• Title/Summary/Keyword: Vacuum Glass

Search Result 758, Processing Time 0.04 seconds

Packaging of Vacuum Microelectronic Device using Electrostatic Bonding (정전 열 접합에 의한 진공전자소자의 패키징)

  • Ju, Byung-Kwon;Lee, Duck-Jung;Oh, Myung-Hwan
    • Proceedings of the KIEE Conference
    • /
    • 1998.11c
    • /
    • pp.1004-1006
    • /
    • 1998
  • Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

  • PDF

Humidity Dependence of Electrical Conductivity of Vacuum Evaporated Au Films on Glass (유리표면에 진공증착된 금박막의 전기전도도의 습도 의존성)

  • 이동영;박현수
    • Journal of the Korean Ceramic Society
    • /
    • v.24 no.6
    • /
    • pp.572-578
    • /
    • 1987
  • The vacuum evaporated Au films on soda-lime glasses were measured by the electrical conductivity with the variation of the annealing time, relative humidity, and temperature. Au films structures were observed by scanning Electron Microscope and X-ray Diffractometer. As the annealing time and temperature increased, the electrical conductivity was increased due to the migration or annihilation of defects, but the electrical conductivity was decreased as with the relative humidity increased. Au films by XRD and SEM examination showed the negligible effect of chemical reactions.

  • PDF

A Study on the Fracture Behavior of Quartz Glass(II) (석영 유리의 파괴 거동에 관한 연구(II))

  • Choi, Seong-Dae;Cheong, Seon-Hwan;Kwon, Hyun-Kyu;Jeong, Young-Kwan;Hong, Yong-Bae
    • Journal of the Korean Society of Industry Convergence
    • /
    • v.10 no.4
    • /
    • pp.213-219
    • /
    • 2007
  • Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.

  • PDF

Effect of Post Deposition Annealing Temperature on the Structural, Optical and Electrical Properties of GZO Films Prepared by RF Magnetron Sputtering (RF 마그네트론 스퍼터링으로 증착 된 GZO 박막의 진공 열처리온도에 따른 구조적, 광학적, 전기적 특성 연구)

  • Kim, Daeil
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.24 no.4
    • /
    • pp.199-202
    • /
    • 2011
  • Ga doped ZnO thin films were deposited with RF magnetron sputtering on glass substrate without intentional substrate heating and then the effect of post deposition annealing temperature on the structural, optical and electrical properties of the films was investigated. The post deposition annealing process was conducted for 30 minutes in a vacuum of $1{\times}10^{-3}$ Torr and the vacuum annealing temperatures were 150 and $300^{\circ}C$, respectively. As increase annealing temperature, GZO films show the increment of the prefer orientation of ZnO (002) diffraction peak in the XRD pattern and the optical transmittance in a visible wave region was also increased, while the electrical sheet resistance was decreased. The figure of merit obtained in this study means that GZO films which vacuum annealed at $300^{\circ}C$ have the highest optoelectrical performance in this study.

A Study on Wafer Level Vacuum Packaging using Epi poly for MEMS Applications (Epi poly를 이용한 MEMS 소자용 웨이퍼 단위의 진공 패키징에 대한 연구)

  • 석선호;이병렬;전국진
    • Journal of the Semiconductor & Display Technology
    • /
    • v.1 no.1
    • /
    • pp.15-19
    • /
    • 2002
  • A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

  • PDF

Characteristics of Schottky Barrier Thin Film Transistors (SB-TFTs) with PtSi Source/Drain on glass substrate

  • O, Jun-Seok;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.08a
    • /
    • pp.199-199
    • /
    • 2010
  • 최근 평판 디스플레이 산업의 발전에 따라 능동행렬 액정 표시 소자 (AMOLED : Active Matrix Organic Liquid Crystral Display) 가 차세대 디스플레이 분야에서 각광을 받고있다. 기존의 TFT-LCD에 사용되는 a-Si:H는 균일도가 좋지만 전기적인 스트레스에 의해 쉽게 열화되고 낮은 이동도는 갖는 단점이 있으며, ELA (Eximer Laser Annealing) 결정화 poly-Si은 전기적인 특성은 좋지만 uniformity가 떨어지는 단점을 가지고 있어서 AMOLED 및 대면적 디스플레이에 적용하기 어렵다. 따라서 a-Si:H TFT보다 좋은 전기적인 특성을 보이며 ELA 결정화 poly-Si TFT보다 좋은 uniformity를 갖는 SPC (Solid Phase Crystallization) poly-Si TFT가 주목을 받고있다. 본 연구에서는 차세대 디스플레이 적용을 위해서 glass 기판위에 증착된 a-Si을 SPC 로 결정화 시킨 후 TFT를 제작하고 평가하였다. 또한 TFT 형성시에 저온공정을 실현하기 위해서 소스/드레인 영역에 실리사이드를 형성시켰다. 소자 제작시의 최고온도는 $500^{\circ}C$ 이하에서 공정을 진행하는 저온 공정을 실현하였다. Glass 기판위에 a-Si이 80 nm 증착된 기판을 퍼니스에서 24시간 동안 N2 분위기로 약 $600^{\circ}C$ 에서 결정화를 진행하였다. 노광공정을 통하여 Active 영역을 형성시키고 E-beam evaporator를 이용하여 약 70 nm 의 Pt를 증착시킨 후, 소스와 드레인 영역의 실리사이드 형성은 N2 분위기에서 $450^{\circ}C$, $500^{\circ}C$, $550^{\circ}C$에서 열처리를 통하여 형성하였다. 게이트 절연막은 스퍼터링을 이용하여 SiO2를 약 15 nm 의 두께로 증착하였다. 게이트 전극의 형성을 위하여 E-beam evaporator 을 이용하여 약 150 nm 두께의 알루미늄을 증착하고 노광공정을 통하여 게이트 영역을 형성 후 에 $450^{\circ}C$, H2/N2 분위기에서 약 30분 동안 forming gas annealing (FGA)을 실시하였다. 제작된 소자는 실리사이드 형성 온도에 따라서 각각 다른 특성을 보였으며 $450^{\circ}C$에서 실리사이드를 형성시킨 소자는 on currnet와 SS (Subthreshold Swing)이 가장 낮은것을 확인하였다. $500^{\circ}C$$550^{\circ}C$에서 실리사이드를 형성시킨 소자는 거의 동일한 on current와 SS값을 나타냈다. 이로써 glass 기판위의 SB-TFT 제작 시 실리사이드 형성의 최적온도는 $500^{\circ}C$로 생각되어 진다. 위의 결과를 토대로 본 연구에서는 SPC 결정화 방법을 이용하여 SB-TFT를 성공적으로 제작 및 평가하였고, 차세대 디스플레이에 적용할 경우 우수한 특성이 기대된다.

