• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1997년도 Proceedings of the 12th KACG Technical Meeting and the 4th Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.7-11
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• 1997

SiC/C functionally gradient material (FGMs) were formed on graphite substrates by hot-wall chemical vapor deposition (CVD) technique using the SiCl$_4$-C$_3$H8-H$_2$ chemistry. Thermochemical equilibrium calculations were carried out to investigate the deposition process. The effect of process variables on the deposition yield and the SiC/C ratio in deposited layers was studied in detail. Calculated results showed a reasonable agreement with the experiment in a qualitative sense. SiC/C FGMs with excellent mechanical and thermal properties could be successfully formed on graphite substrates by carefully controlling the compositions in the deposited layers.

• Corrosion Science and Technology
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• 제10권6호
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• pp.194-198
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• 2011

This is the first release of an interim report on the development of coating technology of Zn-Mg alloy layers on steel strip by EML-PVD (electromagnetic levitation - physical vapor deposition) process in an air-to-air type continuous PVD pilot plant. It intends to introduce a basic principle of the EML-PVD process together with the high speed PVD pilot plant built in Posco. Due to the agitation effect provided by the high frequency induction coil, simultaneous evaporation of Zn and Mg from a droplet could produce alloy coating layers with Mg content of 6% to 12% depending on the composition of the droplet inside the coil. For its superior corrosion resistance, Zn-Mg alloy coated steel would be a very promising material for automotive, electrical appliances, and construction applications.

• 한국재료학회지
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• 제26권9호
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• pp.486-492
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• 2016

Tungsten (W) thin film was deposited at $400^{\circ}C$ using pulsed chemical vapor deposition (pulsed CVD); film was then evaluated as a nucleation layer for W-plug deposition at the contact, with an ultrahigh aspect ratio of about 14~15 (top opening diameter: 240~250 nm, bottom diameter: 98~100 nm) for dynamic random access memory. The deposition stage of pulsed CVD has four steps resulting in one deposition cycle: (1) Reaction of $WF_6$ with $SiH_4$. (2) Inert gas purge. (3) $SiH_4$ exposure without $WF_6$ supply. (4) Inert gas purge while conventional CVD consists of the continuous reaction of $WF_6$ and $SiH_4$. The pulsed CVD-W film showed better conformality at contacts compared to that of conventional CVD-W nucleation layer. It was found that resistivities of films deposited by pulsed CVD were closely related with the phases formed and with the microstructure, as characterized by the grain size. A lower contact resistance was obtained by using pulsed CVD-W film as a nucleation layer compared to that of the conventional CVD-W nucleation layer, even though the former has a higher resistivity (${\sim}100{\mu}{\Omega}-cm$) than that of the latter (${\sim}25{\mu}{\Omega}-cm$). The plan-view scanning electron microscopy images after focused ion beam milling showed that the lower contact resistance of the pulsed CVD-W based W-plug fill scheme was mainly due to its better plug filling capability.

• 한국결정성장학회지
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• 제8권2호
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• pp.240-248
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• 1998

화학기상증착 방법에 의한 다결정 다이아몬드 박막성장을 위한 공정가운데 가장 많이 사용되는 기법중의 하나가 바로 플라즈마에 의한 방법이다. 특히 플라즈마 화학기상증착(Plasma-Enhanced CVD)기술에 의한 다이아몬드 박막응용은 그 공정에 대한 세부 조정을 통하여 더욱 향상시킬 수 있다. 다이아몬드 박막증착의 경우 중요 변수들은 다이아몬드 필름이 증착되는 기판(substrate)의 온도, $CH_4/H_2$가스비율, 전체가스 압력 및 가스 excitation에너지 등이다. 분광 ellipsometry는 다이아몬드 필름 증착과 관련된 극단적인 환경에서도 물리적인 접촉이나 만들어지는 샘플의 손상없이도 필름자체의 여러 성질뿐만 아니라 기초 샘플의 온도까지도 결정할 수 있는 좋은 방법이다. 이러한 장점들을 이용하여 양질의 다이아몬드 박막을 성장시키기 위한 조건과 그에 따른 박막 특성을 얻기 위하여 분광 ellipsomerry의 사용과 해석이 소개된다. 그리고, 분광 ellipsometry를 이용, 플라즈마 화학기상증착 기술에 의하여 성장되는 다이아몬드 박막으로부터 나타나는 중요 변수들이 결정될 것이며 이러한 변수들은 필름의 두께, 필름에 포함되는 void 및 비다이아몬드의 체적비와, 그들의 시간에 따른 변화등을 포함한다. 그리고 샘플이 원하는 두께까지 성장된 후에 라만 분광기로 측정되어 다이아몬드 성분을 확인한다.

