• 한국연소학회:학술대회논문집
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• 한국연소학회 2014년도 제49회 KOSCO SYMPOSIUM 초록집
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• pp.19-20
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• 2014

Boiler design should be desinged to maximize thermal efficiency of the system under imposed load requirement and a boiler should be validated for transient operation. If a proper prediction is possible on the transient behavior and transient characteristics of a boiler, one may asses the performance of boiler component, control logics and operation procedures. In this work, dynamic modeling method of boiler is presented and dynamic simulation of load runback scenario was carried out on suprecritical oil-firing boiler.

• 대한기계학회논문집A
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• 제33권9호
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• pp.949-956
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• 2009

The C(t)-integral describes amplitude of stress and strain rate field near a tip of stationary crack under transient creep condition. Thus the C(t)-integral is a key parameter for the high-temperature crack assessment. Estimation formulae for C(t)-integral of the cracked component operating under mechanical load alone have been provided for decades. However, high temperature structures usually work under combined mechanical and thermal load. And no investigation has provided quantitative estimates for the C(t)-integral under combined mechanical and thermal load. In this study, 3-dimensional finite element analyses were conducted to calculate the C(t)-integral of elastic-creep material under combined mechanical and thermal load. As a result, redistribution time for the crack under combined mechanical and thermal load is re-defined through FE analyses to quantify the C(t)-integral. Estimates of C(t)-integral using this proposed redistribution time agree well with FE analyses results.

• 대한기계학회논문집A
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• 제21권1호
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• pp.133-143
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• 1997

Piezoelastic materials have recently attracted considerable attention because of their potential use in intelligent structural systems. In this paper, we treat a transient piezothermoelastic problem in a hexagonal plate of crystal class 6mm subjected to antisymmetric heating temperature. We analyze this problem by use of the potential function method. Numerical calculations are carried out for a cadmium selenide solid, and the results are presented graphically in comparison with those derived from the similar problem in a cadmium selenide plate subjected to symmetric heating temperature for a symmetry transient problem.

• Steel and Composite Structures
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• 제51권1호
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• pp.1-8
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• 2024

Transient dynamic behavior of a sandwich beam under thermal and impulsive loads has been researched in the context of higher-order beam theory. The impulse load of blast type has been enforced on the top exponent of the sandwich beam while it is in a thermal environment. The core of the sandwich beam is cellular with auxetic rectangular pattern, whereas the layers have been built with the incorporation of graphene oxide powder (GOP) and are micromechanically introduced through Halpin-Tsai formulization. Governing equations for the sandwich beam have been solved through inverse Laplace transform style for obtaining the dynamical deflections. The connection of beam deflections on temperature variability, GOP quantity, pulse load situation and core relative density has been surveyed in detail.

• Computers and Concrete
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• 제2권4호
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• pp.249-266
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• 2005

In the present paper a transient three-dimensional thermo-mechanical model for concrete is presented. For given boundary conditions, temperature distribution is calculated by employing a three-dimensional transient thermal finite element analysis. Thermal properties of concrete are assumed to be constant and independent of the stress-strain distribution. In the thermo-mechanical model for concrete the total strain tensor is decomposed into pure mechanical strain, free thermal strain and load induced thermal strain. The mechanical strain is calculated by using temperature dependent microplane model for concrete (O$\check{z}$bolt, et al. 2001). The dependency of the macroscopic concrete properties (Young's modulus, tensile and compressive strengths and fracture energy) on temperature is based on the available experimental database. The stress independent free thermal strain is calculated according to the proposal of Nielsen, et al. (2001). The load induced thermal strain is obtained by employing the biparabolic model, which was recently proposed by Nielsen, et al. (2004). It is assumed that the total load induced thermal strain is irrecoverable, i.e., creep component is neglected. The model is implemented into a three-dimensional FE code. The performance of headed stud anchors exposed to fire was studied. Three-dimensional transient thermal FE analysis was carried out for three embedment depths and for four thermal loading histories. The results of the analysis show that the resistance of anchors can be significantly reduced if they are exposed to fire. The largest reduction of the load capacity was obtained for anchors with relatively small embedment depths. The numerical results agree well with the available experimental evidence.

• 한국기계가공학회지
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• 제17권4호
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• pp.150-159
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• 2018

The present research deals with a finite element analysis and fatigue evaluation of a steam separator of a high-pressure evaporator for the Heat Recovery Steam Generator (HRSG). The fatigue during the expected life of the HRSG was evaluated according to the ASME Boiler and Pressure Vessel Code Section VIII Division 2 (ASME Code). First, based on the eight transient operating conditions prescribed for the HRSG, temperature distribution of the steam separator was analyzed by a transient thermal analysis. Results of the thermal analysis were used as a thermal load for the structural analysis and used to determine the mean cycle temperature. Next, a structural analysis for the transient conditions was carried out with the thermal load, steam pressure, and nozzle load. The maximum stress location was found to be the riser nozzle bore, and hence fatigue was evaluated at that location, as per ASME Code. As a result, the cumulative usage factor was calculated as 0.00072 (much less than 1). In conclusion, the steam separator was found to be safe from fatigue failure during the expected life.

• 한국초전도ㆍ저온공학회논문지
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• 제4권2호
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• pp.68-72
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• 2002

This work investigates the transient cooling characteristics of an Infrared (IR) detector cryochamber, which has a critical effect on the cooling load. The current thermal modeling considers the conduction heat transfer through a cold well. the gaseous conduction due to outgassing. and the radiation heat transfer. The transient cooling Performance. i.e. the penetration depth and cooling load, is determined using a finite difference method. It is found that the penetration depth increases as the bore conductivity increases. Gaseous conduction and radiation hardly affect the penetration depth. The transient cooling load increases as the bore conductivity increases. The effects of gaseous conduction and radiation on transient heat transfer are weak at initial stages of cooling. However, their effects become significant as the cooling Process Proceeds.

• 대한기계학회논문집A
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• 제30권7호
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• pp.833-840
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• 2006

The paper presents a numerical solution to the problem of a hot rigid indenter sliding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed, regardless of the thermal contact resistance. However the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady state, the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient, the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger numbers of small contact areas are established, unlit eventually the accuracy of the algorithm is limited by the discretization used.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 춘계학술대회논문집
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• pp.330-333
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• 2005

The paper presents a numerical solution to the problem of a hot rigid indenter siding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed regardless of the thermal contact resistance. However, the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady-state the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger number of small contact areas are established, until eventually the accuracy of the algorithm is limited by the discretization used.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.208-212
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• 2003

Silicon transient voltage suppressors (TVSs) are clamping devices that limit voltage spikes by low impedance avalanche breakdown of a rugged silicon PN junction. They are used to protect sensitive components from electrical overstress such as that caused by induces lightning, inductive load switching and electrostatic discharge. In this paper, we present static and dynamic characteristics of TVS diode using thermal analysis simulation software. And also, it is presented that the thermal dissipation characteristics of TVS diode in the transient state.