• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1994.03a
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• pp.192-200
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• 1994

• Progress in Superconductivity and Cryogenics
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• v.24 no.1
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• pp.13-17
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• 2022

The mechanical properties of REBCO coated conductor (CC) tapes under uniaxial tension are mainly determined by the thick layer Components like the substrate and the stabilizer. Depending on the applications of the CC tapes, it is also needed to externally reinforce thin metallic foils to one side or both sides of the CC tapes. This study investigated the effect of additional stabilizer layers or lamination on the electrical resistivity and electromechanical properties in RCE-DR processed GdBCO CC tapes with different structures. The strain/stress tolerance of I_c in differently processed 12 mm-wide REBCO CC tapes under uniaxial tension at 77 K and self-field could be determined by the loading-unloading scheme. As a result, Sn-Cu stabilized CC tape showed a significant decrease in mechanical properties due to its soft but thick stabilizing layer. However, similar electromechanical properties have been observed on both Sn-Cu and Sn-stabilized CC tapes, the I_c degradation behavior was independent of whether the CC tape has an external reinforcement or different stabilizing layers.

• Journal of Power System Engineering
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• v.9 no.4
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• pp.96-101
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• 2005

Magnesium alloys have been widely used for many structural components of automobiles and aircraft because of high specific strength and good cast ability in spite of hexagonal closed-packed crystal structure of pure magnesium. In this study, uniaxial tension tests at high temperature and creep tests are done in order to investigate the characteristics of high temperature and mechanisms for creep deformation of AZ31 Mg alloy. Yield stress and ultimate tensile stress decreased with increasing temperature, but elongation increased from results of uniaxial tension test at high temperature. The apparent activation energy Qc, the applied stress exponent n and rupture life have been determined during creep of AZ31 Mg alloy over the temperature range of 473K to 573K and stress range of 23.42 MPa to 93.59 MPa, respectively, in order to investigate the creep behavior. Constant load creep tests were carried out in the equipment including automatic temperature controller, whose data are sent to computer. At around the temperature of $473K{\sim}493K$ and under the stress level of $62.43{\sim}93.59%MPa$, and again at around the temperature of $553K{\sim}573K$ and under the stress level of $23.42{\sim}39.00MPa$, the creep behavior obeyed a simple power-law relating steady state creep rate to applied stress and the activation energy for the creep deformation was nearly equal, respectively, and a little low to that of the self diffusion of Mg alloy including aluminum. Also rupture surfaces at high temperature have had bigger dimples than those at lower temperature by SEM.

• Tunnel and Underground Space
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• v.10 no.1
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• pp.70-79
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• 2000

We carried out NPT-ensemble (constant-number of particles, pressure, and temperature) Molecular Dynamics (MD) simulations for measuring strength anisotropy under uniaxial compressive stress rotated to the crystallographic axes in $\alpha$-quartz. Uniaxial compressive strengths of a single quartz crystal were measured in directions of the a- and c-axis. Measured uniaxial strength of a single quartz crystal was higher in the direction parallel to the c-axis than that measured in the direction normal to the c-axis. However the reverse was found in calculated uniaxial strengths by MD simulation. The contradictive result of strengths was observed in both cases but was found to be different in origin. Strength anisotropy of defectless $\alpha$-quartz crystal in MD simulation is basically caused by structural difference of quartz. By contrast, anisotropy of measured strength in the uniaxial compression test is related to oriented micro-defects developed during crystal growth.

• Progress in Superconductivity and Cryogenics
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• v.18 no.4
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• pp.21-24
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• 2016

The mechanical properties of REBCO coated conductor (CC) wires under uniaxial tension are largely determined by the thick component layers in the architecture, namely, the substrate and the stabilizer or even the reinforcement layer. Depending on device applications of the CC tapes, it is necessary to reinforce thin metallic foils externally to one-side or both sides of the CC tapes. Due to the external reinforcement of brass foils, it was found that this could increase the reversible strain limit from the Cu-stabilized CC tapes. In this study, the effects of differently hardened brass foil laminate on the electromechanical property of CC tapes were investigated under uniaxial tension loading. The tensile strain dependence of the critical current ($I_c$) was measured at 77 K and self-field. Depending on whether the $I_c$ of CC tapes were measured during loading or after unloading, a reversible strain (or stress) limit could be determined, respectively. The both-sides of the Cu-stabilized CC tapes were laminated with brass foils with different hardness, namely 1/4H, 1H and EH. From the obtained results, it showed that the yield strength of the brass laminated CC tapes with EH brass foil laminate was comparable to the one of the Cu-stabilized CC tape due to its large yield strength even though its large volume fraction. It was found that the brass foil with different hardness was mainly sensitive on the stress dependence of $I_c$, but not on the strain sensitivity due to the residual strain induced in the laminated CC tapes during unloading.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.12
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• pp.2565-2573
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• 2002

