• Title/Summary/Keyword: Vertical feed-through

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Wafer Level Packaging of RF-MEMS Devices with Vertical feed-through (Ultra Thin 실리콘 웨이퍼를 이용한 RF-MEMS 소자의 웨이퍼 레벨 패키징)

  • 김용국;박윤권;김재경;주병권
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.12S
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    • pp.1237-1241
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    • 2003
  • In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

A Study on the Temperature Characteristics of the Floor Cooling System of Mock-up Experimentent (Mock-up실험에 의한 바닥복사 냉방시스템의 온도특성에 관한 연구)

  • Yoo, Ho-Chun;Lee, Young-A
    • Journal of the Korean Solar Energy Society
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    • v.28 no.6
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    • pp.48-57
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    • 2008
  • The research analyzed the distribution of the indoor temperatures of a radiant floor cooling system through mock-up experiments. It investigated the temperature difference of feed water, the vertical temperature difference of indoor air, the temperature difference of floor surface, and so on. The following is the results of the research. First, the research shows that the difference between indoor temperature and outside temperature was the smallest when the temperature of feed water was set at 16$^{\circ}C$. In addition, the temperature changes according to indoor positions (wall, room, floor, and ceiling) were the most uniform. Thus, the research found that the cold water temperature of 16$^{\circ}C$ is the most proper. In addition, it confirmed that the feed water temperature of 18$^{\circ}C$ is effective because the temperature can lower the temperature of a room to 13.55$^{\circ}C$, which is lower than the temperature of a non-cooling mode. Second, an investigation on the temperature distribution of vertical air in indoor space shows that the temperature distribution had a difference of 0.2 to 1.9$^{\circ}C$ on the average, which satisfies the range of 3.0$^{\circ}C$ in the standard of ISO.

A study on Processing technology of high-speed and high-accuracy for Metal Mold Cutting (금형가공을 위한 고속.고정도 가공기술의 연구)

  • 박희영
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.221-226
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    • 1999
  • It can be acquired the high effective productivity through of high speed, precision of machine tools, and then, machine tools will be got a competitive power. Industrially advanced countries already developed that the high speed feed is 50m/min using the high speed ball screw. Also, a lot of problems have happened the feed and servo drive system. It is necessary to study about the character of positioning accuracy, heat generation and high speed/accuracy control for feed/servo drive system of high speed/accuracy. In this study, we make use of high performance vertical machine center with a ball screw of large-scale-lead. Also, we'll apply the high-speed/accuracy control technology in this part of feedforward control, multi-buffering block size, etc. Using the design of the mechanical element and high-speed precision control, the basic design concept can be established.

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Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through (수직형 Feed-through 갖는 RF-MEMS 소자의 웨이퍼 레벨 패키징)

  • Park, Yun-Kwon;Lee, Duck-Jung;Park, Heung-Woo;kim, Hoon;Lee, Yun-Hi;Kim, Chul-Ju;Ju, Byeong-Kwon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.10
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    • pp.889-895
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    • 2002
  • Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

A Feed-forward Microsecond Level Real-time SOP Finding System (순방향 마이크로초 단위의 실시간 편광상태 검출 시스템)

  • Jung, Hyun-Soo;Shin, Seo-Yong
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.33 no.1C
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    • pp.94-101
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    • 2008
  • In this paper, we introduce a real-time state-of-polarization(SOP) finding system. The system divides the optical wave into linear horizontal- and vertical-SOP components and measures two different beat-signals, which are produced by superposition with reference optical source, in time domain. From these measured beat signals we can get SOP information of the signal instantly. Since the proposed scheme is a feed-forward measurement system, comparing with conventional systems which require an optical feedback loop, the measurement time becomes reduced tremendously. We also introduced a novel calibration method for compensating birefringence-related errors which may occur during the measurement. We prove the operation and performance of the proposed system through computer simulation and actual experiments.

A Study on Design of Narrow Beamwidth Multimode Feed Horn Antenna for High Power Microwave Antenna System (초고출력 안테나 시스템 급전용 좁은 빔폭의 다중모드 혼 안테나 설계에 관한 연구)

  • Lee, Sang-Heun;Ahn, Ji-Hwan;Yoon, Young-Joong;So, Joon-Ho
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2005.11a
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    • pp.361-366
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    • 2005
  • In this paper, a modified multimode hem antenna is designed to have 142 mm horn aperture radius and 921 mm length in order to be safe under 100 MW peak pulse power at 3 cm wave length through breakdown phenomenon study that threshold field strengths for the air breakdown phenomena is decided to be 3.78 MV/m. The proposed antenna is measured gain over 27 dBi and the -25 dB beam width of 29$^{\circ}$ in vertical plane.

