• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.117-123
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• 2014

Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.

• Journal of the Korean Graphic Arts Communication Society
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• v.24 no.1
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• pp.35-44
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• 2006

본 연구에서는 PCB에 진공인쇄 방식이 적용된 스크린 인쇄방법을 이용하여 Pattern 및 Hole충전의 신뢰성을 향상시킬 수 있는 기술을 적용하였다. 새로운 dry process 기술인 직접회로 인쇄 기술은 일반적으로 사용되고 있는 wet process 중 도금, 에칭, 박리 등의 공정을 줄일 수 있어 제조원가, 공정 리드타임 감소, 폐기물 감소로 환경 친화적 공정이라고 할 수 있다. 직접회로 인쇄는 진공도 100 Pa, 인쇄압력 0.45 MPa, 인쇄 속도 30 mm/sec, 인쇄각도 85도, 스크린 마스크와 기판 사이의 Gap 2 mm에서 인쇄될 때 가장 좋은 결과를 보였다. 직접회로 인쇄에 사용된 인쇄기는 일반 PCB공정에서 사용되는 동일한 형태에 진공조건을 유지시킬 수 있도록 개선하여 사용하였다.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.73-79
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• 2008

Atomization speed of diesel fuel injected from 8-hole nozzle is faster than that of 7-hole nozzle because the hole diameter of 8-hole nozzle is smaller than that of 7-hole nozzle. But both insufficient distance between the fuel sprays and short penetration of injected sprays through 8-hole nozzle hole cause many harmful effects on combustion. In this study, we installed the 8-hole injectors to diesel 2.0 liter class engine, and optimized in-cylinder swirl and penetration via selecting and matching proper cylinder head and combustion bowl. Through this process, we found out the performance and emission potential of 8-hole nozzle installed engine are better than those of 7-hole nozzle installed one.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38B no.9
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• pp.715-721
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• 2013

Minimization techniques are adaptations of Helical structure, Meta material, multi-layer structure etc. But, Helical structure is not suited to minimization technique of RF circuit having single resonant frequency. Because it generate resonant frequency following as rotation of circumference. Meta material and multi layer structure have weakness of expenditure and complex structure. In addition, conventional three dimensional M$\ddot{o}$bius Strip and planar M$\ddot{o}$bius Strip are not two dimensional planar M$\ddot{o}$bius Strip that has weakness of electrical coupling effect. Therefore, in this paper, we proposed miniaturized and reduced electrical coupling effect antenna by adaptation of Quasi M$\ddot{o}$bius Strip that topology is same as three dimensional M$\ddot{o}$bius Strip with Via-Hole structure. According to the simulation result, physical circumferential length is 1/3 minimized compared with conventional ring antenna under the same resonant frequency. In addition, coupling effect is not nearly generates near to the resonant frequency, 2.4GHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.4 s.334
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• pp.45-52
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• 2005

This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias.

• International Journal of Automotive Technology
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• v.7 no.3
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• pp.283-288
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• 2006

A mathematical methodology is proposed for designing nozzle hole shapes producing controlled geometric cavitation. The proposed methodology uses an unstructured RANS flow solver, with the ability to compute sensitivity derivatives via an adjoint algorithm. The adjoint formulation for the N-S equations is presented while variation of the turbulence viscosity is not taken into account during the geometry modifications. The sensitivities are calculated in a mode independently of the shape parameterisation. The method is used to develop and evaluate conceptual shapes for nozzle hole cavitation reduction. The localized region at the hole inlet producing cavitation, is parameterised using its radius of curvature, while a cost function is formulated to eliminate the negative pressures present at this location. Sensitivity derivatives are used to assess the dependence of the localized region on the minimum pressure, and to drive the geometry to the targeted shape. The results show that the computer model can provide nozzle hole entry shapes that produce predefined flow characteristics, and thus can be used as an inverse design tool for nozzle hole cavitation control.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.60-60
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• 1994