. TTL SN74S08N and SN74ALS08N devices get a breakdown and destruction occurred but TTL SN74LS08N, SN74AS08N and 74F08N devices get a destruction occurred. Also destructed TTL ICs were removed their surface and a chip conditions were analyzed by SEM. The SEM analysis of the damaged devices showed onchipwire and bondwire destruction like melting due to thermal effect. The tested results expect to be applied to the fundamental data which interprets the combination mechanism of the semiconductors from artificial microwave environment.

The Damage of Microcontroller Devices due to Coupling Effects by High Power Electromagnetic Wave (고출력 전자기파의 커플링 효과에 의한 마이크로컨트롤러 소자의 피해)

  • Hong, Joo-Il;Hwang, Sun-Mook;Huh, Chang-Su
    • Journal of the Korea Institute of Military Science and Technology
    • /
    • v.11 no.6
    • /
    • pp.148-155
    • /
    • 2008
  • We investigated the damage effects of microcontroller devices under high power electromagnetic(HPEM) wave. HPEM wave was radiated from the open-ended standard rectangular waveguide(WR-340) to free space. The influence of different reset-, clock-, data-, and power supply-line lengths has been tested. The susceptibility of the tested microcontroller devices was in general much influenced by clock-, reset-, and power supply-line length, little influenced by data-line length. Further the line length was increased, the malfunction threshold was decreased as expected, because more energy couples to the devices. The surfaces of the destroyed microcontroller devices were removed and the chip conditions were investigated with microscope. The microscopic analysis of the damaged devices showed component and bondwire destructions such as breakthroughs and melting due to thermal effects.

Microwave Electric Field and Magnetic Field Simulations of an ECR Plasma Source for Hyperthermal Neutral Beam Generation

  • Lee, Hui-Jae;Kim, Seong-Bong;Yu, Seok-Jae;Jo, Mu-Hyeon;NamGung, Won
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.501-501
    • /
    • 2012
  • A 2.45 GHz electron cyclotron resonance (ECR) plasma source with a belt magnet assembly configuration (BMC) was developed for hyperthermal neutral beam (HNB) generation. A plasma source for high flux HNB generation should be satisfied with the requirements: low pressure operation, high density, and thin plasma. The ECR plasma source with BMC achieved high density at low operation pressure due to electron confinement enhancement caused by high mirror ratio and drifts in toroidal direction. The 2.45 GHz microwave launcher had a circularly bended WR340 waveguide with slits. The microwave E-field profile induced by the microwave launcher was studied in this paper. The E-field profile was a cups field perpendicular to B-filed at ECR zone. The optimized E-field profile and B-field were found for effective ECR heating.

  • PDF

The Damage of Microcontroller Devices due to Coupling Effects under High Power Electromagnetic Wave by Magnetron (고출력 전자기파의 커플링 효과에 의한 마이크로 컨트롤러의 손상)

  • Hong, Joo-Il;Hwang, Sun-Mook;Huh, Chang-Su
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.57 no.12
    • /
    • pp.2263-2268
    • /
    • 2008
  • We investigated the malfunction and destruction characteristics of microcontroller devices under high power electromagnetic(HPEM) wave by magnetron. HPEM was rated at a microwave output of 0 to 1,000 W, at a frequency of 2,450${\pm}$50 MHz and was radiated from the open-ended standard rectangular waveguide(WR-340) to free space. The influence of different reset-, clock-, data-, and power supply-line lengths has been tested. The variation of the line length was done with flat cables. The susceptibility of the tested microcontroller devices was in general much influenced by clock-, reset-, and power supply-line length, little influenced by data-line length. Further the line length was increased, the malfunction threshold was decreased as expected, because more energy couples to the devices. The surfaces of the destroyed microcontroller devices were removed and the chip conditions were investigated with microscope. The microscopic analysis of the damaged devices showed component and bondwire destructions such as breakthroughs and melting due to thermal effects. The obtained results are expected to provide fundamental data for interpreting the combined mechanism of microcontroller devices in an intentional microwave environment.