• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.9-13
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• 2006

COF에 사용되는 구리배선은 폴리이미드 필름에 subtractive 방법을 이용하여 만들어지고 있으나 선폭이 작아짐에 따라 subtractive 방법은 폭방향으로 에칭 현상으로 인하여 사용에 제한이 되고 있다. Semi-additive 방법은 리소그래피 공정과 전기도금범을 사용하여 구리배선을 만드는 방법으로 $10-40{\mu}m$의 좁은 선폭에 대한 연구를 하였다. AZ4620과 PMER900의 두꺼운 PR을 사용하였으며 전기도금법을 이용하여 구리 배선을 형성하였다. 기존의 용액은 높은 잔류응력으로 인하여 구리도금층에 crack이 발생하였으며 via filling에 사용된 도금액을 사용한 경우 잔류응력이 낮아서 crack이 없는 구리배선을 얻을 수 있었다. 기지층의 에칭시 배선의 폭방향으로의 에칭 현상은 관찰되지 않았다.

• Journal of Electrochemical Science and Technology
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• 제7권3호
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• pp.234-240
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• 2016

The effect of initial electrolyte loading (IEL) on cell performance in a coin-type molten carbonate fuel cell (MCFC) was investigated in this work. Since the material of MCFC depends on the manufacturer, optimisation requires experimental investigation. In total, four IEL values, 1.5, 2.0, 3.0, and 4.0 g, were used, corresponding to a pore filling ratio (PFR) of 38, 51, 77, and 102%, respectively. The cell performance with respect to the PFR was analysed via steady-state polarisation, step-chronopotentiomtery, and impedance methods. The electrochemical analyses revealed that internal resistance and overpotential of the cell decreased with increasing PFR, and a large overpotential was observed when the PFR was 102%, probably due to the flooding phenomenon. After operation, cross-section of the cell was analysed via surface analysis of SEM and EDS methods, and the remaining electrolyte was estimated by dissolution of the cell in 10 wt% acetic acid. A linear relationship between IEL and the weight reduction ratio by dissolution was obtained. Thus, the remaining amount of electrolyte could be measured after operation. The results of SEM and EDS showed that a PFR of 38 and 102% showed a lack and flooding of electrolytes at the cell, respectively, which led to a large overpotential. This work reports that MCFC performance is allowed only in the narrow range of PFR.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.7-14
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• 2015

Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

• Structural Engineering and Mechanics
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• 제55권5호
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• pp.979-999
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• 2015

This paper proposes a novel reliability analysis method which computes reliability index, most probable point and probability of failure of uncertain systems more efficiently and accurately with compared to Monte Carlo, first-order reliability and response surface methods. It consists of Initial and Simulation steps. In Initial step, a number of space-filling designs are selected throughout the variables space, and then in Simulation step, performances of most of samples are estimated via interpolation using the space-filling designs, and only for a small number of the samples actual performance function is used for evaluation. In better words, doing so, we use a simple interpolation function called "reduced" function instead of the actual expensive-to-evaluate performance function of the system to evaluate most of samples. By using such a reduced function, total number of evaluations of actual performance is significantly reduced; hence, the method can be called Reduced Function Evaluations method. Reliabilities of six examples including series and parallel systems with multiple failure modes with truncated and/or non-truncated random variables are analyzed to demonstrate efficiency, accuracy and robustness of proposed method. In addition, a reliability-based design optimization algorithm is proposed and an example is solved to show its good performance.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.261-278
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• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• 멤브레인
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• 제26권4호
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• pp.310-317
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• 2016

