• 한국표면공학회지
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• 제44권2호
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• pp.68-73
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• 2011

A Ni-W thin-film was synthesized by electrodeposition, and its corrosion resistance and electrical surface conductivity were investigated. Amount of tungsten in the Ni-W thin-film increased linearly with current density during the electrodeposition, and crack-free and low-crystalline Ni-21 at.%W coating layer was obtained. Corrosion resistances of the Ni-W thin-films were examined with an anodic polarization method and a storage test in a strong sulfuric acid solution. As a result, the Ni-21 at.%W thin-film exhibited the greatest corrosion resistance, and maintained the electrical surface conductivity even after the severe corrosion test, which could be applicable as a surface treatment for advanced metallic bipolar plates in fuel cell or redox flow battery systems.

• Progress in Superconductivity
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• 제6권1호
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• pp.64-68
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• 2004

We fabricated cube-textured Ni and Ni-W alloy substrates for coated conductors and characterized the effects of W addition on microstructure, mechanical strength, and magnetic properties of the substrate. Pure Ni and Ni-(2, 3, 5at.%)W alloys were prepared by plasma arc melting, heavily cold rolled and then annealed at various temperatures of $600-1300^{\circ}C$. The texture was evaluated by pole-figure and orientation distribution function (ODF) analysis. Mechanical properties were investigated by micro Vickers hardness and tension test. Ferromagnetism of the substrate was measured by physical property measurement system (PPMS). It was observed that Ni-W substrates had sharp cube texture, and the full-width at half-maximums (FWHMs) of in-plane texture was $^{\circ}$-5.57$4.42^{\circ}$, which is better than that of pure Ni substrate. In addition cube texture of Ni-W substrates was retained at higher temperature up to $1300^{\circ}C$. Microstructural observation showed that the Ni-W substrates had fine grain size and higher mechanical properties than the pure Ni substrate. These improvements are probably due to strengthening mechanisms such as solid solution hardening and/or grain size strengthening. PPMS analysis showed that addition of W effectively reduced saturation magnetization in applied magnetic field and Curie temperature.

• 한국표면공학회지
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• 제21권4호
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• pp.176-182
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• 1988

Effects of Cr, Ni and W on the anodic polarization behavior were investigated for Fe-Cr-Ni-W alloys in deaerated 1N HCI solution. Surface films formed on the polarization were analysed using AES, SEM and EDAX. A higerconcentration of tungten was found in the surface oxide film compared to the matrix. It played an importanet role on incresing the stability of the passive film. The presence of an adequate amount of Cr was essential to increase the pitting resistance of the alloys in acid chloride media. Under 12 wt%cr,alloys containing 6wt%W did not exhidit any passivity at all. The main role of Ni was to control the microstructure rather than to modify the corrosion resistance. In 23 cr-14Ni-^W alloy, the duplex microstructure of ferrite($\delta$-phase) in an austenic matrix was developed. The reson why proferred pitting appeared in austenite and ferrite/austenite interface was that ferrite had more amount of Cr and W than austenite.

• 한국분말재료학회지
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• 제8권1호
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• pp.26-34
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• 2001

In the present study, the effect of Ni content on densification and grain growth in Ni doped W compacts was investigated by using the dilatometric analysis. The Ni-doped W compacts with various amount of Ni activator from 0.02 to 0.4 wt％ were sintered in hydrogen atmosphere up to 140$0^{\circ}C$. As the amount of Ni and heating rates, the Ni-doped W compacts show a greatly different dilatometric behavior during the sintering. The sintered specimen was densified over 98％ of theoretical density by adding only 0.06 wt％ Wi in sub-micron W powder and the appropriate heating rate. It was also observed that the microstructure development strongly depended on the change of the Ni amount. In addition, it was found that the critical content of Ni showing large grain growth in microstructure was below 0.1 wt％.

• 한국자기학회지
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• 제6권6호
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• pp.382-387
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• 1996

본 연구에서는 ${(Ni_{x}Cu_{0.2}Zn_{0.8-x}O)}_{1-w}{(Fe_{2}O_{3})}_{1+w}$의 Ni 함량(x)과 $Co_{3}O_{4}$ 첨가량에 따른 복소투자율 변화에 관하여 검토하였다. Ni 함량 x=0.6 이상에서는 매우 좁은 투자율 허수항($\mu$") 피이크가 형성됨으로서 다른 조성에 비해 손실이 적음을 알 수 있었고 공명주파수($f_{\mu"max}$)는 Ni 함량의 변화와 비례하여 현저하게 증가하였다. $Fe_{2}O_{3}$ 결핍량(w)이 많을 수록 $\mu$" 값은 낮았으나, $Fe_{2}O_{3}$ 결핍량(w)의 변화가 공명주파수에는 큰 영향을 미치지 않는 경향을 나타내었다. NiCuZn 페라이트 조성에 대하여 $Co_{3}O_{4}$를 첨가한 경우는 첨가량이 많아짐에 따라 초기투자율이 감소하여 $f_{\mu"max}$ 값은 증가하였으나, 전체적인 손실의 정도를 제어하는데에는 Ni 함량을 변화시키는 것이 더 효과적임을 알 수 있었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.178-179
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• 2014

In this study, $Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electrodeposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano particles. The structure and microstructure ofcoatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on microstructure, microhardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.171-172
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• 2015

$Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electro-deposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano-particles. The structure and micro-structure of coatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on micro-structure, micro-hardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• 한국표면공학회지
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• 제44권1호
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• pp.1-6
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• 2011

A NiW functional alloy plating was investigated as variables of metal ion concentration, complexing agent, temperature, pH and applied current density. Even if numerous studies on reaction mechanism of NiW induced codeposition were carried out during couples of decade, it has not been acceptable reaction mechanism. This study was focused on the effect of the plating variables on the alloy composition in the NiW alloy plating. Applied current density could control mainly the alloy composition rather than other plating variables. It has also been confirmed that the functional alloy plating such as layered or gradient plating was possible by controlling applied current density.

• 한국표면공학회지
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• 제16권2호
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

• E2M - 전기 전자와 첨단 소재
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• 제3권4호
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• pp.325-331
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• 1990

본 연구는 텅스텐 소결에 저온 활성제로 작용하는 Ni-P 공정합금을 미량첨가하여 제조공정의 간단화를 통한 새로운 W-Cu계 전기접점제조를 목표로 하였다. 이를 위해 1회 용침공정을 통해 제조한 W(Ni-P)-Cu 합금에 대한 전기접점특성을 조사하여 접점의 미세구조 관점에서 논의하였다. Ni-P 합금첨가한 접점은 기존의 순수 W-Cu 합금에 비해 낮은 접촉저항 및 낮은 아크소모를 나타내는 우수한 접점성능을 보여주었다. 이것은 Ni-P합금이 Cu용침이 개시되기전 짧은 승온단계에서 분말간의 강한 결합과 Cu용침에 유리한 기공통로를 갖는 W 분말 골격체의 형성을 유도하기 때문인 것으로 판단된다.