• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.160-160
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• 2016

In this study, we applied the low temperature curing Ag paste to replace PVD System. The electrode formation of low temperature curing Ag paste for silicon Hetero-junction solar cells is important for improving device characteristics such as adhesion, contact resistance, fill factor and conversion efficiency. The low temperature curing Ag paste is composed various additives such as solvent, various organic materials, polymer, and binder. it depends on the curing temperature conditions. The adhesion of the low temperature curing Ag paste was decided by scratch test. The specific contact resistance was measured using the transmission line method. All of the Ag electrodes were experimented at various curing temperatures within the temperature range of $160^{\circ}C-240^{\circ}C$, at $20^{\circ}C$ intervals. The curing time was also changed by varying the conditions of 10-50min. In the optimum curing temperature $200^{\circ}C$ and for 20 min, the measured contact resistance is $19.61m{\Omega}cm^2$. Over temperature $240^{\circ}C$, confirmed bad contact characteristic. We obtained photovoltaic parameter of the industrial size such as Fill Factor (FF), current density (Jsc), open-circuit voltage (Voc) and convert efficiency of up to 76.2%, 38.1 mA/cm2, 646 mV and 18.3%, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.424-424
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• 2008

Dye-sensitized Solar Cell (DSC) is a new type of solar cell by using photocatalytic properties of $TiO_2$. The electric potential distribution in DSCs has played a major role in the operation of such cells. Models based on a built-in electric field which sets the upper limit for the open circuit voltage(Voc) and/or the possibility of a Schottky barrier at the interface between the mesoporous wide band gap semiconductor and the transparent conducting substrate have been presented. $TiO_2$ thin films were deposited on the FTO substrate by Nd:YAG Pulsed Laser Deposition(PLD) at room temperature and post-deposition annealing at $500^{\circ}C$ in flowing $O_2$ atmosphere for 1 hour. The structural properties of $TiO_2$ thin films have investigated by X-ray diffraction(XRD) and atomic force microscope(AFM). Thickness of $TiO_2$ thin films were controlled deference deposition time and measurement by scanning electron microscope(SEM). Then we manufactured a DSC unit cells and I-V and efficiency were tested using solar simulator.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.7
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• pp.571-574
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• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

• Current Photovoltaic Research
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• v.9 no.4
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• pp.128-132
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• 2021

Advances in screen printing technology have been led to development of high efficiency silicon solar cells. As a post PERx structure, an n-type wafer-based rear side TOPCon structure has been actively researched for further open-circuit voltage (Voc) improvement. In the case of the metal contact of the TOPCon structure, the poly-Si thickness is very important because the passivation of the substrate will be degraded when the metal paste penetrates until substrate. However, the thin poly-Si layer has advantages in terms of current density due to reduction of parasitic absorption. Therefore, poly-Si thickness and firing temperature must be considered to optimize the metal contact of the TOPCon structure. In this paper, we varied poly-Si thickness and firing peak temperature to evaluate metal induced recombination (Jom) and contact resistivity. Jom was evaluated by using PL imaging technique which does not require both side metal contact. As a results, we realized that the SiN_x deposition conditions can affect the metal contact of the TOPCon structure.

• Membrane Journal
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• v.21 no.3
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• pp.213-221
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• 2011

Using poly(ethylene oxide) (PEO) as a polymer host, poly(ethylene glycol) (PEG) as a plasticizer, potassium iodide and iodine as sources of $I^-/I_3^-$, polymer electrolyte membranes were prepared. Based on the polymer electrolytes, solid-state dye-sensitized solar cell (DSSC)s were fabricated. The content of PEG in the electrolyte was controlled to be 95%. The mole number of KI per 1 mole of EO ([KI]/[EO] ratio) in the electrolyte was changed to be 0.022, 0.044, 0.066 and 0.088. The electrolyte membrane showed wax phase in ambient temperature. The ionic conductivity increased with increasing KI content to reach the maximum value at which [KI]/[EO] ratio is 0.066. After the maximum value, the ionic conductivity decreased with increasing KI content. In the case of DSSC, the Voc decreased continuously with increasing KI content in the polymeric electrolyte membrane. The $J_{SC}$ increased with increasing KI content to show maximum value at which [KI]/[EO] ratio is 0.044. In the higher KI content region, $J_{SC}$ value decreased with increasing KI content.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.591-591
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• 2012

본 연구는 Transparent conducting oxide (TCO, 산화물투명전극)를 이용한 박막태양전지 효율향상에 관한 것으로, 이중의 TCO층(Double-stacked TCO layer)의 효과적인 광학 및 전기적 설계에 관한 것이다. 기존 박막 태양전지에서는 투명전극 TCO layer로서, ITO (Indium-Tin-Oxide), FTO (Fluorine- Tin-Oxide), 및 AZO(Aluminum-doped Zinc Oxide) 등을 사용해 왔다. 각 TCO layer마다 장점이 있지만 단점 또한 존재한다. ITO의 경우 높은 전기적 특성을 가지는 반면 수소 플라즈마에 취약하고 기계적 강도에 취약해 ITO 단일층만으로 박막 태양전지에 적용하는 것에 제한을 받는다. 한편, AZO의 경우 전기적 특성도 우수할 뿐만 아니라 수소 플라즈마에도 내구성이 강한 장점이 있지만, 일함수가 p형 반도체보다 낮아 Schottky junction이 되어, 높은 전위장벽이 형성된다. 이는 정공의 이동을 방해하고, 정공의 축적이 일어나서 순방향 전압을 인가할 때 많은 전류의 감소를 가져온다. 또한, AZO와 p형 반도체 사이의 높은 직렬저항으로 인해 광전압(Voc, Open circuit voltage)와 충실률 (FF, Fill factor)가 떨어진다는 단점이 있다. 본 실험에서는 ITO/AZO 2중구조의 TCO층을 적용하여 상기의 문제점을 해결하고자 한다. 이중 구조 TCO층은 Magnetron sputter system을 이용하여, 단계적으로 증착되었다. 빛이 입사하는 유리에 ITO를 제1전도층으로 증착하였는데, ITO는 입사광의 투과도와 전기전도성이 우수하다. 제2전도층으로는 AZO층을 이용하였으며, 실리콘 반도체층과 접하게 된다. AZO는 실리콘 증착시 발생하는 수소 플라즈마에 안정적이고, 물리적 강도 또한 우수한 장점이 있다. 이중 구조층위에 실리콘 광흡수층(Si absorber)을 증착하였으며, pin 구조를 가진다. 기존, 단일막 TCO층과 2중구조 TCO층을 이용하여, 실리콘 박막 태양전지를 구성하였다. 이때, ITO/AZO의 2중구조를 적용하였을 때 태양 전지 특성이 크게 향상된 결과를 얻을 수가 있었다. 특히, 전류밀도의 경우 ITO, FTO, AZO 각각 14.5 mA/cm2, 11.2 mA/cm2, 8.18 mA/cm2를 나타낸 반면 ITO/AZO 2중구조의 경우 약 17mA/cm2 로 크게 향상 되었고, 태양전지 변환 효율도 각각 7.5%, 6.9%, 4%에서 ITO/AZO 2중 구조의 경우 8.05%로 크게 향상되었다. 본 발표에서는 2중구조 TCO를 이용한 현공정에 적용 가능한 박막태양전지 효율향상 기법에 대해 논의하고자 한다.