• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.416-416
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• 2016

Organic-inorganic metal halide perovskite solar cells have received attention because it has a number of advantages with excellent light harvesting, high carrier mobility, and facile solution processability and also recorded recently power conversion efficiency (PCEs) of over 20%. The major issue on perovskite solar cells have been reached the limit of small area laboratory scale devices produced using fabrication techniques such as spin coating and physical vapor deposition which are incompatible with low-cost and large area fabrication of perovskite solar cells using printing and coating techniques. To solution these problems, we have investigated the feasibility of achieving fully printable perovskite solar cells by the blade-coating technique. The blade-coating fabrication has been widely used to fabricate organic solar cells (OSCs) and is proven to be a simple, environment-friendly, and low-cost method for the solution-processed photovoltaic. Moreover, the film morphology control in the blade-coating method is much easier than the spray coating and roll-to-roll printing; high-quality photoactive layers with controllable thickness can be performed by using a precisely polished blade with low surface roughness and coating gap control between blade and coating substrate[1]. In order to fabricate perovskite devices with good efficiency, one of the main factors in printed electronic processing is the fabrication of thin films with controlled morphology, high surface coverage and minimum pinholes for high performance, printed thin film perovskite solar cells. Charge dissociation efficiency, charge transport and diffusion length of charge species are dependent on the crystallinity of the film [2]. We fabricated the printed perovskite solar cells with large area and flexible by the bar-coating. The morphology of printed film could be closely related with the condition of the bar-coating technique such as coating speed, concentration and amount of solution, drying condition, and suitable film thickness was also studied by using the optical analysis with SEM. Electrical performance of printed devices is gives hysteresis and efficiency distribution.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.157.1-157.1
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• 2016

In this work, we experimentally investigated the solar absorption performance of Cu-based scalable nanostructured surfaces and compared their performance with the conventional TiNOX. We fabricated Cu-based nanostructured surfaces with a controlled chemical oxidation process applicable to a large area or complex geometry. We optimized the process parameters including the chemical compounds, dipping time and process temperature. We conducted both lab-scale and outdoor experiments to characterize the conversion efficiency of each absorber surfaces with single and double glazing setup. Lab-scale experiment was conducted with $50mm{\times}50mm$ absorber sample with 1-sun condition (1kW/m2) using a solar simulator (PEC-L01) with measuring the temperature at the absorber plate, cover glass, air gap and ambient. From the lab-scale experiment, we obtained ${\sim}91^{\circ}C$ and $94^{\circ}C$ for CuO and TiNOX surfaces after 1 hr of solar illumination at single glazing, respectively. To measure the absorber performance at actual operating condition, outdoor experiment was also conducted using $110mm{\times}110mm$ absorber sample. We measured the solar flux with thermopile detector (919P-040-50). From outdoor experiment, we observed ${\sim}123^{\circ}C$ and $131^{\circ}C$ for CuO and TiNOX with 0.6 kW/m2 insolation at double glazing, respectively. We showed that the suggested nanostructured CuO solar absorber has near-equivalent collection efficiency compared with the state-of-the-art TiNOX surfaces even with much simpler manufacturing process that does not require an expensive equipment.

• Journal of the Korean Vacuum Society
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• v.13 no.2
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• pp.72-78
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• 2004

Cu seed layers deposited by magnetron sputtering onto tantalum nitride barrier films were treated with ECR plasma and then the copper films were electroplated and rapid thermal annealed in an argon or nitrogen atmosphere at various temperatures ranging from 200 to $500^{\circ}C$. Changes in the microstructure and physical properties of the copper films electroplated on the hydrogen ECR plasma cleaned copper seed layers were investigated using X-ray diffraction (XRD), electron back-scattered diffraction (EBSD), and atomic force microscopy (AFM) analyses. It was found that the copper film undergoes complete recrystallization during annealing at a temperature higher than $400^{\circ}C$. The resistivity of the Cu film tends to decrease and the degree of (111) preferred orientation tends to increase as the annealing temperature increases. Theoptimum annealing condition for obtaining the film with the lowest resistivity, the smoothest surface and the highest degree of the (111) preferred orientation is rapid thermal annealing in a nitrogen atmosphere at $400^{\circ}C$ for 120 s. The resistivity and the surface roughness of the electroplated copper film annealed under this condition are 1.98 $\mu$O-cm and 17.77 nm, respectively.

