• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.187-188
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.743-744
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• 2008

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.149-156
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• 2017

Graphene nanoplatelet (GNP)-reinforced alumina ($Al_2O_3$) is a promising material for micro-partapplications, particularly micro-nozzle shapes, because of its excellent wearresistance. In this study, a $Al_2O_3$/GNPcomposite with 15 vol% graphene nanoplatelets (GNP) was highly densified and fabricated via spark plasma sintering for micro-electrical discharge drilling (Micro-ED drilling) and the wear resistance property of the composite is evaluated via the ball-on-disk method. In addition, the diameter and shape of the micro-electrodes machined by wire electrical discharge grinding (WEDG), block electrical discharge grinding (BEDG), and new linear block moving electrical discharge grinding (LBMEDG) methods are systematically compared and analyzed to observe the micro-hole machining in the micro-ED drilling of the $Al_2O_3$/15vol% GNP composite.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.55-67
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• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Composites Research
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• v.24 no.4
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• pp.23-28
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• 2011

Recently CFRP laminate joints process by bolts and nets are developed rapidly in aircraft industries. However, there are serious drawback during jointing process. Many hole processes are needed for the manufacturing and structural applications using composite materials. Generally, very durable polycrystalline crystalline diamond (PCD) drill has been used for the CFRP hole process. However, due to the expensive price and slow process speed, chemical vapor deposition (CVD) diamond drill has been used increasingly which are relatively-low durability but easily-adjustable process speed via drill shape change and price is much lower. In this study, the comparison of hole process between PCD and CVD diamond coated drills was done. First of all, CFRP hole processbility was evaluated using the equations of hole processing conditions (feed amount per blade, feed speed). The comparison on thermal damage occurring from the CFRP specimen was also studied during drilling process. Empirical equation was made from the temperature photo profile being taken during hole process by infrared thermal camera. In addition, hole processability was compared by checking hole inside condition upon chip exhausting state for two drills. Generally, although the PCD can exhibit better hole processability, hole processing speed of CVD diamond drill exhibited faster than PCD case.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.