• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.76-76
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• 2009

눈부신 전자산업의 발달로 대부분의 전자제품이 다기능/경박단소화 되고 있어, 고밀도 실장 기술인 양면 표면실장과 고집적 패키징 기술인 패키지 적층 공정의 적용이 점차 확대되고 있다. 따라서 양면 표면실장 및 패키지 적층 공정에 사용되는 저온 접합용 무연 솔더 즉, $183^{\circ}C$(Sn-37Pb 공정 솔더 융점) 이하의 융점을 가지는 저온 무연 솔더에 대한 관심이 높아지고 있다. 한편, 미세피치 적용 분야에 있어 ACF/P를 이용한 COG 접속 분야 외에도 최근 저온 접합용 무연 솔더를 이용한 접속 분야가 각광을 받고 있다. 따라서, 접속피치 미세화에 대응하기 위해 스크린 인쇄성을 향상시킬 수 있는 저온 무연 솔더 paste 제조 및 공정 기술의 개발이 필요한 실정이다. 현재 대표적인 저온 무연 솔더 조성은 Sn-Bi계($138^{\circ}C$ 융점)와 Sn-In계($120^{\circ}C$ 융점)이다. 하지만, 이들 조성의 신뢰성 등에 있어 개선의 여지가 있으므로 이를 해결하기 위한 무연솔더 조성의 개발이 필요하다. 이와 같은 관점에서, 본 연구는 $137^{\circ}C$의 융점을 갖는 Sn-57.6Ag-0.4Ag 저온 무연 솔더 paste를 $217^{\circ}C$의 융점을 갖는 Sn-3.0Ag-0.5Cu 솔더 paste와 비교하여 인쇄성, reflow 특성, void inspection, 미세조직 관찰 및 underfill 적용 등의 실험을 실시하였다.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.150-155
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• 2009

A shaft for laser printers has to be produced with high dimensional accuracy of a few micrometers. Most companies produce the shaft, therefore, by machining. These days, forging process is tried to be employed in manufacturing the shaft for productivity. In this study, the dimensional inaccuracy of straightness is studied and the underfill is not focused because the shaft shape is simple and the load capacity of press is sufficient. The straightness and concentricity of the shaft is important for the operation of a laser printer. Many design parameters such as preform shapes, tooling dimensions, forging load, and billet geometries may affect on the dimensional accuracy. In the forging process of shafts, a billet which is cut from wires is used. The billet, therefore, may be a little bit curved but not always straight. The elastic recovery is considered to cause the dimensional inaccuracy. Therefore, the effect of the forging load on the elastic recovery and straightness is investigated through the finite element analyses using DEFORM-3D and ABAQUS.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1322-1327
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• 2007

Many automotive companies have tried to apply the aluminum alloy sheet to car body because reducing the car weight can improve the fuel efficiency of vehicle. In order to do that, sheet materials require of weldablity, formability, productivity and so on. Aluminum alloy was not easy to join these metals due to its material properties. Thus, the laser is good heat source for aluminum alloy welding because of its high heat intensity. However, the welding quality was not good by porosity, underfill, and magnesium loss in welded metal for AA5182 aluminum alloy. In this study, Nd:YAG laser welding of AA 5182 with filler wire AA 5356 was carried out to overcome this problem. The weldability of AA5182 laser welding with AA5356 filler wire was investigated in terms of tensile strength and Erichsen ratio. For full penetration, mechanical properties were improved by filler wire. In order to optimize the process parameters, model to estimate tensile strength by artificial neural network was developed and fitness function was defined in consideration of weldability and productivity. Genetic algorithm was used to search the optimal point of laser power, welding speed, and wire feed rate.

• Transactions of Materials Processing
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• v.24 no.5
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• pp.340-347
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• 2015

Multi-pass shape drawing is used to manufacture long products of arbitrary cross-sectional shapes. This process allows smooth surface finishes and closely controlled dimensions of the cross-sectional shape. Tube shape drawing for hollow type products provides material savings and weight reduction. The intermediate die shapes are very important in multi-pass tube shape drawing. In the current paper, the design method for the intermediate dies in a tube shape drawing process is developed using a die offset for corner filling (DOCF) method. Underfill defects are related to the radial velocity distribution of each divided section in the deformation zone. The developed intermediate die shape design was applied to the two-pass tube shape drawing with fixed mandrel for manufacturing a hollow linear motion (LM) guide rail. The proposed design method led to uniform and steady metal flow at each divided section. FE-simulations and experiments were conducted to validate the effectiveness of the proposed method in multi-pass tube shape drawing process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.4
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• pp.123-129
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• 2018

A rotational drawing die which can form a long tube with spiral grooves on the surface is presented. The main feature of the proposed die is a rotation insert that is embedded into the die container for the die to freely rotate with respect to the drawing centerline as the materials are drawn. We employed a three-dimensional finite element model to investigate the effects of the rotational die on the material filling of spiral grooves. The material used in the finite element analysis was stainless 304. We also performed a pilot drawing test to verify the usefulness of the proposed rotational drawing die. Results reveal that the material filling of spiral grooves by the proposed rotational drawing die was in good agreement for both the finite element analysis and the drawing test. We found that the underfill in a conventional drawing die was reduced in the proposed rotational drawing die.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.93-101
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• 2007

Aluminum alloy which is one of the light materials has been tried to apply to light weight vehicle body. In order to do that, welding technology is very important. In case of the aluminum laser welding, the strength of welded part is reduced due to porosity, underfill, and magnesium loss. To overcome these problems, laser welding of aluminum with filler wire was suggested. In this study, experiment about laser welding of AA5182 aluminum alloy with AA5356 filler wire was performed according to process parameters such as laser power, welding speed and wire feed rate. The tensile strength was measured to find the weldability of laser welding with filler wire. The models to estimate tensile strength were suggested using three regression models and one neural network model. For regression models, one was the multiple linear regression model, another was the second order polynomial regression model, and the other was the multiple nonlinear regression model. Neural network model with 2 hidden layers which had 5 and 3 nodes respectively was investigated to find the most suitable model for the system. Estimation performance was evaluated for each model using the average error rate. Among the three regression models, the second order polynomial regression model had the best estimation performance. For all models, neural network model has the best estimation performance.