리튬이온 이차전지는 리튬이온이 이동하면서 전기화학적 충방전사이클을 완성하는 에너지변환장치를 의미한다. 리튬이온 이차전지는 높은 에너지밀도와 낮은 자가방전률, 상대적으로 긴 수명주기 등 다양한 장점을 갖는다. 최근 전기차 수요증가는 고용량 리튬이온 이차전지 개발을 촉진하고 있으나 음극에서의 dendrite 형성으로 인한 전기적 단락 현상과 전지 폭발 문제와 같은 심각한 안전문제를 야기한다. 또한, 리튬이온 이차전지 구동시 상승된 온도에서 폴리올레핀계열(예 : 폴리에틸렌과 폴리프로필렌) 격리막의 열수축 문제가 발생한다. 이와 같이 낮은 열 안정성은 리튬이온 이차전지의 성능과 수명의 감소로 이어진다. 본 연구에서는 폴리올레핀계열 함침격리막 제조를 위한 중요한 소재로서 술폰화 폴리아릴렌에테르술폰 랜덤 공중합체를 사용하였으며, 제조된 격리막을 이용하여 dendrite 형성과 관련된 금속이온 흡착 능력과 리튬이온전도성, 열적 내구성이 평가되었다.

• Advances in nano research
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• 제15권4호
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• pp.339-353
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• 2023

This work aims to present a solution for the buckling behavior of perforated nano/microbeams with deformable boundary conditions using nonlocal strain gradient theory (NLSGT). For the first time, a solution that can provide buckling loads based on the non-local and strain gradient effects of perforated nanostructures on an elastic foundation, while taking into account both deformable and rigid boundary conditions. Stokes' transformation and Fourier series are used to realize this aim and determine the buckling loads under various boundary conditions. We employ the NLSGT to account for size-dependent effects and utilize the Winkler model to formulate the elastic foundation. The buckling behavior of the perforated nano/microbeams restrained with lateral springs at both ends is studied for various parameters such as the number of holes, the length and filling ratio of the perforated beam, the internal length, the nonlocal parameter and the dimensionless foundation parameter. Our results indicate that the number of holes and filling ratio significantly affect the buckling response of perforated nano/microbeams. Increasing the filling ratio increases buckling loads, while increasing the number of holes decreases buckling loads. The effects of the non-local and internal length parameters on the buckling behavior of the perforated nano/microbeams are also discussed. These material length parameters have opposite effects on the variation of buckling loads. This study presents an effective eigenvalue solution based on Stokes' transformation and Fourier series of the restrained nano/microbeams under the effects of elastic medium, perforation parameters, deformable boundaries and nonlocal strain gradient elasticity for the first time.

• Korean Journal of Radiology
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• 제22권3호
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• pp.395-404
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• 2021

Objective: To compare the utility of computed tomography perfusion (CTP) and three different 4-point scoring systems in computed tomography angiography (CTA) in confirming brain death (BD) in patients with and without skull defects. Materials and Methods: Ninety-two patients clinically diagnosed as BD using CTA and/or CTP for confirmation were retrospectively reviewed. For the final analysis, 86 patients were included in this study. Images were re-evaluated by three radiologists according to the 4-point scoring systems that consider the vessel opacification on 1) the venous phase for both M4 segments of the middle cerebral arteries (MCAs-M4) and internal cerebral veins (ICVs) (A60-V60), 2) the arterial phase for the MCA-M4 and venous phase for the ICVs (A20-V60), 3) the venous phase for the ICVs and superior petrosal veins (ICV-SPV). The CTP images were independently reviewed. The presence of an open skull defect and stasis filling was noted. Results: Sensitivities of the ICV-SPV, A20-V60, A60-V60 scoring systems, and CTP in the diagnosis of BD were 89.5%, 82.6%, 67.4%, and 93.3%, respectively. The sensitivity of A20-V60 scoring was higher than that of A60-V60 in BD patients (p < 0.001). CTP was found to be the most sensitive method (86.5%) in patients with open skull defect (p = 0.019). Interobserver agreement was excellent in the diagnosis of BD, in assessing A20-V60, A60-V60, ICV-SPV, CTP, and good in stasis filling (κ: 0.84, 0.83, 0.83, 0.83, and 0.67, respectively). Conclusion: The sensitivity of CTA confirming brain death differs between various proposed 4-point scoring systems. Although the ICV-SPV is the most sensitive, evaluation of the SPV is challenging. Adding CTP to the routine BD CTA protocol, especially in cases with open skull defect, could increase sensitivity as a useful adjunct.

