• Journal of information and communication convergence engineering
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• 제8권3호
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• pp.273-276
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• 2010

Opportunistic spectrum access (OSA) allows unlicensed users to share licensed spectrum in space and time with no or little interference to primary users, with bring new research challenges in MAC design. We propose a cognitive MAC protocol using statistical channel information and selecting appropriate idle channel for transmission. The protocol based on the CSMA/CA, exploits statistics of spectrum usage for decision making on channel access. Idle channel availability, spectrum hole sufficiency and available channel condition will be included in algorithm statistical information. The model include the control channel and data channel, the transmitter negotiates with receiver on transmission parameters through control channel, statistical decision results (successful rate of transmission) from exchanged transmission parameters of control channel should pass the threshold and decide the data transmission with spectrum hole on data channel. The proposed protocol's simulation will show that proposed protocol does improve the throughput performance via traditional opportunistic spectrum access MAC protocol.

• Composites Research
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• 제29권6호
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• pp.388-394
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• 2016

Fiber reinforced plastic (FRP) composites have drawn increasing attentions worldwide for decades due to its outstanding properties. Stress concentration factor (SCF) as an essential parameter in materials science are critically considered in structure design and application, strength assessment and failure prediction. However, investigation of stress concentration in FRP composites has been rarely reported so far. In this study, three resource-conserving analyses (Isotropic analysis, Orthotropic analysis and Finite element analysis) were introduced to plot the $K_T^A-d/W$ curve for E-glass/epoxy composite plate with the geometrical defect of circular hole placed centrally. The plates were loaded to uniaxial direction for simplification. Finite element analysis (FEA) was carried out via ACP (ANSYS composite prepost module). Based on the least squares method, a simple expression of fitting equation could be given based on the simulated results of a set of discrete points. Finally, all three achievable solutions were presented graphically for explicit comparison. In addition, the investigation into customized efficient SCFs has also been carried out for further reference.

• Current Photovoltaic Research
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• 제11권4호
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• pp.103-107
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• 2023

A Nickel oxide (NiO_x) thin films were prepared via sol-gel process on a transparent conductive oxide glass substrate. The NiO_x thin films were spin-coated in ambient air and subsequently annealed for 30 minutes at temperatures ranging from 150℃ to 450℃. The structural and optical characteristics of the NiO_x thin films annealed at various temperatures were measured using X-ray diffraction, field emission scanning electron microscopy, and ultraviolet-visible spectroscopy. After optimizing the NiO_x coating conditions, perovskite solar cells were fabricated with p-i-n inverted structure, and its photovoltaic performance was evaluated. NiO_x thin films annealed at 350℃ exhibited the most favorable characteristics as a hole transport layer, resulting in the highest power conversion efficiency of 17.88 % when fabricating inverted perovskite solar cells using this film.

• International Journal of Control, Automation, and Systems
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• 제3권3호
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• pp.469-476
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• 2005

Performance of a force-torque sensor is affected significantly by an error signal that is included in the sensor signal. The error sources may be classified mainly into two categories: one is a structural error due to inaccuracy of sensor body, and the other is a noise signal existing in sensed information. This paper presents a principle of 6-axis force-torque sensor briefly, a double-hole structure to be able to improve a structural error, and then a signal conditioning to reduce the effect of a noise signal. The validity of the proposed method is investigated through experimental study, which shows that SIN ratio is improved significantly in our experimental setup, and the sensor can be implemented cheaply with reasonable performance.

• 천문학회보
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• 제38권2호
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• pp.60.1-60.1
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• 2013

We study tidal disruption and subsequent mass fallback process for stars approaching supermassive black holes on bound orbits, by performing three dimensional Smoothed Particle Hydrodynamics simulations with a pseudo-Newtonian potential. We find that the mass fallback rate decays with the expected -5/3 power of time for parabolic orbits, albeit with a slight deviation due to the self-gravity of the stellar debris. For eccentric orbits, however, there is a critical value of the orbital eccentricity, significantly below which all of the stellar debris is bound to the supermassive black hole. All the mass therefore falls back to the supermassive black hole in a much shorter time than in the standard, parabolic case. The resultant mass fallback rate considerably exceeds the Eddington accretion rate and substantially differs from the -5/3 power of time. We also show that general relativistic precession is crucial for accretion disk formation via circularization of stellar debris from stars on moderately eccentric orbits.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.297-298
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• 2011

Metal/poly (4,4'-aminotriphen-ylene hexafluoroisopropylidenediphthalimide) (TP6F PI)/metal structure exhibited an electrically volatile phase transition with high (OFF) or low (ON) resistive states when voltage between electrodes swept. Here, we demonstrate a noble set-up in which holes are injected by photoelectron emission process during the voltage sweep instead of direct charge carrier injection via metal electrode, which enables direct investigation into changed electronic structures of TP6F PI both in ON and OFF states using photoemission spectroscopy methods. In the I-V measurement, TP6F PI shows a non-volatile behavior. In spectroscopic results, this non-volatile behavior is leaded from the structural modification of the O=C double bond in phthalimide of TP6F PI by hole injection.

• 한국세라믹학회지
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• 제42권12호
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• pp.865-871
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• 2005

Submicron thick solid electrolyte membrane is essential to the implementation of low temperature solid oxide fuel cell, and, therefore, development of new electrode structures is necessary for the submicron thick solid electrolyte deposition while providing functions as current collector and fuel transport channel. In this research, a nickel membrane with multi-stage nano hole array has been produced via modified two step replication process. The obtained membrane has practical size of 12mm diameter and $50{\mu}m$ thickness. The multi-stage nature provides 20nm pores on one side and 200nm on the other side. The 20nm side provides catalyst layer and $30\~40\%$ planar porosity was measured. The successful deposition of submicron thick yttria stabilized zirconia membrane on the substrate shows the possibility of achieving a low temperature solid oxide fuel cell.

• 한국표면공학회지
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• 제32권3호
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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• pp.12-17
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• 2003

본 연구에서는 MICP Etching system 을 이용한 Via contact 및 Deep contact hole etch process 특성을 연구하였다. Langmuir probe 를 이용한 MICP source 의 Plasma density & electron temperature 측정하였고 탄소와 플로우르를 포함하는 혼합 Plasma 를 형성하여 RF frequency, wall temperature, chamber gap, gas chemistry 등의 변화에 따른 식각 특성을 조사하였다. Plasma density 는 1000w 에서 $10^{11}$/$cm^3$ 이상의 high density plasma와 uniform plasma 형성을 확인하였고 $CH_{2}F_{2}$와 CO의 적절한 혼합비를 이용하여 Oxide to PR 선택비가 10 이상인 고선택비 조건을 확보하였다. 고선택비 형성에 따라 Polymer 형성이 많이 되었고 이를 개선하기 위하여 반응 챔버의 온도 조절을 통하여 Polymer 증착 방지에 효과적인 것을 확인하였다. MICP source를 이용하여 탄소와 플로우르의 혼합 가스와 식각 챔버의 온도 조절에 의한 선택비 증가를 확보하여 High Aspect Ratio Contact Hole Etch 가능성을 확보하였다.