• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.344-350
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• 2011

Higher integrated density in 3D ICs also brings the difficulties of routing, which can cause the routing failure or re-design from beginning. Hence, precise congestion estimation at the early physical design stage such as floorplan is beneficial to reduce the total design time cost. In this paper, an effective estimation method of routing congestion is proposed for 3D ICs at floorplan stage. This method uses synthesized virtual signal nets, power/ground network and clock network to achieve the estimation. During the synthesis, the TSV location is also under consideration. The experiments indicate that our proposed method had small difference with the estimation result got at the post-placement stage. Furthermore, the comparison of congestion maps obtained with our method and global router demonstrates that our estimation method is able to predict the congestion hot spots accurately.

• ETRI Journal
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• v.36 no.4
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• pp.643-653
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• 2014

To reduce interconnect delay and power consumption while improving chip performance, a three-dimensional integrated circuit (3D IC) has been developed with die-stacking and through-silicon via (TSV) techniques. The power supply problem is one of the essential challenges in 3D IC design because IR-drop caused by insufficient supply voltage in a 3D chip reduces the chip performance. In particular, power bumps and TSVs are placed to minimize IR-drop in a 3D power delivery network. In this paper, we propose a design methodology for 3D power delivery networks to minimize the number of power bumps and TSVs with optimum mesh structure and distribute voltage variation more uniformly by shifting the locations of power bumps and TSVs while satisfying IR-drop constraint. Simulation results show that our method can reduce the voltage variation by 29.7% on average while reducing the number of power bumps and TSVs by 76.2% and 15.4%, respectively.

• Proceedings of the Korean Information Science Society Conference
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• 2005.07a
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• pp.694-696
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• 2005

VLSI 셀 배치문제는 셀(노드)과 넷으로 구성된 회로를 최소의 비용과 제약조건을 만족하면서 칩 위에 배치하는 문제로 지금까지 여러가지 다양한 배치 알고리즘들이 제시되어왔다. 배치 알고리즘은 입력으로 회로정보를 받아서 결과를 숫자 데이터로 출력하기 때문에 알고리즘 개발자는 배치결과를 숫자 데이터로 분석할 수 밖에 없다. 이런 점에서 실험 결과에 대한 신뢰성 문제가 발생될 수 있는데 2003년 발표된 밴치마킹에 관한 논문[1]에 따르면 뛰어난 성능을 가진 대표적인 알고리즘들을 비교 분석한 결과 실제 최종 배치된 결과에서 셀들의 오버랩 현상과 균일하지 못한 배치 등 몇 가지 문제점들이 지적되었다. 본 논문에서는 이러한 문제점들을 해결하기 위해 알고리즘 개발자가 실험 결과를 가시화해서 직접 확인하고 분석할 수 있는 가시화 도구를 제안한다. 또한 가시화 도구는 결과분석을 통해 보다 향상된 알고리즘 개발에 도움을 주는 것을 목적으로 한다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.8
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• pp.74-83
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• 2002

In order to design a huge VLSI system, the scan testing methodology by employing scan flip-flops(cells) is a popular method to test those If chips. In this case, the connection order of scan cells are not important, and hence the order can be determined in the very final stage of physical design such as cell placement. Using this fact, we propose, in this paper, a scan cell reordering method which minimizes the length of wires for scan chain connections. Especially, our reordering method is newly proposed method in the case when the scan cells are grouped according to their clock domains. In fact, the proposed reordering method reduces the wire length about 13.6% more than that by previously proposed reordering method. Our method may also be applicable for reordering scan chains that have various constraints on the scan cell locations due to the chain grouping.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.32B no.5
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• pp.720-729
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• 1995

We proposed a XMESH(crossed-mesh) topology as a suitable interconnection for the massively parallel computer architectures, and presented performance analysis of the proposed interconnection topology. Horizontally, the XMESH has the same links as those of the toroidal mesh(TMESH) or toroid, but vertically, it has diagonal cross links instead of the vertical links. It reveals desirable interconnection characteristics for the massively parallel computers as the number of nodes increases, while retaining the same structural advantages of the TMESH such as the symmetric structure, periodic placement of subsystems, and constant degree, which are highly recommended features for VLSI/WSI implementations. Furthermore, n*k XMESH can be easily expanded without increasing the diameter as long as n.leq.k.leq.n+4. Analytical performance evaluations show that the XMESH has a shorter diameter, a shorter mean internode distance, and a higher message completion rate than the TMESH or the diagonal mesh(DMESH). To confirm these results, an optimal self-routing algorithm for the proposed topology is developed and is used to simulate the average delay, the maximum delay, and the throughput in the presence of contention. In all cases, the XMESH is shown to outperform the TMESH and the DMESH regardless of the communication load conditions or the number of nodes of the networks, and can provide an attractive alternative to those networks in implementing massively parallel computers.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.571-574
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• 2008

In this paper, we propose $256{\times}256$ pixel array fingerprint sensor with an advanced circuits for detecting. The pixel level simple detection circuit converts from a small and variable sensing current to binary voltage out effectively. We minimizes an electrostatic discharge(ESD) influence by applying an effective isolation structure. The sensor circuit blocks were designed and simulated in standard CMOS $0.35{\mu}m$ process. Full custom layout is performed in the unit sensor pixel and auto placement and routing is performed in the full chip.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.3
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• pp.531-536
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• 2009

In this paper, we propose $256{\times}256$ pixel array fingerprint sensor with an advanced circuits for detecting. The pixel level simple detection circuit converts from a small and variable sensing current to binary voltage out effectively. We minimizes an electrostatic discharge(ESD) influence by applying an effective isolation structure around the unit pixel. The sensor circuit blocks were designed and simulated in standard CMOS $0.35{\mu}m$ process. Full custom layout is performed in the unit sensor pixel and auto placement and routing is performed in the full chip.