• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1237-1241
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• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• 한국태양에너지학회 논문집
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• 제28권6호
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• pp.48-57
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• 2008

The research analyzed the distribution of the indoor temperatures of a radiant floor cooling system through mock-up experiments. It investigated the temperature difference of feed water, the vertical temperature difference of indoor air, the temperature difference of floor surface, and so on. The following is the results of the research. First, the research shows that the difference between indoor temperature and outside temperature was the smallest when the temperature of feed water was set at 16$^{\circ}C$. In addition, the temperature changes according to indoor positions (wall, room, floor, and ceiling) were the most uniform. Thus, the research found that the cold water temperature of 16$^{\circ}C$ is the most proper. In addition, it confirmed that the feed water temperature of 18$^{\circ}C$ is effective because the temperature can lower the temperature of a room to 13.55$^{\circ}C$, which is lower than the temperature of a non-cooling mode. Second, an investigation on the temperature distribution of vertical air in indoor space shows that the temperature distribution had a difference of 0.2 to 1.9$^{\circ}C$ on the average, which satisfies the range of 3.0$^{\circ}C$ in the standard of ISO.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.221-226
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• 1999

It can be acquired the high effective productivity through of high speed, precision of machine tools, and then, machine tools will be got a competitive power. Industrially advanced countries already developed that the high speed feed is 50m/min using the high speed ball screw. Also, a lot of problems have happened the feed and servo drive system. It is necessary to study about the character of positioning accuracy, heat generation and high speed/accuracy control for feed/servo drive system of high speed/accuracy. In this study, we make use of high performance vertical machine center with a ball screw of large-scale-lead. Also, we'll apply the high-speed/accuracy control technology in this part of feedforward control, multi-buffering block size, etc. Using the design of the mechanical element and high-speed precision control, the basic design concept can be established.

• 한국전기전자재료학회논문지
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• 제15권10호
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• 한국통신학회논문지
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• 제33권1C호
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• pp.94-101
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• 2008

본 논문에서는 실시간으로 빛의 편광상태(SOP)를 파악할 수 있는 장치를 소개한다. 소개하는 장치는 광파를 수평 선형편광과 수직 선형편광 성분으로 분리하고, 각각을 기준 광원의 수평 선형편광 및 수직 선형편광 성분들과 중첩시키고 이로부터 발생한 비트신호들을 시간 영역에서 측정하여 비교함으로써 광파의 SOP를 파악해 내는 순방향(feed-forward) 측정 시스템으로서 귀환(feedback) 방식을 이용하는 기존의 방식들에 비해 SOP 측정시간을 실시간으로 단축시키는 장점을 갖고 있다. 본 논문에서는 또한 SOP 측정 과정에서 수반될 수 있는 광소자의 복굴절 변화에 의한 측정 오차를 매우 간편하고 정확하게 제거할 수 있는 새로운 오차 보정 방식을 소개한다. 제안하는 시스템의 동작과 성능을 모의실험 및 광학 실험을 통해 입증하였다.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2005년도 종합학술발표회 논문집 Vol.15 No.1
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• pp.361-366
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• 2005

In this paper, a modified multimode hem antenna is designed to have 142 mm horn aperture radius and 921 mm length in order to be safe under 100 MW peak pulse power at 3 cm wave length through breakdown phenomenon study that threshold field strengths for the air breakdown phenomena is decided to be 3.78 MV/m. The proposed antenna is measured gain over 27 dBi and the -25 dB beam width of 29$^{\circ}$ in vertical plane.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.671-677
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• 1996

This paper proposes a study on the effects of motion errors for acceleration/ deceleration types. The proposed motion errors are consisted of two errors : one due to transient response of servomechanism and the other due to gain mismatching of positioning servo motor. They are derived from using laplace transformation for the block diagram of general purpose feed drive system. In order to minimize them, the paper proposes second order polynomial regression model by using orthogonal array method which describes one of experimental methodolgies. The validity and reliability of the study was veri lied on a vertical machining center equipped with FANUC 0MC through a series of experiments and analyses.

• 농업과학연구
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• 제18권2호
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• pp.127-139
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• 1991

1. The purpose of this study was to recommend ways of more efficient pheasant farm business management and promoting the demand of pheasant foods by reviewing the current pheasant farm business management and the general pattern of consumption of pheasant foods. The study was conducted on the basis of the field survey covering 83 pheasant feeders and 283 consumers. 2. Majority of pheasant feeders, 86.8%(n=72), utilized broiler feed for pheasant rearing because of high price of exclusive pheasant feed. 3. In case of producing 1,000 heads of 5 month-old pheasant, the primary production cost per head was roughly calculated at about 5,530 Won. And 40.3% of primary production cost was consisted of feed cost and 12.9% was depreciation cost for facillities including artificial incubator equipments. 4. 81.1%(n=51) of whole surveyed feeders disposed of 1-4 week-old birds directly to the new feeders and 6%(n=6) sold them to the middlemen who were almost pioneering pheasant feeders. 5. 48.9%(n=138) of the surveyed consumer respondents have taken the pheasant foods once and several times, and the others never once. And 50.6%(n=69) of the respondents who had taken the pheasant foods were satisfied with the tastes. 6. The surveyed consumers were asked whether they knew the nutritional value of pheasant foods and 47.3(n=136) recognized it positively and 37.5%(n=106) negatively. 7. To increase the pheasant farm income and promote the demand of pheasant foods. followings are recommended. - Production cost should be reduced by cooperative utilization of facilities and equipments at farm level, and exclusive pheasant feed of good quility should be developed and supplied to the feeders at a low price. - Pheasant marketing and pricing system should be improved to prevent consumers from price disorder of retail shop including pheasant food reataurants and to popularize the pheasant foods. - Various type of menu of pheasant foods should be developed not only to satisfy consumers in tastes but also to solve the seasonality of pheasant supply. But it is preferable that this action is led by pheasant feeders and their cooperative organization, espectially through vertical intergration system owned by pheasant feeders. - Generic, pioneering advertisement and promotion should be carried out to promote primary demend of pheasant foods. It would be preferable that these primary demend advertising and promoting activities shuld be sponsored by pheasant feeders and government together. And their activities should be supported by institutional regulation.

• Nuclear Engineering and Technology
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• 제51권1호
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• pp.60-72
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• 2019

The air-cooled passive decay heat removal system (APDHR) was proposed to provide the ultimate heat sink for non-LOCA accidents. The APDHR is a modified one of Passive Auxiliary Feed-water system (PAFS) installed in APR+. The PAFS has a heat exchanger in the Passive Condensate Cooling Tank (PCCT) and can remove decay heat for 8 h. After that, the heat transfer rate through the PAFS drastically decreases because the heat transfer condition changes from water to air. The APDHR with a vertical heat exchanger in PCCT will be able to remove the decay heat by air if it has sufficient natural convection in PCCT. We conducted the thermal-hydraulic simulation by the MARS code to investigate the behavior of the APR + selected as a reference plant for the simulation. The simulation contains two phases based on water depletion: the early phase and the late phase. In the early phase, the volume of water in PCCT was determined to avoid the water depletion in three days after shutdown. In the late phase, when the number of the HXs is greater than 4089 per PCCT, the MARS simulation confirmed the long-term cooling by air is possible under extended Station Blackout (SBO).

• 센서학회지
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• 제29권5호
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.