Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.19-19
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- 2004
(Effects of Varying Cu UBM Thickness on Electrodeposited Tin Microbumps)
전해도금된 Sn 미세범프에 미치는 Cu UBM 두께의 영향
- ;
- Jurenka Claudia (Fraunhofer IZM, Germany) ;
- Wolf Juergen (Fraunhofer IZM, Germany) ;
- ;
- Engelmann Gunter (Fraunhofer IZM, Germany)
- Published : 2004.11.01
Abstract
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