• 제목/요약/키워드: UHV

검색결과 208건 처리시간 0.029초

마이크로 전자빔 시스템을 위한 전자광학렌즈의 제작에 의한 나노 패턴 형성 (Nano-scale pattern delineation by fabrication of electron-optical lens for micro E-beam system)

  • 이용재;박정영;전국진;국양
    • 전자공학회논문지D
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    • 제35D권9호
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    • pp.42-47
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    • 1998
  • 현재의 전자빔 묘화의 한계를 극복할 수 있는 마이크로 전자빔 시스템의 전자 광학 렌즈를 제작하였고 전자빔 묘화실험을 통하여 이를 검증하였다. 마이크로머시닝기술을 이용하여 실리콘 전극을 제작하고 이를 양극 접합을 통해 조립하여 다층 전극의 전자 광학 렌즈를 제작하였다. 완성된 전자 광학 소자를 초고진공 챔버에 장착하여, STM(Scanning Tunneling Microscope) 팁에서 방출된 전자빔의 focusing 특성을 관찰하였으며 전자를 집속하여 리소그라피를 수행하였다. E-beam 감광막은 PMMA(Poly-methylmethacrylate)를 사용하였고 0.13㎛의 패턴을 형성시킬 수 있었다.

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RF-Magnetron sputtering법을 이용한 ZnO buffer layer가 ZnO:(Al,P) 박막의 미세구조에 미치는 영향

  • 신승학;김종기;이준형;허영우;김정주
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.266.2-266.2
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    • 2016
  • 최근 디스플레이 산업의 확대에 따라 투명 전도 산화물(Transparent Conducting Oxides:TCOs)의 수요가 급증하고 있다. 이 중 ZnO는 wide bandgap (3.37eV)와 large exciton binding energy (60meV)의 값을 가져 차세대 투명 전도 산화물, LED와 LD 등의 소자 소재로 각광받고 있다. ZnO는 electron을 내어놓는 native defect 때문에 기본적으로 n-type 물성을 띈다. 그래서 dopant를 이용해 p-type ZnO를 제작할 때 native defect를 줄이는 것이 중요한 요점이 된다. 이 때 buffer layer를 사용하여 native defect를 줄이는 방법이 사용되고 있다. 본연구에서는 RF-magnetron sputtering법을 이용하여 c-plane sapphire 기판 위에 다양한 조건의 ZnO buffer layer를 증착하고, 그 위에 ZnO:(Al,P) co-doping한 APZO를 증착하였다. ZnO buffer layer 증착조건의 변수는 증착온도와 Ar:O2의 비율을 변수로 두었다. 이러한 박막을 FE-SEM, XRD, Hall effect measurement, AFM을 통하여 미세구조와 물성을 관찰하였다. 이 때 APZO보다 낮은 증착온도에서 ZnO buffer layer가 증착되면 APZO를 증착하는 동안 chamber 내부에서 열처리하는 효과를 얻게 되고, UHV(Ultra High Vaccum)에서 열처리 될 때 ZnO buffer layer의 mophology와 결정성이 변하게 되는 모습을 관찰아혔다. 또한 본 실험을 통해 ZnO buffer layer의 증착 온도가 APZO의 증착온도보다 높을 때 제어 가능한 실험이 됨을 확인 할 수 있었다.

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Si 및Si$_{0.7}$Ge$_{0.3}$ 박막의 표현형태 및 조도의 전개 (Evolution of surface morphology and roughness in Si and $_{0.7}$Ge$_{0.3}$ thin fimls)

  • 이내웅
    • 한국표면공학회지
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    • 제31권6호
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    • pp.345-358
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    • 1998
  • The evolution of surface roughness and morphology in epitaxial Si and $Si_{0.7}Ge{0.3}$ alloys grown by UHV opm-beam sputter deposition onto nominally-singular, [100]-, and [110]-mi-scut Si(001) was investigated by stomic force microscopy and trasmission electron microscopy. The evolution of surface roughness of epitaxial Si films grown at $300^{\circ}C$ is inconsistent with conventional scaling and hyperscaling laws for kineti roughening. Unstable growth leading to the formation of mounds separated by a well-defined length scale is observed on all substrates. Contraty to previous high-temperature growth results, the presence of steps during deposition at $300^{\circ}C$ increases the tendency toward unstable growth resulting in a much earlier development of mound structures and larger surface roughnesses on vicival substrates. Strain-induced surface roughening was found to dominate in $Si_{0.7}Ge{0.3}$ alloys grown on singular Si(001) substrates at $T_S\ge450^{\circ}C$ where the coherent islands are prererentially bounded along <100> directions and eshibt {105} facetting. Increasing the film thickness above critical values for strain relaxation leads to island coalescence and surface smoothening. At very low growth temperatures ($T_s\le 250^{\circ}C$), film surfaces roughen kinetically, due to limited adatom diffusiviry, but at far lower rates than in the higher-temperature strain-induced regime. There is an intermediate growth temperature range, however, over which alloy film surfaces remain extremely smooth even at thicknesses near critical values for strain relaxation.

