• Title/Summary/Keyword: Viscoelastic analysis

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Theoretical Modeling of the Resonant Column Testing with the Viscosity of a Specimen Considered (점성을 고려한 공진주 실험의 이론적 모델링)

  • 조성호;황선근;권병성;강태호
    • Journal of the Korean Geotechnical Society
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    • v.19 no.4
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    • pp.145-153
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    • 2003
  • The resonant column testing determines the shear modulus and material damping factor dependent on the shear strain magnitude, based on the wave-propagation theory. The determination of the dynamic soil properties requires the theoretical formulation of the dynamic behavior of the resonant column testing system. One of the theoretical formulations is the use of the wave equation for the soil specimen in the resonant column testing device. Wood, Richart and Hall derived the wave equation by assuming the linear elastic soil, and didn't take the material damping into consideration. Hardin incorporated the viscoelastic damping of soil in the wave equation, but he had to assume the material damping factor for the determination of the shear modulus. For the better theoretical formulation of the resonant column testing, this study derived a new wave equation to include the viscosity of soil, and proposed an approach for the solution. Also, in this study, the equation of motion for the testing system, which is another approach of the theoretical formulation of the resonant column testing, was also derived. The equation of motion leads to the better understanding of the resonant column testing, which includes the dynamic magnification factor and the phase angle of the response. For the verification of the proposed equation of motion for the resonant column testing, the finite element analysis was performed for the resonant column testing. The comparison of the dynamic magnification factors and the phase angles far the system response were performed.

A Relation of Viscoelastic Properties to Empirical Properties of Korean Asphalt Binder (국내 아스팔트의 점탄성적 물성과 경험적 물성과의 관계)

  • Kim, Nam-Ho;Lee, Kwan-Ho
    • International Journal of Highway Engineering
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    • v.3 no.2 s.8
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    • pp.113-121
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    • 2001
  • Among the currently available binder specifications, Superpave Performance Grade asphalt specification is regarded as a superior specification on its theoretical background as well as pavement performance relationship. Many difficulties are expected; however, for Superpave implementation in Korea because of heavy burden of equipment cost as well as lack of trained personnel in asphalt industry, which may too much barrier to overcome in Korean situation. As an effort to improve qualify of asphalt binder, recently, people discuss about a possibility of constituting a performance-based asphalt specification using rather easy-to-measure asphalt properties. The objective of this paper is to determine the possibility of constituting a performance-based asphalt specification using an empirical asphalt properties, such as penetration ring and ball softening point rather than using fundamental properties of asphalt. Nine straight asphalts, that covers entire straight asphalt from all Korean refineries, and eighteen modified asphalts that were modified from two modifiers were included in the study. An analysis was made through a comparison between empirical properties and Superpave PG criteria. This study concluded that it may possible to constitute a pseudo-Superpave-like specification using an empirical asphalt properties as a specification criteria. Therefore, more systematic research is needed to constitute the asphalt specification.

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SLUMPING RESISTANCE AND VISCOELASTICITY OF RESIN COMPOSITE PASTES (치과용 복합레진의 중합 전 slumping resistance와 점탄성)

  • Suh, Hee-Yeon;Lee, In-Bog
    • Proceedings of the KACD Conference
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    • 2008.05a
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    • pp.235-245
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    • 2008
  • The aim of this study was to develop a method for measuring the slumping resistance of resin composites and to relate it to the rheological characteristics. Five commercial hybrid composites (Z100. Z250. DenFil, Tetric Ceram. ClearFil) and a nanofill composite (Z350) were used to make disc-shaped specimens of 2 mm thickness. An aluminum mold with square shaped cutting surface was pressed onto the composite discs to make standardized imprints. The imprints were light-cured either immediately (non-slumped) or after waiting for 3 minutes at $25^{\circ}C$ (slumped). White stone replicas were made and then scanned for topography using a laser 3-D profilometer. Slumping resistance index (SRI) was defined as the ratio of the groove depth of the slumped specimen to that of the non-slumped specimen. The pre-cure viscoelasticity of each composite was evaluated by an oscillatory shear test and normal stress was measured by a squeeze test using a rheometer. Flow test was also performed using a flow tester. Correlation analysis was performed to investigate the relationship between the viscoelastic properties and the SRI. SRI varied between the six materials (Z100 < DenFil < Z250 < ClearFil < Tetric Ceram < Z350). The SRI was strongly correlated with the viscous (loss) shear modulus G' but not with the loss tangent. Also. slumping resistance was more closely related to the resistance to shear flow than to the normal stress. Slumping tendency could be quantified using the imprint method and SRI. The index may be applicable to evaluate the clinical handling characteristics of composites.

