• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.2
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• pp.55-60
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• 2020

In this paper, we conducted a study on ways to not only check disaster information on smart-phone in the event of a disaster, but also simultaneously check it on wearable devices using short-range wireless communication. Wearable devices commonly used include such devices as wireless earphones, smart bands and smart-watches. Among these devices are smart-watches that allow users to view disaster information in the event of a disaster. However, because current disaster message can only check on smart-phones, research was conducted on how to deliver disaster information received from smart-phones to smart-watches. If studies such as this paper continue, we will be able to recognize disasters more efficiently in the event of a disaster and to carry out preparations for them.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.96-97
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• 2000

Incoherent broadband optical sources have been applied in various areas such as a light source for optical device characterization, fiber-optic gyroscopes$^{(1)}$ , and spectrum sliced light source in wavelength division multiplexing (WDM) system$^{(2)}$ . To utilize the inherent low loss in silica optical fibers, various types of incoherent light sources are being developed. Among the light sources, the amplified spontaneous emission (ASE) from a rare earth doped fiber has benefits in temperature stability, high output power, low polarization dependence over semiconductor diodes$^{(3)}$ . Recently erbium doped fibers (EDF) have been intensively researched for ASE sources as well as optical amplifiers$^{(4)}$ . The spectrum of ASE from an EDF, however, is limited in the 1520~1560 nm range in conventional configurations. In this letter we described a new broadband ASE source which included both the conventional ASE band of Er$^{3+}$ ion, 1520nm~1560nm and ASE band from Tm$^{3+}$ ions that extends the bandwidth further. For the first time, to the best knowledge of authors, a fiber ASE source based on the energy transfer between Er$^{3+}$ and Tm$^{3+}$ ions in the range of 1460~1550 nm, has been demonstrated using a single 980nm pump laser diode. (omitted)omitted)

• Korean Journal of Optics and Photonics
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• v.7 no.1
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• pp.1-8
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• 1996

Charge-coupled device(CCD) array detectors are widely used in real time modulation transfer function(MTF) measurement systems. This paper presents the characteristics of two-dimensional CCDs used in a real time MTF measurement system for copy lenses. The MTF characteristics of a copy lens measured by this equipment show different results according to the direction of shift register, shutter speed and the amplifier gain of CCDs. An object generator is fabricated to reduce the variation of MTF values for the irradiance nonuniformity in on-axis and off-axis image plane and this MTF equipment is calibrated by using a standard lens.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.93-98
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• 2020

We investigated the effect of a post-annealing process using ultraviolet (UV) light on the electrical properties of solution-processed InZnO (IZO) thin-film transistors (TFTs). UV light was irradiated on IZO TFTs for different time periods of 0s, 30s, and 90s. We measured transfer and retention stability curves to evaluate the performance of the fabricated TFTs. In addition, we measured height, amplitude, and phase AFM images to analyze changes in the surface and morphology of the devices. AFM measurements were performed by setting the drive amplitude of the cantilever tip to 47.9 mV in tapping mode, then dividing the device surface into 500 nm × 500 nm. In the case of IZO TFT irradiated with UV for 30s, the electron mobility and I_on/I_off ratio were improved, the threshold voltage was reduced by approximately 2 V, and the subthreshold swing also decreased form 1.34 V/dec to 1.11 V/dec.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.47-48
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• 2015

As the power system develops rapidly into a smarter and more flexible state, so must the communication technologies that support it. Machine to machine (M2M) communication in Smart Grid environment has been discussed in European Telecommunications Standards Institute (ETSI). The power system is not easily replaceable, due to system replacement cost. The M2M gateway is required in other to improve interoperability in M2M environment. The Distributed Network Protocol 3.0 (DNP3.0) is the most important standard in the SCADA systems for the power. It has been used for device data collection/control in Substation Systems, Distribution Automation System. If the DNP3.0 data model is combined with a set of contemporary web protocols, it can result in a major shift. We selected Constrained Application Protocol (CoAP) based on RESTful as M2M protocol. It is a specialized web transfer protocol for use with constrained nodes and constrained networks. We have used the OPNET Modeler 17.1 in order to verity the SOAP versus CoAP. In this paper, we propose the CoAP-based M2M Gateway to Distribution Automation system using DNP3.0 in Smart Grid Environment.

• Journal of the Korea Computer Industry Society
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• v.3 no.8
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• pp.1063-1072
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• 2002

Characteristics of a guitar sound changes according to the internal structure a guitar. The developed system uses a PC to analyze a guitar sound, which will have different characteristics in accordance with the internal structure of the guitar and the material that the guitar made, and make a data base. The developed system consist of three parts; a mechanical body which holds a guitar and the internal structure of the guitar can be changed easily; DSP sound acquisition boards which have multi channel sound input and A/D converting abilities with RS232C data transfer to PC abilities; and software which runs on a PC to analyze the input sound and make a data base.

• Journal of Advanced Navigation Technology
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• v.15 no.4
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• pp.646-654
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• 2011

Recently, the task in which the number of people of the emergency medical technician whom it boards the ambulance is unreasonably insufficient and in which the fire fighter one person gets in the ambulance and which transfers the patient comes into question often. When the emergency patient is generated, it has to transfer to the special hospital in which above anything else, the measure which is quick and exact is needed and where there is the medical device which is suitable for particularly, the patient. This paper implementations the emergency medical system by the smart phone. The implemented system monitors the heart beat of the patient the monitoring among the patient transport with the real-time type. It can grasp the medical history information of the patient, and etc. in the past. And the system provides the emergency hospital which the patient requires and the pre-hospital phase provides the environment in which the disposition which is quick and efficient is possible to the emergency patient.

• Journal of computational fluids engineering
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• v.10 no.2
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• pp.48-53
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• 2005

This work discusses the numerical analysis, the design and experimental test of the SMA actuator along with its capabilities and limitations. Convective heating and cooling using water actuate the SMA(Shape memory alloy) element of the actuator. The fuel such as propane, having a high energy density, is used as the energy source for the SMA actuator in order to increase power and energy density of the system, and thus in order to obviate the need for electrical power supplies such as batteries. The system is composed of a pump, valves, bellows, a heater(burner), control unit and a displacement amplification device. The experimental test of the SMA actuator system results in 150 MPa stress(force : 1560 N) with $3\%$ strain and 0.5 Hz. actuation frequency. The actuation frequency is compared with the prediction obtained from numerical analysis. For the designed SMA actuator system, the results of numerical analysis were utilized in determining design parameters and operating conditions.