• Journal of Electrical Engineering and Technology
• /
• 제6권2호
• /
• pp.280-283
• /
• 2011

In the present work, a new approach is proposed for via interconnects of semiconductor devices, where multi-wall carbon nanotubes (MWCNTs) are used instead of conventional metals. In order to implement a selective growth of carbon nanotubes (CNTs) for via interconnect, the buried catalyst method is selected which is the most compatible with semiconductor processes. The cobalt catalyst for CNT growth is pre-deposited before via hole patterning, and to achieve the via etch stop on the thin catalyst layer (ca. 3nm), a novel 2-step etch scheme is designed; the first step is a conventional oxide etch while the second step chemically etches the silicon nitride layer to lower the damage of the catalyst layer. The results show that the 2-step etch scheme is a feasible candidate for the realization of CNT interconnects in conventional semiconductor devices.

• Journal of Electrical Engineering and Technology
• /
• 제6권2호
• /
• pp.233-238
• /
• 2011

In the present work, a new approach is proposed for via interconnects of semiconductor devices, where multi-wall carbon nanotubes (MWCNTs) are used instead of conventional metals. In order to implement a selective growth of carbon nanotubes (CNTs) for via interconnect, the buried catalyst method is selected which is the most compatible with semiconductor processes. The cobalt catalyst for CNT growth is pre-deposited before via hole patterning, and to achieve the via etch stop on the thin catalyst layer (ca. 3nm), a novel 2-step etch scheme is designed; the first step is a conventional oxide etch while the second step chemically etches the silicon nitride layer to lower the damage of the catalyst layer. The results show that the 2-step etch scheme is a feasible candidate for the realization of CNT interconnects in conventional semiconductor devices.

• 대한치과보철학회지
• /
• 제46권2호
• /
• pp.148-156
• /
• 2008

자가부식 접착제는 사용하기 쉽고, 술식 민감성이 적은 장점이 있으나 특히 산도가 약한 자가부식 접착제의 법랑질에 대한 결합력은 논란이 되고 있다. 본 연구에서는 2단계 자가부식 접착제인 Clearfil SE Bond (Kuraray, Okayama, Japan)의 연마 법랑질에 대한 미세인장 결합강도를 측정하여 3단계 산부식수세 접착제인 Scotchbond Multi-Purpose (3M ESPE, St. Paul, MN, USA) 및 1단계 자가부식 접착제인 iBond (Heraeus Kulzer Gmbh, Hanau, Germany)의 결합강도와 비교하고자 하였고, 2단계 자가부식 접착제에 산부식 전처리를 시행하는 것이 법랑질에 대한 결합강도를 높일 수 있는지 알아 보고자 하였다. 실험군은 2단계 자가부식 접착제인 Clearfil SE Bond만 사용한 비산부식 군과 35% 인산 (Scotchbond Etchant, 3M ESPE)으로 산부식 후 Clearfil SE Bond를 사용한 산부식 군, 그리고 1단계 자가부식 접착제인 iBond를 사용한 군으로 나누었다. 대조군은 3단계 산부식수세 접착제인 Scotchbond Multi-Purpose를 사용한 군으로 정하였다. Bovine 전치의 순면을 십자가형으로 4등분하여 각 군으로 무작위로 배분하였다. 각 치아의 순면을 800-grit 실리콘 카바이드 지로 연마한 후 삭제된 법랑질면에 제조사의 설명서에 따라 각 군의 접착제를 적용하고 Light-Core (Bisco)로 적층 충전하였다. 시편은 $37i{\acute{E}}$, 증류수에 일주일 동안 보관한 후 low speed precicion diamond saw (TOPMENT Metsaw-LS, R&B, Daejeon, Korea)를 이용하여 약 $0.8{\times}0.8mm$ 단면이 되도록 시편을 절단하여 미세시편을 제작하였다. 일주일마다 증류수를 교환하면서 한 달, 세 달 동안 $37i{\acute{E}}$, 증류수에 미세시 편을 보관한 후 각각의 미세인장결합강도를 측정하였다. 미세인장결합강도 (MPa)는 파절 시에 가해진 힘 (N)을 접착면적 ($mm^2$)으로 나누어 계산하였다. 접착계면에서의 파절 양상은 실물현미경 (Microscope-B nocular, Nikon)을 이용하여 분류하였다. 미세인장결합강도에 대한 통계분석은 one-way ANOVA를 이용하여 유의수준 5%에서 검정하였고, 사후감정은 Least Significant Difference 방법을 이용하였다. 중합 후 1개월 뒤 측정된 각각의 접착제의 평균 미세인장결합강도는 유의수준 5%에서 모든 접착제 간에 유의한 차이가 없었다. 3개월 뒤 측정된 각각의 접착제의 평균 미세인장결합강도는 유의수준 5%에서 iBond 와 Clearfil SE Bond 비산부식 군과 Scotchbond Multi- Purpose 간에는 각각 유의한 차이가 없었다. 본 연구에서는 2단계 자가부식 접착제인 Clearfil SE Bond의 연마 법랑질에 대한 미세인장결합강도가 3단계 산부식수세 접착제인 Scotchbond Multi-Purpose 와 비교하여 유의한 차이가 없었으며 (P>0.05), 3개월 후의 결과에서 Clearfil SE Bond 비산부식 군의 미세인장결합강도가 Clearfil SE Bond 산부식 군보다 유의하게 낮았다 (P<0.05). 즉 35% 인산으로 산부식 전처리를 시행한결과 Clearfil SE Bond 의 법랑질에 대한 결합강도가 증가하였다.