• Applied Biological Chemistry
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• v.40 no.4
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• pp.294-300
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• 1997

As a part of basic investigation for utilizing by-products derived from marine food processing more effectively as a food source, refining of viscera oil of squid caught off Newzealand were investigated. In the process of refining, degumming with 3% of phosphoric acid at $60^{\circ}C$ for 30 min was effective in removing phosphatides, and optimal condition to neutralize was treating with 0.6% excess of 20% sodium hydroxide solution at $80^{\circ}C$ for 20 min. Bleaching was optimized by adding 10% activated clay and treating for $100^{\circ}C$ for 20 min under vacuum, and deodorizing was done by steam destillation at $180^{\circ}C$ for 60 min under 4 torr of vacuum. Acid value, peroxide value and chromaticity of refined squid viscera oil were 0.20, 0.8 meq/kg and 0.019, respectively. The ratio of polyenoic acid composition to saturated acid composition of refined squid viscera oil was 1.28 and its major fatty acids were 16 : 0, 18 : In-9, 20 : 5n-3 and 22 : 6n-3.

• Journal of the Korean Society for Heat Treatment
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• v.5 no.4
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• pp.195-200
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• 1992

SCM 415 has been vacuum carburized in the carburizing pressure of 60-65kpa and the carburizing temperature of 1233k and 1273k after varied to 0-20 in the ratio of $N_2/C_3H_8$ and then diffusion treated for various times at 1123k. The results obtained from the experiment are as follows. 1. With increasing from 0 to 20 in ratio of $N_2/C_3H_8$ the sooting formation of surface after carburizing considerably decreased. 2. The hardness control and surface carbon content of carburizing surface has been modified by the addition of nitrogen to the propan. 3. The appoximate value of k is indirectry calculated at 1123k which results are obtained to $0.58{\times}10^{-2}(wt.%.S^{-1/2})$. 4. A great deal of propan by addition of nitrogen gas in carburizing gas was possible to saving without considerable change in case hardening depth. 5. The effective carburizing depth range is obtained to 0.8-1.1mm by diffusion temperature of 1123k after carburization at 1273k-3.6ks, and the surface hardness is increased as the increasing of $T_D/T_c$ in our experimental condition, and the maximum hardness as reachin distance from surface is decreased.

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.400-405
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• 2000

We investigated the effect of TMIn (trimethly-indium) source depletion on InGaAs, InGaAsP and 1.55 $\mu\textrm{m}$ InGaAs/InGaAsP SMQW by using EPISON ultrasonic monitor for measuring the concentration of metalorganic/carrier gas mixtures. And the problems for the growth reproducibility in MOCVD was solved by using an EPISON ultrasonic monitor with closed-loop mode under the condition of TMIn source depletion. The saturation pressure of TMIn was dramatically decreased over consumption of 80%. In the case of bulk epilayer, Up-shifting of 300 arcsec to Ga-rich direction and FWHM broadening by a factor of two in DCXRD spectrum were observed due to the TMIn source depletion. In the case of SMQW, Up-shifting of 300 arcsec to Ga-rich direction in DCXRD spectrum and blue-shift of 40 nm in PL spectrum were observed due to the TMIn source depletion. However, good reproducibility ($\Delta\theta$<$\pm$100 arcsec) was achieved even the condition of 95% of TMIn consumption, when we used the EPISON with closed-loop mode.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.331-340
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• 2010

3D fluid based numerical modelling is done for a VHF multi hollow cathode array plasma enhanced chemical vapor deposition system. In order to understand the fundamental characteristics of it, Ar plasma is analyzed with a condition of 40 MHz, 100 Vrf and 1 Torr. For hole array of 6 mm diameter and 20 mm inter-hole distance, plasma is well confined within the hole at an electrode gap of 10 mm. The peak plasma density was $5{\times}10^{11}#/cm^3$ at the center of the hole. When the substrate was assumed at ground potential, electron temperature showed a peak at the vicinity of the grounded walls including the substrate and chamber walls. The reaction rate of metastable based two step ionization was 10 times higher than the direct electron impact ionization at this condition. For $H_2$, the spatial localization of discharge is harder to get than Ar due to various pathways of electron impact reactions other than ionization.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.523-523
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• 2012