• 한국세라믹학회지
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• 제43권5호
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• pp.299-303
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• 2006

In this paper, anode supported SOFC with columnar structured YSZ electrolyte was fabricated via Electron Beam Physical Vapor Deposition (EBPVD) method. Liquid condensation process was employed for the preparation of NiO-YSZ substrate and the high power electron beam deposition method was used for the deposition of YSZ electrolyte film. Double layered cathode with LSM-YSZ and LSM was printed on electrolyte via screen-printing method and fired at $1150^{\circ}C$ in air atmosphere for 3 h. The electrochemical performance and the long-term stability of $5{\times}5cm^2$ single cell were investigated with DC current-voltage characteristics and AC-impedance spectroscopy. According to the investigation, $5{\times}5cm^2$ sized unit cell showed the maximum power density of around $0.76W/cm^2$ at $800^{\circ}C$ and maintained the stable performance over 400 h.

• 반도체디스플레이기술학회지
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• 제13권3호
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• pp.27-33
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• 2014

To develop high efficiency crystalline solar cells, the $SiN_x$ film for surface passivation and anti-reflection coating is very important and it is generally deposited by PECVD. In this paper, the $SiN_x$ film deposited by Hot-Wire chemical vapor deposition(HWCVD) that has no plasma damage was studied. First, to optimize the $SiN_x$ film deposition process, $SiH_4$ gas rate and substrate temperature were varied and then refractive index and thickness were measured. When $SiH_4$ gas rate was 22sccm and substrate temperature was $100^{\circ}C$, refractive index was 1.94 and higher than that of other process conditions. Second, the lifetime was measured by varying the annealing temperature and time. The annealing process was made from 5 to 30 minutes at $300{\sim}500^{\circ}C$. When the annealing temperature was $100^{\circ}C$ and time was 10minute, the lifetime was the highest. The lifetime of annealed samples was also measured after the firing process at $975^{\circ}C$. Although the lifetime of all samples was decreased by firing process, the lifetime of annealed samples before the firing process was higher than that of fired samples only. Finally, the characteristics of solar cells with HWCVD $SiN_x$ film were measured.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권3호
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• pp.205-212
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• 2002

The growth characteristics of metal-organic chemical vapor deposition (MOCVD) $Pb(Zr_xTi_{1-x})O_3 (PZT) thin films were investigated for the application of high-density ferroelectric random access memories (FRAM) devices beyond 64Mbit density. The supply control of Pb precursor plays the most critical role in order to achieve a reliable process for PZT thin film deposition. We have monitored the changes in the microstructure and electrical properties of films on increasing the Pb precursor supply into the reaction chamber. Under optimized conditions, $Ir/IrO_2/PZT(100nm)/Ir capacitor shows well-saturated hysteresis loops with a remanent polarization (Pr) of $~28{\mu}C/textrm{cm}^2$ and coercive voltage of 0.8V at 2.5V. Other issues such as step coverage, compositional uniformity and low temperature deposition was discussed in viewpoint of actual device application.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.339.1-339.1
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• 2014

In this paper we studied the application of inter-poly dielectric as silicon dioxide-like film was deposited by the higher energy assisting deposition (HEAD) process the modified CCP process, which enables low temperature (LT) process and improving film density. In these experiments the relative hydrogen concentration of $SiO_2$-like films deposited on silicon substrate were analyzed by the secondary ion mass spectroscopy (SIMS) and it was shown that our lower hydrogenated oxide (LHO) film prepared by HEAD process with the precursor contained the siloxane species had lower hydrogen concentration, $8{\times}10{\cdot}^{22}cm{\cdot}^3$ than that of the commercial undoped silicon glass (USG) film ($1{\times}10{\cdot}^{21}cm{\cdot}^3$) prepared by the high density plasma-chemical vapor deposition (HDP-CVD). We consider that the LHO film deposited by HEAD process used as high performance material into Flash memory devices.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.74-84
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• 2022

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.

• 한국결정성장학회지
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• 제27권1호
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• pp.1-8
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• 2017

Metal organic chemical vapor deposition(MOCVD) 방법을 이용하여 금속 촉매에 따른 ${\beta}-Ga_2O_3$ 나노 와이어의 제작과 특성에 대해 연구하였다. 본 연구의 성장 조건에서 ${\beta}-Ga_2O_3$ 나노 와이어의 성장이 가능한 금속 촉매는 Au, Cu 그리고 Ni이 있었으며 각 금속 촉매로 성장한 나노 와이어는 성장률과 형상에 많은 차이가 있었다. Ni 촉매 성장의 경우에는 Vapor-Solid(VS) 과정이 ${\beta}-Ga_2O_3$ 나노 와이어 성장의 주된 메커니즘이고 Au, Cu 촉매 성장의 경우에는 Vapor-Liquid-Solid(VLS) 과정이 주된 성장 메커니즘 임을 확인할 수 있었다. 또한, 촉매의 종류에 따라서 ${\beta}-Ga_2O_3$ 나노 와이어의 광학적 특성도 다르게 나타나는 것을 확인할 수 있었다. 반면, 동일한 성장 조건에서 Ti, Ag 그리고 Sn 금속은 나노 와이어 성장을 위한 촉매로 작용하지 못하였다. 본 연구에서는 금속 촉매에 따른 나노 와이어의 성장 가능 여부와 성장한 나노 와이어의 특성 변화가 금속 촉매의 녹는 점, 금속- Ga의 공융 점과 관련이 있음을 상태도와 연관 지어 밝혀내었다.