• Journal of Convergence Society for SMB
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• v.6 no.4
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• pp.71-77
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• 2016

In this paper, we proposed a verification of speaker change utilizing the KL distance based on GMM-UBM to improve the performance of conventional BIC based Speaker Change Detection(SCD). We have verified Conventional BIC-based SCD using KL-distance based SCD which is robust against difference of information volume than BIC-based SCD. And we have applied GMM-UBM to compensate asymmetric information volume. Conventional BIC-based SCD was composed of two steps. Step 1, to detect the Speaker Change Candidate Point(SCCP). SCCP is positive local maximum point of dissimilarity d. Step 2, to determine the Speaker Change Point(SCP). If ${\Delta}BIC$ of SCCP is positive, it decides to SCP. We examined verification of SCP using GMM-UBM based KL distance D. If the value of D on each SCP is higher than threshold, we accepted that point to the final SCP. In the experimental condition MDR(Missed Detection Rate) is 0, FAR(False Alarm Rate) when the threshold value of 0.028 has been improved to 60.7%.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.75-76
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• 2006

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.170-173
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• 2000

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.19-19
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• 2004

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.148-148
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• 1996

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.199-200
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• 2003

• Journal of the Korea Society of Computer and Information
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• v.25 no.12
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• pp.187-194
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• 2020

In today's process-oriented industries, such as semiconductor and petrochemical processes, autocorrelation exists between observed data. As a management method for the process where autocorrelation exists, a method of using the observations is to construct a batch so that the batch mean approaches to independence, or to apply the EWMA (Exponentially Weighted Moving Average) statistic of the observed value to the EWMA control chart. In this paper, we propose a method to determine the batch size of UBM (Unweighted Batch Mean), which is commonly used as a management method for observations, and a method to determine the optimal batch size based on ARL (Average Run Length) We propose a method to estimate the standard deviation of the process. We propose an improved control chart for processes in which autocorrelation exists.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.16 no.11
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• pp.3780-3797
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• 2022

The estimation of radio map (RM) is a fundamental and critical task for the network planning and optimization performance of mobile communication. In this paper, a RM estimation method is proposed based on a deep dual learning structure. This method can simultaneously and accurately reconstruct the urban building map (UBM) and estimate the RM of the whole cell by only part of the measured reference signal receiving power (RSRP). Our proposed method implements UBM reconstruction task and RM estimation task by constructing a dual U-Net-based structure, which is named RadioCycle. RadioCycle jointly trains two symmetric generators of the dual structure. Further, to solve the problem of interference negative transfer in generators trained jointly for two different tasks, RadioCycle introduces a dynamic weighted averaging method to dynamically balance the learning rate of these two generators in the joint training. Eventually, the experiments demonstrate that on the UBM reconstruction task, RadioCycle achieves an F1 score of 0.950, and on the RM estimation task, RadioCycle achieves a root mean square error of 0.069. Therefore, RadioCycle can estimate both the RM and the UBM in a cell with measured RSRP for only 20% of the whole cell.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.95-99
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• 2001

Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.