• The Journal of Advanced Prosthodontics
• /
• 제5권3호
• /
• pp.305-311
• /
• 2013

PURPOSE. Over the past years, the adhesion of fiber posts luted with simplified adhesive systems has been a matter of great interest. The aim of this study was to assess the post retentive potential of a self-adhesive resin cement using different adhesive systems to compare the push-out bond strengths of fiber posts. MATERIALS AND METHODS. The post spaces of 56 mandibular premolar roots were prepared and divided into 4 experimental groups and further divided into 2 subgroups according to testing time (n=7). The fiber posts (Rely X Fiber Post) were luted with a self-adhesive resin cement (RelyX Unicem) and one of the following adhesive systems: no adhesive, a total-etch adhesive resin (Single Bond), a two-step self-etch adhesive resin (Clearfil SE Bond) and a one-step self-etch adhesive resin (Clearfil S3 Bond). Each root was cut horizontally, and 1.5 mm thick six root segments were prepared. Push-out tests were performed after one week or three months (0.5 mm/min). Statistical analysis were performed with three-way ANOVA (${\alpha}$=.05). RESULTS. Cervical root segments showed higher bond strength values than middle segments. Adhesive application increased the bond strength. For one week group, the total-etch adhesive resin Single Bond showed higher bond strength than the self-adhesive resin cement RelyX Unicem applied without adhesive resin at middle region. For 3 months group, the two-step self-etch adhesive resin Clearfil SE Bond showed the highest bond strength for both regions. Regarding the time considered, Clearfil SE Bond 3 months group showed higher bond strength values than one week group. CONCLUSION. Using the adhesive resins in combination with the self-adhesive resin cement improves the bond strengths. The bond strength values of two-step self-etch adhesive resin Clearfil SE Bond improved as time passes.

• Restorative Dentistry and Endodontics
• /
• 제40권1호
• /
• pp.68-74
• /
• 2015

Objectives: This study examined the effects of additional acid etching on the dentin bond strength of one-step self-etch adhesives with different compositions and pH. The effect of ethanol wetting on etched dentin bond strength of self-etch adhesives was also evaluated. Materials and Methods: Forty-two human permanent molars were classified into 21 groups according to the adhesive types (Clearfil SE Bond [SE, control]; G-aenial Bond [GB]; Xeno V [XV]; Beauti Bond [BB]; Adper Easy Bond [AE]; Single Bond Universal [SU]; All Bond Universal [AU]), and the dentin conditioning methods. Composite resins were placed on the dentin surfaces, and the teeth were sectioned. The microtensile bond strength was measured, and the failure mode of the fractured specimens was examined. The data were analyzed statistically using two-way ANOVA and Duncan's post hoc test. Results: In GB, XV and SE ($pH{\leq}2$), the bond strength was decreased significantly when the dentin was etched (p < 0.05). In BB, AE and SU (pH 2.4 - 2.7), additional etching did not affect the bond strength (p > 0.05). In AU (pH = 3.2), additional etching increased the bond strength significantly (p < 0.05). When adhesives were applied to the acid etched dentin with ethanol-wet bonding, the bond strength was significantly higher than that of the no ethanol-wet bonding groups, and the incidence of cohesive failure was increased. Conclusions: The effect of additional acid etching on the dentin bond strength was influenced by the pH of one-step self-etch adhesives. Ethanol wetting on etched dentin could create a stronger bonding performance of one-step self-etch adhesives for acid etched dentin.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.97-102
• /
• 2000

We have studied etching characteristic of Ta film using Electron Cyclotron Resonance (ECR) etcher system. Microwave source power. RF bias power. and working pressure were varied to investigate the etch Profile. And we have used two step etching method to acquire the goWe have studied etching characteristic of Ta film using Electron Cyclotron Resonance (ECR) etcher system. Microwave source power. RF bias power. and working pressure were varied to investigate the etch Profile. And we have used two step etching method to acquire the good etch profile preventing the microloading effect.od etch profile preventing the microloading effect.