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SLUMPING RESISTANCE AND VISCOELASTICITY OF RESIN COMPOSITE PASTES (치과용 복합레진의 중합 전 slumping resistance와 점탄성)

  • Suh, Hee-Yeon;Lee, In-Bog
    • Restorative Dentistry and Endodontics
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    • v.33 no.3
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    • pp.235-245
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    • 2008
  • The aim of this study was to develop a method for measuring the slumping resistance of resin composites and to relate it to the rheological characteristics. Five commercial hybrid composites (Z100, Z250, DenFil, Tetric Ceram, ClearFil) and a nanofill composite (Z350) were used to make disc-shaped specimens of 2 mm thickness. An aluminum mold with square shaped cutting surface was pressed onto the composite discs to make standardized imprints. The imprints were light-cured either immediately (non-slumped) or after waiting for 3 minutes at $25{\circ}C$ (slumped). White stone replicas were made and then scanned for topography using a laser 3-D profilometer. Slumping resistance index (SRI) was defined as the ratio of the groove depth of the slumped specimen to that of the nonslumped specimen. The pre-cure viscoelasticity of each composite was evaluated by an oscillatory shear test and normal stress was measured by a squeeze test using a rheometer. Flow test was also performed using a flow tester. Correlation analysis was performed to investigate the relationship between the viscoelastic properties and the SRI. SRI varied between the six materials (Z100 < DenFil < Z250 < ClearFil < Tetric Ceram < Z350). The SRI was strongly correlated with the viscous (loss) shear modulus G' but not with the loss tangent. Also, slumping resistance was more closely related to the resistance to shear flow than to the normal stress. Slumping tendency could be quantified using the imprint method and SRI. The index may be applicable to evaluate the clinical handling characteristics of composites.

Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly (유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석)

  • Lee, Jae Hak;Song, Jun-Yeob;Kim, Seung Man;Kim, Yong Jin;Park, Ah-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.2
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    • pp.31-43
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    • 2019
  • In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

ViscoElastic Continuum Damage (VECD) Finite Element (FE) Analysis on Asphalt Pavements (아스팔트 콘크리트 포장의 선형 점탄성 유한요소해석)

  • Seo, Youngguk;Bak, Chul-Min;Kim, Y. Richard;Im, Jeong-Hyuk
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.28 no.6D
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    • pp.809-817
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    • 2008
  • This paper deals with the development of ViscoElastic Continuum Damage Finite Element Program (VECD-FEP++) and its verification with the results from both field and laboratory accelerated pavement tests. Damage characteristics of asphalt concrete mixture have been defined by Schapery's work potential theory, and uniaxial constant crosshead rate tests were carried out to be used for damage model implementation. VECD-FEP++ predictions were compared with strain responses (longitudinal and transverse strains) under moving wheel loads running at different constant speeds. To this end, an asphalt pavement section (A5) of Korea Expressway Corporation Test Road (KECTR) instrumented with strain gauges were loaded with a dump truck. Also, a series of accelerated pavement fatigue tests have been conducted at pavement sections surfaced with four asphalt concrete mixtures (Dense-graded, SBS, Terpolymer, CR-TB). Planar strain responses were in good agreement with field measurements at base layers, whereas strains at both surface and intermediate layers were found different from simulation results due to the complexity of tire-road contact pressures. Finally, fatigue characteristics of four asphalt mixtures were reasonably described with VECD-FEP++.

Phosphate Concentration Dependent Degradation of Biofilm in S. aureus Triggered by Physical Properties (인산염 농도에 따른 물성 변화로 발생하는 황색포도상구균 바이오필름 제거 현상)

  • Song, Sang-Hun;Hwang, Byung Woo;Son, Seong Kil;Kang, Nae-Gyu
    • Journal of the Society of Cosmetic Scientists of Korea
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    • v.47 no.4
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    • pp.361-368
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    • 2021
  • The objective of this study was to establish technology for removing bacteria with human- and eco-friendly material. Staphylococcus aureus as an important component for balanced equilibrium among microbiomes, was cultured under various concentrations of phosphate. Experimental observation relating to physical properties was performed in an addition of phosphate buffer. Statistically minimum value of size and hardness using atomic force microscope was observed on the matured biofilm at 5 mM concentration of phosphate. As a result of absorbance for the biofilm tagged with dye, concentration of biofilm was reduced with phophate, too. To identify whether this reduction by phosphate at the 5 mM is caused by counter ion or not, sodium chloride was treated to the biofilm under the same condition. To elucidate components of the biofilm counting analysis of the biofilm using time-of-flight secondary ion mass spectrometry was employed. The secondary ions from the biofilm revealed that alteration of physical properties is consistent to the change of extracellular polymeric substrate (EPS) for the biofilm. Viscoelastic characterization of the biofilm using a controlled shear stress rheometer, where internal change of physical properties could be detected, exhibited a static viscosity and a reduction of elastic modulus at the 5 mM concentration of phosphate. Accordingly, bacteria at the 5 mM concentration of phosphate are attributed to removing the EPS through a reduction of elastic modulus for bacteria. We suggest that the reduction of concentration of biofilm induces dispersion which assists to easily spread its dormitory. In conclusion, it is elucidated that an addition of phosphate causes removal of EPS, and that causes a function of antibiotic.