A basic research was performed to ensure the usefulness of Small Punch-creep(SP-creep) test for residual life evaluation of heat resistant components effectively. This paper presents analytical results of initial stress and strain distributions in SP specimen caused by constant loading for SP-creep test and its experimental correlations with uniaxial creep(Ten-creep) test on 9Cr1MoVNb steel. It was shown that the initial maximum equivalent stress, ${\sigma}_{eq{\cdot}max}$ from FE analysis was correlated with steady-state equivalent creep strain rate, ${\epsilon}_{qf-ss'}$ rupture time, $t_r$, activation energy, Q and Larson-Miller Parameter, LMP during SP-creep deformation. The simple correlation laws, ${\sigma}_{sp}-{\sigma}_{TEN}$, $P_{sp}-{\sigma}_{TEN}\; and\; Q_{sp}-Q_{TEN}$ adopted to established a quantitative correlation between SP-creep and Ten-creep test data. Especially, the activation energy obtained from SP-creep test is linearly related to that from Ten-creep test at $650^{\circ}C$ as follows : $Q_{SP-P}\;{\risingdotseq}\;1.37 \;Q_{TEN},\; Q_{SP-{\sigma}}{\risingdotseq}1.53\; Q_{TEN}$.

• Transactions of Materials Processing
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• v.23 no.5
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• pp.289-296
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• 2014

Uniaxial tensile tests were conducted to accurately evaluate the in-plane mechanical properties of fiber metal laminates (FMLs). The FMLs in the current study are comprised of a layer of self-reinforced polypropylene (SRPP) sandwiched between two layers of aluminum alloy 5052-H34. The nonlinear tensile behavior of the FMLs under in-plane loading conditions was investigated using both numerical simulations and a theoretical analysis. The numerical simulation was based on finite element modeling using the ABAQUS/Explicit code and the theoretical constitutive model was based on the volume fraction approach using the rule of mixture and a modification of the classical lamination theory, which incorporates the elastic-plastic behavior of the aluminum alloy and the SRPP. The simulations and the model are used to predict the inplane mechanical properties such as stress-strain response and deformation behavior of the FMLs. In addition, a post-stretching process is used to reduce the thermal residual stresses before uniaxial tensile testing of the FMLs. Through comparison of both the numerical simulations and the theoretical analysis with the experimental results, it is concluded that the numerical simulation model and the theoretical approach can describe with sufficient accuracy the actual tensile stress-strain behavior of the FMLs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.146-152
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• 2014

The temperature dependence of strain-enhanced electron mobility in nMOSFETs is investigated by using a self-consistent Schr$\ddot{o}$dinger-Poisson solver. The calculated results suggest that vertical compressive stress is more efficient to maintain the strain-enhanced electron mobility than longitudinal tensile stress in high temperature condition.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.118-121
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• 2007

Bulk metallic glass (BMG)/crystalline composites comprising a copper based BMG alloy and crystalline nickel were produced by means of eloctroless plating of nickel on $Cu_{54}Zr_{22}Ti_{18}Ni_6$ BMG powder and subsequent consolidation using spark plasma sintering. The plastic deformation behavior of BMG/crystalline composites was examined by uniaxial compression test at various temperatures in the supercooled liquid region (SLR) of the BMG alloy. The evolution of strain states during uniaxial compression was tackled by microstructure observations. Deformation temperature played an important role in the deformation behavior of BMG/crystalline composites, which was attributed to a strong temperature dependence of the flow stress of the BMG alloy in the SLR. BMG/crystalline composites deformed homogenously in the temperature range where the flow stress of the BMG alloy was close to that of crystalline nickel. In contrast, inhomogeneous deformation was observed in the temperature range where the flow stress of the BMG alloy largely differs from that of crystalline nickel.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.4
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• pp.180-184
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• 2020

The crystallographic texture plays an important role in both the plastic deformation and the macroscopic anisotropy of magnesium alloys. In previous study for AZ80 magnesium alloy, it was found that the main texture components of the textures vary with the deformation conditions at high temperatures. Also, the basal texture was formed at stress of more than 15-20 MPa and the non-basal texture was formed at stress of less than 15-20 MPa. Therefore, in this study, uniaxial compression deformation of AZ80 magnesium alloy was carried out at high temperature (stress of 15-20 MPa). The uniaxial compression deformation is performed at temperature of 723 K and strain rate 3.0 × 10^-3s^-1, with a strain range of between -0.4 and -1.3. Texture measurement was carried out on the compression planes by the Schulz reflection method using nickel filtered Cu Kα radiation. EBSD measurement was also conducted in order to observe spatial distribution of orientation. As a result of high temperature deformation, the main component of texture and its development vary depending on deformation condition of this study.