  • PDF

Fabrication of a robust, transparent, and superhydrophobic soda-lime glass

  • Rahmawan, Yudi;Kwak, Moon-Kyu;Moon, Myoung-Woon;Lee, Kwang-Ryeol;Suh, Kahp-Yang
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.02a
    • /
    • pp.86-86
    • /
    • 2010
  • Micro- and nanoscale texturing and control of surface energy have been considered for superhydrophobicity on polymer and silicon. However these surfaces have been reported to be difficult to meet the robustness and transparency requirements for further applications, from self cleaning windows to biochip technology. Here we provided a novel method to fabricate a nearly superhydrophobic soda-lime glass using two-step method. The first step involved wet etching process to fabricate micro-sale patterns on soda-lime glass. The second step involved application of $SiO_x$-incorporated DLC to generate high intrinsic contact angle on the surface using chemical vapor deposition (CVD) process. To investigate the effect of surface roughness, we used both positive and negative micro-scale patterns on soda-limeglass, which is relatively hard for surface texturing in comparison to quartz or Pyrex glasses due to the presence of impurities, but cheaper. For all samples we tested the static wetting angle and transparency before and after 100 cycles of wear test using woolen steel. The surface morphology is observed using optical and scanning electron microscope (SEM). The results shows that negative patterns had a greater wear resistance while the hydrophobicity was best achieved using positive patterns having static contact angle up to 140 deg. with about 80% transparency. The overall experiment shows that positive patterns at etching time of 1 min shows the optimum transparency and hydrophobicity. The optimization of micro-scale pattern to achieve a robust, transparent, superhydrophobic soda-lime glass will be further investigated in the future works.

  • PDF

A Study for the Characteristic Changes under the Repeated Thermal Exposure in the Process of Repairing Aircraft Sandwich Structures (항공기용 복합재 샌드위치부품의 수리시 열간노출에 따른 물성변화에 관한 연구)

  • 최병근;김돈원;김윤해
    • Proceedings of the Korean Society For Composite Materials Conference
    • /
    • 2001.10a
    • /
    • pp.105-110
    • /
    • 2001
  • Autoclave curing using the vacuum bagging method is widely used for the manufacture of advanced composite prepreg airframe structures. Due to increasing use of advanced composites, specific techniques have been developed to repair damaged composite structures. In order to repair the damaged part, it is required that the damaged areas be removed, such as skin and/or honeycomb core, by utilizing the proper method and then repairing the area by laying up prepreg (and core) then curing under vacuum using the vacuum bagging materials. It shall be cured either in an oven or autoclave per the original specification requirements. Delamination can be observed in the sound areas during and/or after a couple times exposure to the elevated curing temperature due to the repeated repair condition. This study was conducted for checking the degree of degradation of properties of the cured parts and delamination between skin prepreg and honeycomb core. Specimens with glass honeycomb sandwich construction and glass/epoxy prepreg were prepared. The specimens were cured 1 to 5 times at $260^{circ}F$ in an autoclave and each additionally exposed 50, 100 and 150 hours in the $260^{circ}F$ oven. Each specimen was tested for tensile strength, compressive strength, flatwise tensile strength and interlaminar shear strength. To monitor the characteristics of the resin itself, the cured resin was tested using DMA and DSC. As a results, the decrease of Tg value were observed in the specific specimen which is exposed over 50 hrs at $260^{circ}F$. This means the change or degradative of resin properties is also related to the decrease of flatwise tensile properties. Accordingly, minimal exposure on the curing temperature is recommended for parts in order to prevent the delation and maintain the better condition.

  • PDF