• 한국방사선학회논문지
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• 제12권6호
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• pp.713-718
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• 2018

많은 선행 연구에서는 무연 차폐재를 제작하기 위하여 몬테카를로 시뮬레이션을 통해 방사선 차폐 능력과 경량화에 대한 가능성을 제시하고 있다. 하지만, 이는 바인더 및 미세 기공에 대한 구현이 어렵기에 제품화 공정에 필요한 정보를 충분히 제공하지 못하는 실정이다. 이에 본 연구에서는 제품화 공정에 요구되는 겔 페이스트에 대한 정보를 사전에 제공하기 위하여 스크린 프린팅 공법을 활용하여 충전율에 따른 방사선 차폐 능력에 대한 결과를 제시하였다. 본 연구에서는 방사선 차폐 능력을 평가하기 위해 IEC 61331-1: 2014와 KS A 4025에 부합하도록 실험 환경을 설계하였으며, 방사선 조사 조건은 KS A 4021 규격을 준용하여 총 여과 2.0 mmAl로 여과된 100 kVp를 이용하였다. 본 연구 결과, TVL를 기준으로 Pb $1270{\mu}m$, $BaSO_4$ $3035{\mu}m$, $Bi_2O_3$ $1849{\mu}m$, $WO_3$ $2631{\mu}m$에서 근사한 값으로 분석되었다. 또한, 충전율은 $BaSO_4$ 38.6%, $Bi_2O_3$ 27.1%, $WO_3$ 30.15%로 분석되었다. 하지만, 차후 저온고압 성형을 적용한다면 충전율을 높이면서도 기공률을 낮춤으로서 방사선 차폐 능력의 개선이 충분히 가능할 것으로 기대된다.

• 청정기술
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• 제27권1호
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• pp.24-32
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• 2021

미연 탄소(unburned carbon, UC)는 대두유를 포수제로 사용하여 부유선별공정을 통해 최대 85.8 wt%까지 비산재로부터 성공적으로 회수되었다. CM (ceramic microsphere)은 부유선별공정 다음 공정인 하이드로 사이클론 분리공정으로부터 18 wt%의 수율을 얻을 수 있었고 회수한 UC와 CM을 각각 고무증량재와 플라스틱(polypropylene) 충진재의 대체재로 사용하여 산업재로 활용 가능성을 조사하였다. 입자가 큰 UC는 볼밀을 사용하여 평균입경 10.2 ㎛로 작게 분쇄하였다. 분쇄된 UC를 점토 대신에 고무증량재로 사용하였을 때 인장강도와 신율이 다소 낮게 나와 고무제품의 표준조건을 만족시키지는 못하였다. 따라서 표준조건을 충족시키기 위해 UC는 고무와 보다 긴밀한 결합이 필요하였고, 이를 위한 표면 에너지를 향상시키는 추가적인 처리가 필요하였다. CM은 평균입경이 5 ㎛의 구형입자로 관찰되었으며, 입자의 표면을 페놀수지, 폴리올, 스테아린산, 올레인산으로 개질하였다. 표면 개질된 CM은 PP (polypropylene) 충진재로 사용되었다. 표면 개질된 CM을 사용한 제품은 흐름성은 양호하였으나 결합력 부족으로 충격강도 및 굴곡강도는 향상되지 못하였다. 그러나 표면 개질된 CM에 유기물과 무기물의 대표적 컬플링제인 실란 1 wt%을 추가적으로 혼합함으로써 충격강도 및 굴곡강도가 크게 향상되는 효과를 얻을 수 있었다.