• Transactions of the KSME C: Technology and Education
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• v.3 no.4
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• pp.265-271
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• 2015

The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.553-556
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• 2000

The paper deals with the dynamic response of non-uniform beams subjected to a moving mass. In the dynamic analysis, the effects of inertia force, elastic force, centrifugal force, Coriolis force and self weight due to moving mass are taken into account. Galerkin's mode summation method is applied for the discretized equations of notion. Numerical results for the dynamic response of the non-uniform beam under a moving mass having various magnitudes and velocities are investigated. Experimental results have a good agrement with predictions

• Journal of the Korean Society for Precision Engineering
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• v.28 no.1
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• pp.63-72
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• 2011

In recent years, hot-stamped components are more increasingly used in the automotive industry in order to reduce weight and to improve the strength of vehicles. In hot stamping process, blank is hot formed and press hardened in a tool. However, in hot stamping without cooling channel, temperature of the tool increases gradually in mass production thus cannot meet the critical cooling rate to obtain high strength over 1500MPa. Warpage occurs in the hot stamped component due to non-uniform stress state caused by unbalanced cooling. Therefore, tools should be uniformly as well as rapidly cooled down by the coolant which flows through cooling channel. In this paper, optimal design method of cooling channel to obtain uniform and high strength of the component is proposed. Optimized cooling channel is applied to the hot press V-bending process. As a result of measuring strength, hardness and microstructure of the hot formed parts, it is known that the design methodology of cooling channel is effective to the hot stamping process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.133-134
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.969-970
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.147-148
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.129-130
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• 2009

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.11
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• pp.1525-1533
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• 2003

In the precision hot plate for wafer processing, uniform temperature of the upper plate is one of key factors affecting the quality of wafers. The state-of-the-art precision hot plates require temperature Variations less than $\pm$0.4$^{\circ}C$ during heating to 15$0^{\circ}C$, Which is difficult to be obtained only by the improvement of manufacturing techniques alone. In this study, computer aided heat transfer analysis was carried out to obtain the temperature distribution of the currently used reference hot plate for 200mm wafer. The analysis on the reference model assuming constant heat generation rate and uniform heating area showed total variation of 0.926$^{\circ}C$ at 15$0^{\circ}C$. One of the new design approaches based on the change of heating location together with different heat generation rate resulted in total variation of 0.297$^{\circ}C$ which is a 68% improvement compared to that of the reference model.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.667-670
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• 2002

Uniform metal-droplet deposition using laser is analyzed. Using the variation principle and modeling the semi-solid phase as a non-Netwonian slurry, this model can greatly save the computational expenses that conventional numerical procedures have suffered from. The simulation results revealed that the developed model could reasonably describe the collision behavior of molten metal with solid surface. Simulations were made with variation of the falling distance and time.