• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.9
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• pp.801-810
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• 2014

In this paper, we will provide a way to grant a differentiated service rate that is according to priorities of WLP device and WUSB/DRD transfer mode by improving D-SoQ that considers existing QoS of WiMedia WSS environment based on UWB technology. The proposed method makes it possible to differentiate SoQ performance and throughput, based on priority of traffic streams.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.412-414
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• 2013

본 논문에서는 UWB 기술 기반 WiMedia WSS 환경에서 기존의 QoS를 고려한 D-SoQ 방식을 개선하여, WLP 디바이스와 WUSB/DRD 전송 모드의 우선순위에 따른 차등화 된 서비스 전송률을 부여하는 방식을 제안한다. 제안하는 방법은 트래픽 스트림의 우선순위에 따라 수율 및 SoQ 성능의 차등화를 가능하게 한다.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.1
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• pp.29-33
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• 2019

With shrinking form factor and improving performance of electronic packages, high input/output (I/O) density is considered as an important factor. Fan out wafer-level packaging (FO-WLP) has been paid great attention as an alternative. However, FO-WLP is vulnerable to warpage during its manufacturing process. Minimizing warpage is essential for controlling production yield, and in turn, package reliability. While many studies investigated the effect of process and design parameters on warpage using finite element analysis, they did not take uncertainty into consideration. As parameters, including material properties, chip positions, have uncertainty from the point of manufacturing view, the uncertainty should be considered to reduce the gap between the results from the field and the finite element analysis. This paper focuses on the effect of uncertainty of Young's modulus of chip on fan-out wafer level packaging warpage using finite element analysis. It is assumed that Young's modulus of each chip follows the normal distribution. Simulation results show that the uncertainty of Young's modulus affects the maximum von Mises stress. As a result, it is necessary to control the uncertainty of Young's modulus of silicon chip since the maximum von Mises stress is a parameter related to the package reliability.

• Journal of Korean Society on Water Environment
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• v.20 no.5
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• pp.397-408
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• 2004

Due to the growing impact of non-point source pollution and limitation of water treatment technology, a new policy of water quality management, called a source protection, is now becoming more important in drinking water supply. The source protection means that the public agency purchases the pollution sensitive area, such as riparian zone, and prohibit locations of point and non-point sources. Many studies have reported that this new policy is more economical in drinking water supply than the conventional one. However, it is very difficult to determine location and size of the pollution sensitive zone in the watershed. In this paper, we presented the scientific criteria for the priority of the pollution sensitive zone, along with a case study of the upstream watershed of the Paldang Reservoir, Han River. This study includes applications of the analytical hierarchy process(AHP) and a watershed-based land prioritization(WLP) model. After major criteria affecting water quality were selected, the AHP and geographic analysis were performed. The WLP model allowed us to include both quantity and quality criteria, using AHP as the multi-criteria method in making decision and reflecting local characteristics and various needs. By adding a travel-time function, which represents the prototype effectively, the results secured adaptability and scientific objectivity as well. As such, the WLP model appeared to provide reasonable criteria in determining the prioritization of land acquisition. If the tested data are used with a validated travel-time and AHP method is applied after further discussion among experts in such field, highly reliable results can be obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Animal Bioscience
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• v.35 no.7
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• pp.1021-1029
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• 2022

Objective: The study was aimed to investigate the rules of postprandial changes in intestine digesta dry matter (DM) flow and amino acid digestibility of growing pigs fed low-protein (LP) diets made of different starch. Methods: Eight barrows (28.8±2.1 kg) with a T-cannula at the distal ileum were randomly allotted to an 8×3 Youden square design. Treatments included: waxy corn starch LP (WLP); corn starch LP (CLP) and pea starch LP (PLP). Diets were given at 08:00 and 20:00. Digesta samples were collected in six 2-h stages from 08:00 to 20:00. Results: The Cr concentrations of ileal digesta increased and then decreased in WLP and CLP, while increased continuously in PLP as time passed after postprandial (p<0.05). Higher average Cr concentrations (0.78% and 0.84% vs 0.70%; p<0.05) and lower average DM flow (181.1 g/kg and 166.3 g/kg vs 240.3 g/kg; p<0.001) were observed in WLP and CLP, compared with PLP. The apparent ileal digestibility coefficient of most amino acids in WLP and CLP increased compared with that in PLP. No difference in lysine or methionine digestibility was observed. When digesta were collected in 2-h periods, the apparent ileal digestibility coefficient of amino acids did not change over time. When digesta was collected in 4-h periods from 16:00 to 20:00 and 6-h periods from 14:00 to 20:00 (p<0.05), WLP and CLP showed markedly higher amino acid digestibility than PLP Conclusion: High-amylose slowly digested starch can increase the DM flow at the distal ileum and reduce the apparent ileal digestibility coefficient of amino acids of pigs fed LP diets. Compared with waxy corn starch and corn starch, pea starch reduced the digestibility of amino acids in digesta collected after 4 h postprandial.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.23-34
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• 2005

Electronic interconnection and packaging is mainly performed in a planar, 2D design style. Further miniaturization and performance enhancement of electronic systems will more and more require the use of 3D interconnection schemes. Key technologies for realizing true 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnect with embedded die. Different applications require different complexities of 3D-interconnectivity. Therefore, different technologies may be used. These can be categorized as a more traditional packaging approach, a wafer-level-packaging, WLP ('above' passivation), approach and a foundry level ('below' passivation) approach. We define these technologies as respectively 3D-SIP, 3D-WLP and 3D-SIC. In this paper, these technologies are discussed in more detail.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.9
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• pp.20-29
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• 2008

WLP(WiMedia Logical link control Protocol) is a protocol to support IP services on the WiMedia UWB platform. It defines that DRP needs to be employed using TSPEC parameters when the packets from upper layer transmit with QoS. However, there is no appropriate means to provide QoS when the TSPEC of the traffic is unknown. In this paper, we propose TSPEC estimation scheme to provide QoS for such unknown applications by monitoring the traffic in realtime. Also, the scheme to estimate the effective TSPEC is proposed that compensate the packet losses in the wireless environment to provide the required QoS. The performances of the proposed TSPEC estimation schemes are evaluate by simulation assuming random wireless packet loss and 1mm-ACK mechanism.