As the wafer geometric requirements continuously complicated and minutes in tens of nanometers, the expectation of real-time add-on sensors for in-situ plasma process monitoring is rapidly increasing. Various industry applications, utilizing plasma impedance monitor (PIM) and optical emission spectroscopy (OES), on etch end point detection, etch chemistry investigation, health monitoring, fault detection and classification, and advanced process control are good examples. However, process monitoring in semiconductor manufacturing industry requires non-invasiveness. The hypothesis behind the optical monitoring of plasma induced ion current is for the monitoring of plasma induced charging damage in non-invasive optical way. In plasma dielectric via etching, the bombardment of reactive ions on exposed conductor patterns may induce electrical current. Induced electrical charge can further flow down to device level, and accumulated charges in the consecutive plasma processes during back-end metallization can create plasma induced charging damage to shift the threshold voltage of device. As a preliminary research for the hypothesis, we performed two phases experiment to measure the plasma induced current in etch environmental condition. We fabricated electrical test circuits to convert induced current to flickering frequency of LED output, and the flickering frequency was measured by high speed optical plasma monitoring system (OPMS) in 10 kHz. Current-frequency calibration was done in offline by applying stepwise current increase while LED flickering was measured. Once the performance of the test circuits was evaluated, a metal pad for collecting ion bombardment during plasma etch condition was placed inside etch chamber, and the LED output frequency was measured in real-time. It was successful to acquire high speed optical emission data acquisition in 10 kHz. Offline measurement with the test circuitry was satisfactory, and we are continuously investigating the potential of real-time in-situ plasma induce current measurement via OPMS.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.388-388
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• 2011

Graphene, with its unique physical and structural properties, has recently become a proving ground for various physical phenomena, and is a promising candidate for a variety of electronic device and flexible display applications. The physical properties of graphene depend directly on the thickness. These properties lead to the possibility of its application in high-performance transparent conducting films (TCFs). Compared to indium tin oxide (ITO) electrodes, which have a typical sheet resistance of ~60 ${\Omega}/sq$ and ~85% transmittance in the visible range, the chemical vapor deposition (CVD) synthesized graphene electrodes have a higher transmittance in the visible to IR region and are more robust under bending. Nevertheless, the lowest sheet resistance of the currently available CVD graphene electrodes is higher than that of ITO. Here, we report an ingenious strategy, irradiation of MeV electron beam (e-beam) at room temperature under ambient condition,for obtaining size-homogeneous gold nanoparticle decorated on graphene. The nano-particlization promoted by MeV e-beam irradiation was investigated by transmission electron microscopy, electron energy loss spectroscopy elemental mapping, and energy dispersive X-ray spectroscopy. These results clearly revealed that gold nanoparticle with 10~15 nm in mean size were decorated along the surface of the graphene after 1.0 MeV-e-beam irradiation. The fabrication high-performance TCF with optimized doping condition showed a sheet resistance of ~150 ${\Omega}/sq$ at 94% transmittance. A chemical transformation and charge transfer for the metal gold nanoparticle were systematically explored by X-ray photoelectron spectroscopy and Raman spectroscopy. This approach advances the numerous applications of graphene films as transparent conducting electrodes.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.148-154
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• 2010

We have fabricated $SiO_2$ oxidation thin films by TCP-CVD (transformer coupled plasma chemical vapor deposition) method for passivation layer of OLED (organic light emitting diode). The purpose of this paper is to control and estimate the deposition rate and refracive index characteristics with process parameters. They are power, gas condition, distance of source and substrate and process temperature. The results show that transmittance of thin films is over 90%, rapid deposition rate and stable reflective index from 1.4 to 1.5 at controled process conditions. They are $SiH_4$ : $O_2$ = 30 : 60 [sccm] gas condition, 70 [mm] distance of source and substrate, no-biased substrate and under 80 [$^{\circ}C$] process temperature.