• Restorative Dentistry and Endodontics
• /
• 제39권1호
• /
• pp.24-31
• /
• 2014

Objectives: The purpose of present study was to evaluate the internal adaptation of composite restorations using different adhesive systems. Materials and Methods: Typical class I cavities were prepared in 32 human third molars. The teeth were divided into the following four groups: 3-step etch-and-rinse, 2-step etch-and-rinse, 2-step self-etch and 1-step self-etch system were used. After the dentin adhesives were applied, composite resins were filled and light-cured in two layers. Then, silver nitrate solution was infiltrated, and all of the samples were scanned by micro-CT before and after thermo-mechanical load cycling. For each image, the length to which silver nitrate infiltrated, as a percentage of the whole pulpal floor length, was calculated (%SP). To evaluate the internal adaptation using conventional method, the samples were cut into 3 pieces by two sectioning at an interval of 1 mm in the middle of the cavity and they were dyed with Rhodamine-B. The cross sections of the specimens were examined by stereomicroscope. The lengths of the parts where actual leakage was shown were measured and calculated as a percentage of real leakage (%RP). The values for %SP and %RP were compared. Results: After thermo-mechanical loading, all specimens showed significantly increased %SP compared to before thermo-mechanical loading and 1-step self-etch system had the highest %SP (p < 0.05). There was a tendency for %SP and %RP to show similar microleakage percentage depending on its sectioning. Conclusions: After thermo-mechanical load cycling, there were differences in internal adaptation among the groups using different adhesive systems.

• The Journal of Advanced Prosthodontics
• /
• 제5권3호
• /
• pp.226-233
• /
• 2013

PURPOSE. This study evaluated the adhesion of 10-MDP containing self-etch and self-adhesive resin cements to dentin with and without the use of etch-and-rinse technique. MATERIALS AND METHODS. Human third molars (N=180) were randomly divided into 6 groups (n=30 per group). Conventional (Panavia F2.0, Kuraray-PAN) and self-adhesive resin cements (Clearfil SA, Kuraray-CSA) were bonded to dentin surfaces either after application of 3-step etch-and-rinse (35% $H_3PO_4$ + ED Primer) or two-step self-etch adhesive resin (Clearfil SE Bond). Specimens were subjected to shear bond strength test using the universal testing machine (0.5 mm/min). The failure types were analyzed using a stereomicroscope and quality of hybrid layer was observed under a scanning electron microscope. The data (MPa) were analyzed using two-way ANOVA and Tukey's tests (${\alpha}$=.05). RESULTS. Overall, PAN adhesive cement showed significantly higher mean bond strength ($12.5{\pm}2.3-14.1{\pm}2.4$ MPa) than CSA cement ($9.3{\pm}1.4-13.9{\pm}1.9$ MPa) (P<.001). Adhesive failures were more frequent in CSA cement groups when used in conjunction with two-step self-adhesive (68%) or no adhesive at all (66%). Hybrid layer quality was inferior in CSA compared to PAN cement in all conditions. CONCLUSION. In clinical situations where bonding to dentin substrate is crucial, both conventional and self-adhesive resin cements based on 10-MDP can benefit from etch-and-rinse technique to achieve better quality of adhesion in the early clinical period.

• 대한전자공학회논문지
• /
• 제24권1호
• /
• pp.91-96
• /
• 1987

Plasma etching can obtain less damaged etch surface than reactive ion etching. This study was performed to get anisotropic etching characteristics of Si using two step etching technique with C2CIF5 and SF6 gas mixture. The results show that the etch rate and aspect ratio of silicon was increased with increment of SF6 contents. The bulging phenomenon on trench side wall in the plasma one-step etching technique was eliminated by the two step etching technique. The anisotropy was decreased from 12(at 120m Torr) to 2.2(at 400m Torr) with increasing the chamber pressure. At the low rf power (350 watts) anisotrpy of silicon was obtained 7 lower than that of high rf power (650 watts. A:~9). In Summary we obtained anisotropic etching profiles of silicon with e 6\ulcornerm depth by using the plasma two-step etching technique.

• The Journal of Advanced Prosthodontics
• /
• 제8권4호
• /
• pp.251-258
• /
• 2016

PURPOSE. This study was undertaken to investigate whether use of an adhesive penetration enhancer, dimethyl sulfoxide (DMSO), improves bond stability of fiber posts to root dentin using two two-step etch-and-rinse resin cements. MATERIALS AND METHODS. Forty human maxillary central incisor roots were randomly divided into 4 groups after endodontic treatment and post space preparation, based on the fiber post/cement used with and without DMSO pretreatment. Acid-etched root dentin was treated with 5% DMSO aqueous solution for 60 seconds or with distilled water (control) prior to the application of Excite DSC/Variolink II or One-Step Plus/Duolink for post cementation. After micro-slicing the bonded root dentin, push-out bond strength (P-OBS) test was performed immediately or after 1-year of water storage in each group. Data were analyzed using three-way ANOVA and Student's t-test (${\alpha}$=.05). RESULTS. A significant effect of time, DMSO treatment, and treatment${\times}$time interaction were observed (P<.001). DMSO did not affect immediate bonding of the two cements. Aging significantly reduced P-OBS in control groups (P<.001), while in DMSO-treated groups, no difference in P-OBS was observed after aging (P>.05). CONCLUSION. DMSO-wet bonding might be a beneficial method in preserving the stability of resin-dentin bond strength over time when fiber post is cemented with the tested etch-and-rinse adhesive cements.