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Extraction of Electrical Parameters for Single and Differential Vias on PCB  

Chae Ji Eun (Dept. of Electronic & Electrical Engineering POSTECH)
Lee Hyun Bae (Dept. of Electronic & Electrical Engineering POSTECH)
Park Hon June (Dept. of Electronic & Electrical Engineering POSTECH)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.42, no.4, 2005 , pp. 45-52 More about this Journal
Abstract
This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias.
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