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A Study on the Effects of Motion Errors for Acceleration/Deceleration Types (가감속 형태에 叫른 운동오차의 영향에 대한 연구)

  • 신동수;곽경남;정성종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.671-677
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    • 1996
  • This paper proposes a study on the effects of motion errors for acceleration/ deceleration types. The proposed motion errors are consisted of two errors : one due to transient response of servomechanism and the other due to gain mismatching of positioning servo motor. They are derived from using laplace transformation for the block diagram of general purpose feed drive system. In order to minimize them, the paper proposes second order polynomial regression model by using orthogonal array method which describes one of experimental methodolgies. The validity and reliability of the study was veri lied on a vertical machining center equipped with FANUC 0MC through a series of experiments and analyses.

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An Empirical Study on Pheasant Farm Business Strategies and Marketability of Pheasant Foods (꿩고기 및 그 가공품(加工品)에 대한 시장성(市場性) 및 경영전략(經營戰略))

  • Oh, Hong Rock;Park, Chong Soo
    • Korean Journal of Agricultural Science
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    • v.18 no.2
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    • pp.127-139
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    • 1991
  • 1. The purpose of this study was to recommend ways of more efficient pheasant farm business management and promoting the demand of pheasant foods by reviewing the current pheasant farm business management and the general pattern of consumption of pheasant foods. The study was conducted on the basis of the field survey covering 83 pheasant feeders and 283 consumers. 2. Majority of pheasant feeders, 86.8%(n=72), utilized broiler feed for pheasant rearing because of high price of exclusive pheasant feed. 3. In case of producing 1,000 heads of 5 month-old pheasant, the primary production cost per head was roughly calculated at about 5,530 Won. And 40.3% of primary production cost was consisted of feed cost and 12.9% was depreciation cost for facillities including artificial incubator equipments. 4. 81.1%(n=51) of whole surveyed feeders disposed of 1-4 week-old birds directly to the new feeders and 6%(n=6) sold them to the middlemen who were almost pioneering pheasant feeders. 5. 48.9%(n=138) of the surveyed consumer respondents have taken the pheasant foods once and several times, and the others never once. And 50.6%(n=69) of the respondents who had taken the pheasant foods were satisfied with the tastes. 6. The surveyed consumers were asked whether they knew the nutritional value of pheasant foods and 47.3(n=136) recognized it positively and 37.5%(n=106) negatively. 7. To increase the pheasant farm income and promote the demand of pheasant foods. followings are recommended. - Production cost should be reduced by cooperative utilization of facilities and equipments at farm level, and exclusive pheasant feed of good quility should be developed and supplied to the feeders at a low price. - Pheasant marketing and pricing system should be improved to prevent consumers from price disorder of retail shop including pheasant food reataurants and to popularize the pheasant foods. - Various type of menu of pheasant foods should be developed not only to satisfy consumers in tastes but also to solve the seasonality of pheasant supply. But it is preferable that this action is led by pheasant feeders and their cooperative organization, espectially through vertical intergration system owned by pheasant feeders. - Generic, pioneering advertisement and promotion should be carried out to promote primary demend of pheasant foods. It would be preferable that these primary demend advertising and promoting activities shuld be sponsored by pheasant feeders and government together. And their activities should be supported by institutional regulation.

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Thermal-hydraulic study of air-cooled passive decay heat removal system for APR+ under extended station blackout

  • Kim, Do Yun;NO, Hee Cheon;Yoon, Ho Joon;Lim, Sang Gyu
    • Nuclear Engineering and Technology
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    • v.51 no.1
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    • pp.60-72
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    • 2019
  • The air-cooled passive decay heat removal system (APDHR) was proposed to provide the ultimate heat sink for non-LOCA accidents. The APDHR is a modified one of Passive Auxiliary Feed-water system (PAFS) installed in APR+. The PAFS has a heat exchanger in the Passive Condensate Cooling Tank (PCCT) and can remove decay heat for 8 h. After that, the heat transfer rate through the PAFS drastically decreases because the heat transfer condition changes from water to air. The APDHR with a vertical heat exchanger in PCCT will be able to remove the decay heat by air if it has sufficient natural convection in PCCT. We conducted the thermal-hydraulic simulation by the MARS code to investigate the behavior of the APR + selected as a reference plant for the simulation. The simulation contains two phases based on water depletion: the early phase and the late phase. In the early phase, the volume of water in PCCT was determined to avoid the water depletion in three days after shutdown. In the late phase, when the number of the HXs is greater than 4089 per PCCT, the MARS simulation confirmed the long-term cooling by air is possible under extended Station Blackout (SBO).

Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique (3중 접합 공정에 의한 MEMS 공진기의 웨이퍼레벨 진공 패키징)

  • Yang, Chung Mo;Kim, Hee Yeoun;Park, Jong Cheol;Na, Ye Eun;Kim, Tae Hyun;Noh, Kil Son;Sim, Gap Seop;Kim, Ki Hoon
    • Journal of Sensor Science and Technology
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    • v.29 no.5
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    • pp.354-359
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    • 2020
  • The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.