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초고진공 전자 사이클로트론 화학 기상 증착 장치에 의한 저온 실리콘 에피 성장에 기판 DC 바이어스가 미치는 영향 (The Effect of Substrate DC Bias on the Low -Temperature Si homoepitaxy in a Ultrahigh Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition)

  • 태흥식;황석희;박상준;윤의준;황기웅;송세안
    • 한국진공학회지
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    • 제2권4호
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    • pp.501-506
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    • 1993
  • The spatial potential distribution of electron cyclotron resonance plasma is measured as a function of tehsubstrate DC bias by Langmuir probe method. It is observed that the substrate DC bias changes the slope of the plasma potential near the subsrate, resulting in changes in flux and energy of the impinging ions across plasma $_strate boundary along themagnetric field. The effect of the substrate DC bias on the low-temperature silicon homoepitaxy (below $560^{\circ}C$) is examine dby in situ reflection high energy electron diffraction (RHEED), cross-section transmission electron microscopy (XTEM),plan-view TEM and high resolution transmision electron microscopy(HRTEM). While the polycrystalline silicon layers are grow withnegative substrate biases, the single crystaline silicon layers are grown with negative substrate biases, the singel crystalline silicon layers are grown with positive substrate biases. As the substrate bias changes form negative to positive values, the growth rate decreases. It is concluded that the control of the ion energy during plasma deposition is very important in silicon epitaxy at low temperatures below $560^{\circ}C$ by UHV-ECRCVD.VD.

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초고압용 폴리머 애자의 산불영향 연구 (A study of the Influence of Forest Fire on Polymer Insulator for UHV)

  • 최인혁;최장현;정윤환;이동일
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 2005년도 춘계학술대회논문집
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    • pp.254-259
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    • 2005
  • Big fire such as mountain fire my cause the prevention of the functions of the overhead cables and insulators, which may affect the operation of the transmission lines. Therefore, in order to understand the effect of the mountain fire on the polymeric insulator for transmission lines, the author observed the deformation of the sheds of the polymeric insulators and the change of the discs of the porcelain insulators under fire, and investigated the electrical and mechanical characteristics of the insulators after the ignition test. As the result the following conclusions were obtained. First, the porcelain insulator was degraded in electrical characteristics when the insulator was subjected to the fire for approximately 5 minutes; whereas, the polymeric insulator was not degraded though there were some damage on its sheds. Second, after 20 minute exposure to the fire, the polymeric insulator lost a lot of parts of sheds, but the electrical characteristics was lowered by around 20%, but the porcelain insulators were electrically degraded by more than 80%.

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광전류를 이용한 n-ZnO/p-Si과 n-ZnO/p-GaN p-n 접합 다이오드의 결함 분석

  • 조성국;남창우;김은규
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.178-178
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    • 2013
  • 고체내의 결함을 분석하기 위한 장비로는 대표적으로 DLTS (deep level transient spectroscopy)를 이용하여 깊은 준위 결함의 활성화에너지를 구하는 분석법, 투과전자현미경을 이용한 박막의 결정살창 분석법, photoluminescence나 electroluminescence를 이용하여 광학적인 방법으로 결함을 분석하는 방법, 마지막으로 광전류 측정을 통하여 결함을 분석하는 방법 등이 있다. 이 중에서도 빛에 의해서 증가되는 광전류를 이용한 결함 분석 방법은 과거에는 종종 시행되어 왔으나 최근에는 거의 연구되어지고 있지 않고 있다. 고체 내의 많은 결함들이 빛에만 반응하는 결함도 있으며 전기적인 측정을 통해서만 발견되는 결함이 존재하기 때문에 모든 부분을 다 만족시키는 방법은 찾기가 힘들다고 알려져 있다. 한편, ZnO는 octahedral 구조로 공간이 비어있기 때문에 여러 가지 결함이 존재하는데, 그 중에서 valence band 바로 위 0.3~0.5 eV에 존재하는 결함 준위는 Zn 빈자리에 의한 결함으로 이론적으로만 밝혀졌을 뿐 실험적으로는 현재까지 발견되어지고 있지 않다. 본 연구에서는 광전류를 이용하여 n-ZnO/p-Si과 n-ZnO/p-GaN p-n 접합 다이오드 내의 결함에 대한 연구를 진행하였다. ZnO를 UHV 스퍼터링 방법으로 성장하였으며 ZnO의 결함의 양을 조절하기 위해 박막의 두께와 증착할 때의 기판 속도 등을 조절하였다. 이렇게 성장된 ZnO 기반의 다이오드를 광전류 측정을 이용하여 결함을 분석하였다. 실험결과 420 nm 파장의 빛을 다이오드에 주사하였을 때 광전류가 크게 증가하는 것을 확인하였으며 이것은 이론적으로만 주장되어져 왔던 Zn 빈자리 결함에 의한 것으로 판단되었다.

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초고압 가스차단부의 냉가스 유동해석 (An Analysis of Cold Gas Flow-Field for UHV Class Interrupters)

  • 송기동;박경엽;송원표
    • 대한전기학회논문지:전기기기및에너지변환시스템부문B
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    • 제49권6호
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    • pp.387-394
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    • 2000
  • This paper presents a method of cold gas flow-field analysis within puffer type GCB(Gas Circuit Breaker). Using this method, the entire interruption process including opening operation of GCB can be simulated successfully. In particular, the distortion problem of the grid due to the movement of moving parts can be dealt with by the fixed grid technique. The gas parameters such as temperature, pressure, density, velocity through the entire interruption process can be calculated and visualized. It was confirmed that the time variation of pressure which was calculated from the application of the method to a model GCB agreed with the experimental one. Therefore it is possible to evaluate the small current interruption capability analytically and to design the interrupter which has excellent interruption capability using the proposed method. It is expected that the proposed method can reduce the time and cost for development of GCB very much. It also will be possible to develop the hot-gas flow-field analysis program by combining the cold-gas flow field program with the arc model and to evaluate the large current interruption capability.

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Ion Beam을 이용한 사파이어($Al_2O_3$) 표면개질 및 금(Au) 박막증착: 접합성 향상 및 접학기구에 대한 연구 (Ion beam induced surface modifications of sapphire and gold film deposition: studies on the adhesion enhancement and mechanisms)

  • 박재원;이광원;이재형;최병호
    • 한국진공학회지
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    • 제8권4B호
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    • pp.514-518
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    • 1999
  • Gold (Au) is not supposed to react with sapphire(single crystalline ) under thermodynamic equillibrium, therefore, a strong adhesion between these two dissimilar materials is not expected. However, pull test showed that the gold film sputter-deposited onto annealed and pre-sputtered sapphire exhibited very strong adhesion even without post-deposition annealing. Strongly and weakly adhered samples as a result of the pull testing were selected to investigate the adhesion mechanisms with Auger electron spectroscopy. The Au/ interfaces were analyzed using a new technique that probes the interface on the film using Auger electron escape depth. It revealed that one or two monolayers of Au-Al-O compound formed at the Au/Sapphire interface when AES in the UHV chamber. It showed that metallic aluminum was detected on the surface of sapphire substrates after irradiating for 3 min. with 7keV Ar+ -ions. These results agree with TRIM calculations that yield preferential ion-beam etching. It is concluded that the formation of Au-Al-O compound, which is responsible for the strong metal-ceramic bonding, is due to ion-induced cleaning and reduction of the sapphire surface, and the kinetic energy of depositing gold atoms, molecules, and micro-particles as a driving force for the inter-facial reaction.

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Photoemission Study on the Adsorption of Ethanol on Chemically Modified TiO2(001) Surfaces

  • Kong, Ja-Hyun;Kim, Yu-Kwon
    • Bulletin of the Korean Chemical Society
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    • 제32권8호
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    • pp.2531-2536
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    • 2011
  • Ethanol is a prototype molecule used in probing catalytic reactivity of oxide catalysts such as $TiO_2$. In the present study, we adsorbed ethanol on $TiO_2$(001) at room temperature (RT) and the corresponding bonding state of ethanol was systematically studied by x-ray photoemission spectroscopy (XPS) using synchrotron radiation. Especially, we compared $TiO_2$(001) surfaces prepared in ultra-high vacuum (UHV) with different surface treatments such as $Ar^+$-sputtering and oxidation with molecular $O_2$, respectively. We find that the saturation coverage of ethanol at RT varies depending on the amount of reduced surface defects (e.g., $Ti^{3+}$) which are introduced by $Ar^+$-sputtering. We also find that the oxidized $TiO_2$(001) surface has other type of surface defects (not related to Ti 3d state) which can dissociate ethanol for further reaction above 600 K. Our C 1s core level spectra indicate clearly resolved features for the two chemically distinct carbon atoms from ethanol adsorbed on $TiO_2$(001), showing the adsorption of ethanol proceeds without C-C bond dissociation. No other C 1s feature for a possible oxidized intermediate was observed up to the substrate temperature of 650 K.

초고압 송전선로용 V련 현수애자장치의 개발 (A Development of V type Suspension String Set for UHV Transmission Lines)

  • 손흥관;이형권;금의연;민병욱;최진성;최인혁
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 하계학술대회 논문집 A
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    • pp.497-499
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    • 2004
  • Due to a typhoon named MAEMI on Sep12, 2004, 7 transmission towers collapsed and 3 were damaged in the Gyeongnam and Busan areas. These caused long-term black-outs in Goeje-do. When a transmission tower collapses or is damaged, Construction will take more than 2 months and this will be accompanied by long-term black-outs. Therefore a temporary iron pole is used in such emergencies. Current temporary rehabilitation angle steel iron Pole consistes of around 800 members, 2,800 bolts and it takes about 5 days to construct a temporary transmission line. Consiquently wide black-outs occur during the construction of the temporary transmission line. To reduce black-out time, the construction period must be reduced as much as possible. This paper presents new methods to reduce temporary transmission line construction time to within 48 hours by applying a self-reliance assembling method instead of the current man power assembling method and by modulizing each angle steel with duralumin.

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